DSPIC33CK64MP502T-I/SS - 100MHz 64KB Flash DSC | Microchip
MPN: DSPIC33CK64MP502T-I/SS ✓ نشطDSPIC33CK64MP502T-I/SS نظرة عامة
A digital signal controller combines the computational capability of a DSP with the peripheral set and ease of use of a microcontroller, sitting within the broader hierarchy of embedded processors: DSC -> microcontroller -> embedded MCU/SoC. The dsPIC33CK family executes a single-cycle MAC DSP engine alongside the 16-bit CPU, making it a common choice in the power-management and industrial-control semiconductor space.
Key features include the 100 MHz modified Harvard architecture core with DSP instruction extensions, dual-panel flash enabling live firmware updates, a 3.5 Msps 12-bit ADC pair, CAN-FD for automotive and industrial networks, and integrated op amps that reduce external component count in current-sense loops.
The MP variant adds two on-chip operational amplifiers and high-resolution PWM suitable for closed-loop power conversion. The dual-panel flash architecture allows firmware execution from one panel while erasing/programming the other, a significant advantage for field-updatable digital power products.
Typical applications include switch-mode power supplies, PFC stages, BLDC/PMSM motor drives, solar micro-inverters, and CAN-FD-connected industrial sensing nodes where deterministic interrupt latency and fast ADC sampling are critical.
Design consideration: the device operates from 3.0 V to 3.6 V, so a 3.3 V LDO or buck regulator is required; budget the 8 KB RAM carefully when using complex control loops with float math.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in a single manufacturer datasheet.
بدائل مباشرة لـ DSPIC33CK64MP502T-I/SS — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع DSPIC33CK64MP502T-I/SS (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, PWM, ADC Resolution, Data RAM Size.
DSPIC33CK64MP502-I/SS
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
DSPIC33CK64MP502T-H/SS
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
DSPIC33CK64MC102T-I/SS
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CK64MC102-I/SS
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CK32MP502-I/SS
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CK64MP502T-I/SS الحدود القصوى والخصائص الكهربائية
| Core | dsPIC33CK 16-bit DSC |
| أقصى تردد للساعة | 100 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| Data RAM Size | 8 kB |
| جهد التغذية التشغيلي | 3 V to 3.6 V |
| Number of Cores | 1 Core |
| Peripherals | CAN-FD, OpAmps, 12-bit ADCs, PWM |
| ADC Resolution | 12 bit |
| العلبة | 28-SSOP |
| نمط التركيب | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Product Type | Digital Signal Processors & Controllers - DSP, DSC |
| Family | dsPIC33C |
| Packaging | Tape & Reel (T suffix) |
دليل تكوين أطراف DSPIC33CK64MP502T-I/SS 28-ssop
تكوين الأطراف لـ DSPIC33CK64MP502T-I/SS (حزمة 28-ssop). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ DSPIC33CK64MP502T-I/SS.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
DSPIC33CK64MP502T-I/SS مناسب لـ 6 التطبيقs: Digital Switch-Mode Power Supplies, BLDC / PMSM Motor Control, CAN-FD Industrial Networking Nodes, Solar Micro-Inverters and PFC Stages, Advanced Sensing and Condition Monitoring, Automotive-Adjacent and Harsh Environment Control.
Digital Switch-Mode Power Supplies
The DSPIC33CK64MP502T-I/SS fits switch-mode power supply control because its 100 MHz dsPIC33CK core closes voltage- and current-loop compensators with deterministic latency, while the high-resolution PWM outputs complementary gate signals with sub-nanosecond duty-cycle granularity. The dual 12-bit ADCs sample output voltage and shunt current at up to 3.5 Msps, and the integrated op amps can amplify shunt signals without external amplifiers, reducing BOM count in LLC, buck, and boost stages. Placed as the supervisory controller, it executes the inner current loop every switching cycle and handles CAN-FD or PMBus telemetry on the side. The trade-off versus a pure analog controller is firmware development effort, but dual-panel flash allows field firmware updates without reworking the board.
موصى به
BLDC / PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK64MP502T-I/SS executes field-oriented control at 100 MHz using single-cycle DSP MAC instructions for the Clarke/Park transforms and PI compensators. High-resolution PWM with programmable dead time drives a three-phase inverter, the 12-bit ADCs sample phase currents synchronized to PWM center, and the on-chip op amps amplify low-side shunt currents directly. The 28-SSOP package suits compact drives in fans, pumps, power tools, and HVAC blowers. A quantified benefit is loop-update rates of tens of kHz with interrupt latency low enough for sensorless observers; the main consideration is that 8 KB of RAM must be budgeted across control state, estimator buffers, and communication stacks.
موصى به
CAN-FD Industrial Networking Nodes
The integrated CAN-FD module makes this DSC a strong fit for industrial nodes that both control local hardware and communicate on a modern CAN-FD bus at data rates beyond classical CAN. In a typical node the DSPIC33CK64MP502T-I/SS pairs with an external CAN-FD transceiver, reads sensors through its 12-bit ADCs and op amps, and performs local closed-loop control while streaming diagnostics over the bus. The 64 KB dual-panel flash accommodates a CANopen-style stack plus the application, and field firmware updates can be delivered over CAN. Compared with separate MCU-plus-transceiver-controller architectures, integration reduces component count and BOM cost; the design constraint is keeping message handling within the 8 KB RAM envelope.
موصى به
Solar Micro-Inverters and PFC Stages
Grid-tied micro-inverters and power-factor-correction stages benefit from this DSC's combination of fast analog sampling and high-resolution PWM. The two 12-bit ADCs can simultaneously sample grid voltage and inductor current, enabling predictive (borderline) current-mode control at 100 MHz core speed, while the PWM module generates the phase-shifted or interleaved gate signals PFC topologies require. Integrated op amps condition current-shunt signals on-chip, trimming component count in thermally constrained outdoor enclosures. The 3.0 V to 3.6 V supply and -40 C to +85 C rating suit derated industrial environments. Designers should note that isolation and grid-protection circuitry remain external; the DSC handles control and compliance telemetry, not galvanic isolation.
موصى به
Advanced Sensing and Condition Monitoring
The DSPIC33CK64MP502T-I/SS serves as a smart sensing controller where analog signals must be acquired, filtered, and interpreted locally. Its 12-bit ADCs plus on-chip op amps form a compact acquisition front end, and the DSP engine executes FIR/IIR filtering and FFT-based feature extraction at 100 MHz without host intervention. Processed results travel over CAN-FD, UART, or SPI to plant networks, enabling predictive maintenance of motors and pumps. Dual-panel flash allows logging algorithms to be updated in the field. Compared with a general-purpose MCU plus external ADC, integration shortens the analog signal path and improves noise immunity; the trade-off is a 3.0 V to 3.6 V analog domain that must be kept clean with proper supply filtering.
موصى به
Automotive-Adjacent and Harsh Environment Control
Although the standard -I grade covers -40 C to +85 C, the same die is available as the DSPIC33CK64MP502T-H/SS with extended high-temperature capability, allowing one PCB design to serve harsh industrial and automotive-adjacent environments such as electric powertrain accessories, on-board chargers, and thermal management controllers. The CAN-FD interface is the native network of these systems, the PWM and ADC peripherals drive motor and power stages, and the 28-SSOP footprint keeps controller area small. Using the shared footprint across -I and -H grades lets one PCB layout address multiple temperature tiers. Designers must verify the exact temperature rating in the current Microchip datasheet for their order code before qualification.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ DSPIC33CK64MP502T-I/SS — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | DSPIC33CK64MP502-I/SS | DSPIC33CK64MP502T-H/SS | DSPIC33CK64MC102T-I/SS | DSPIC33CK32MP502-I/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Core / Clock | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz |
| Program Flash | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB |
| Data RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| On-chip Op Amps | Yes (MP variant) | Yes | Yes | No (MC variant) | Yes |
| CAN-FD | Yes | Yes | Yes | Yes | Yes |
| Temperature Grade | -I: -40 C to +85 C | -I: -40 C to +85 C | -H: extended high temperature (up to 150 C per Microchip USA) | -I: -40 C to +85 C | -I: -40 C to +85 C |
| Packaging | Tape & Reel (T) | Tube/Tray | Tape & Reel | Tape & Reel | Tube/Tray |
أبرز الفروقات
- Integrated op amps reduce external analog BOM (مقابلDSPIC33CK64MC102T-I/SS)
- 64 KB dual-panel flash enables field updates (مقابلDSPIC33CK32MP502-I/SS)
- Extended-temperature drop-in available (مقابلDSPIC33CK64MP502T-H/SS)
ملاحظات التصميم
The DSPIC33CK64MP502T-I/SS requires a 3.0 V to 3.6 V supply with adequate decoupling: place a 0.1 uF ceramic capacitor at each VDD pin pair and a 10 uF bulk capacitor near the device. When coexisting with noisy power-conversion circuitry, isolate the controller supply with an LC filter or a small LDO fed from the main rail, because ADC accuracy depends directly on VDD ripple. Estimated: a 100 mVpp supply ripple can degrade 12-bit ADC effective resolution noticeably, so target less than 20 mVpp at the VDD pins.
For the 28-SSOP (0.65 mm pitch), route PWM outputs away from the ADC input traces and analog op-amp pins to minimize coupled switching noise. Use a solid ground plane and connect the shunt/op-amp input network with Kelvin routing directly to the amplifier input pins. Keep the crystal or clock source traces short and guarded by ground. These practices follow Microchip's dsPIC33C family layout guidance in the device datasheet and associated hardware design application notes.
Do not assume pin-equivalence between MP and MC variants at board bring-up without checking the datasheet pin tables - most pins match but multiplexed analog functions differ. Also confirm the exact temperature suffix: the -I grade tops out at +85 C, while only the -H variant supports higher ambient temperatures. Finally, when substituting the DSPIC33CK32MP502 for the 64 KB part, verify that compiled firmware plus bootloader fits in 32 KB before switching MPNs.
معلومات الامتثال
Compliance details were not present in the verified web data. Microchip standard catalog parts are typically RoHS-compliant and lead-free; confirm on the official Microchip product page before procurement.
