EP1C20F400C6AC - Cyclone 20,060 LEs 301 I/O FPGA | Intel
MPN: EP1C20F400C6AC ✗ انتهى عمره الإنتاجيEP1C20F400C6AC نظرة عامة
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and embedded memory, all controlled by a user-defined bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA) within the digital IC category. Unlike fixed-function ASICs, FPGAs allow post-manufacture hardware reconfiguration, making them ideal for prototyping, low-volume production, and designs requiring parallel processing or hardware acceleration.
Key features of the EP1C20F400C6AC include 20,060 logic elements, 294,912 bits of embedded RAM organized into M4K memory blocks, up to 301 user I/O, and on-board LVDS support. The device also integrates phase-locked loops (PLLs) for clock management, supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, PCI), and provides True-LVDS and LVPECL signaling capability. The 400-ball FineLine BGA package enables dense board placement while preserving signal integrity for high-speed interfaces.
The Cyclone architecture employs a 2-D row-and-column interconnect fabric with embedded multiplier blocks optimized for DSP arithmetic. The four input look-up tables (LUTs) drive arithmetic carry chains, supporting efficient implementation of adders, accumulators, and counters. Memory blocks operate in true dual-port, simple dual-port, and single-port modes with optional parity bits and shift-register configurations.
Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, low-cost ASIC prototyping, and embedded control systems. The combination of moderate logic density, generous I/O count, and BGA packaging suits designs that require many board-edge connections, such as baseband processing or peripheral bridging.
When designing with this device, use the Altera Quartus II design suite for synthesis, place-and-route, and bitstream generation. Ensure proper decoupling per Cyclone reference designs and verify signal-integrity at LVDS speeds with the IBIS models published by Intel. The BGA package requires X-ray inspection and reflow profiling compatible with lead-free assembly.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design guidance drawn from the manufacturer datasheet and reference designs - content not available from any single distributor catalog page.
بدائل مباشرة لـ EP1C20F400C6AC — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1C20F400C6AC (نفس عامل الشكل والبصمة) — يختلف في Speed Grade, Package, Operating Temperature, PLLs, Process Technology.
EP1C20F400C6
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C20F400C6AB
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C20F400C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C20F400I7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C20F400
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C20F40017
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C20F400C6AC الحدود القصوى والخصائص الكهربائية
| Family | Cyclone |
| Logic Elements | 20,060 |
| Embedded RAM Bits | 294,912 |
| Number of User I/O | 301 |
| Number of Logic Blocks / Cells | 20060 |
| Total RAM Bits | 294912 |
| Core Voltage | 1.5 V |
| جهد التغذية | 1.5 V |
| العلبة | 400-BGA (FineLine BGA, 1.0 mm pitch, ~2.2 mm height) |
| نوع التركيب | Surface Mount |
| Process Technology | 0.13 µm SRAM |
| Number of PLLs | 2 |
| درجة حرارة التشغيل | 0C to +85C (Commercial grade 'C') |
| Speed Grade | 6 (slowest commercial) |
| Design Tool | Altera Quartus II |
دليل تكوين أطراف EP1C20F400C6AC 400-bga (fineline bga, 1.0 mm pitch, ~2.2 mm height)
تكوين الأطراف لـ EP1C20F400C6AC (حزمة 400-bga (fineline bga, 1.0 mm pitch, ~2.2 mm height)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP1C20F400C6AC.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP1C20F400C6AC مناسب لـ 6 التطبيقs: Industrial Motor Control, Video Processing and Display Pipelines, Telecommunications Line Cards, Low-Cost ASIC Prototyping, Embedded Control Systems, ASIC Replacement and Glue Logic.
Industrial Motor Control
The EP1C20F400C6AC fits industrial motor-control designs where its 20,060 logic elements and 301 user I/O simultaneously drive PWM generation, encoder feedback decoding, and serial communication links. Its on-chip PLLs generate the high-resolution clocks required for field-oriented control loops. With 1.5 V core operation and 3.3 V tolerant I/O banks, the part interfaces directly to industrial 24 V-referenced drivers via optocouplers, simplifying board design and reducing component count.
موصى به
Video Processing and Display Pipelines
The EP1C20F400C6AC suits video-processing pipelines requiring simultaneous parallel pixel operations. With 294,912 bits of embedded RAM and 301 I/O pins, it can buffer full D1 video frames and route RGB/YCbCr data to LCD drivers. The True-LVDS support enables direct connection to LVDS-panel timing controllers without external serializers. Designers typically instantiate color-space converters and scalers in the logic fabric while using M4K blocks as line buffers.
موصى به
Telecommunications Line Cards
The EP1C20F400C6AC's 301 user I/O make it well-suited for telecommunications line cards where TDM buses, control processors, and glue logic must coexist. Its LVDS capability handles high-speed backplane signaling, while the 1.5 V core minimizes per-port power. The BGA package provides the dense I/O required for multi-port T1/E1 aggregation, and embedded M4K RAM blocks store packet buffers without external memory in many configurations.
موصى به
Low-Cost ASIC Prototyping
The EP1C20F400C6AC serves as a low-cost ASIC prototyping vehicle for designs targeting 20K-gate densities. Designers map RTL directly into the 20,060 logic elements, validate functionality at near-ASIC speeds, and then commit to mask production. The Quartus II toolchain supports incremental compilation and pin preservation, allowing iterative refinement without ground-up redesign. The F400 BGA footprint also mirrors common ASIC packages for early board bring-up.
موصى به
Embedded Control Systems
The EP1C20F400C6AC operates as a controller hub in embedded systems, integrating UART, SPI, I2C, GPIO, and PWM peripherals in a single device while leaving headroom for custom logic. The 20,060 LEs handle protocol stacks (Modbus, CAN, EtherCAT) alongside timing-critical tasks, and 294,912 RAM bits provide buffer space for message queues. The 1.5 V core with selectable VCCIO banks enables direct 3.3 V peripheral connection without level shifters.
موصى به
ASIC Replacement and Glue Logic
The EP1C20F400C6AC replaces multiple discrete logic ICs by integrating bus bridges, address decoders, interrupt controllers, and timing generators in a single FPGA. With 301 user I/O and 294,912 RAM bits, it absorbs mid-complexity board functions while reducing BOM cost and assembly time. The Quartus II toolchain ships with reference designs for common glue-logic patterns (PCI, I2C, memory controllers), shortening development cycles.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1C20F400C6AC — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1C20F400C6 | EP1C20F400C6AB | EP1C20F400C6N | EP1C20F400I7N | EP1C20F400 | EP1C20F40017 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 400-BGA (FineLine BGA) | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 |
| Embedded RAM (bits) | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 |
| User I/O | 301 | 301 | 301 | 301 | 301 | 301 | 301 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
أبرز الفروقات
- Full 400-BGA I/O exposure with 301 user I/O pins (مقابلEP1C20F324C6)
- Highest-density Cyclone original family member (مقابلEP1C12F400C6)
- Industrial temperature option available in same package (مقابلEP1C20F400I7N)
ملاحظات التصميم
Estimated: the 400-BGA FineLine package uses 1.0 mm ball pitch. Place at least 4 via-in-pad microvias under the BGA for thermal and signal escape, with a 0.5 mm via diameter and 0.2 mm drill. Use 1-oz copper on outer layers and 0.5-oz on inner layers for controlled-impedance routing of LVDS pairs. Per Altera's Cyclone Device Handbook, dedicate continuous ground and VCCIO planes under the device to minimize power-supply inductance.
Estimated: at typical utilization (60% LEs, 50% RAM, 100 MHz operation), the EP1C20 core draws approximately 300-500 mA from the 1.5 V rail. Use a low-dropout regulator such as the TI TPS7A4533 or Linear LT1963 with at least 20% headroom. Decouple with 10 uF bulk + 0.1 uF + 1 nF ceramic capacitors within 5 mm of each VCC/VCCIO pin pair.
Do not confuse the EP1C20F400C6AC (Cyclone original) with the EP1C20F324C6 (different package - F324 BGA, 249 I/O); they are NOT pin-compatible. Also, the 'AC' suffix indicates a customer-specific variant - verify with your Intel FAE that the AC marking is drop-in compatible with the standard EP1C20F400C6 before committing to PCB layout.
Estimated: in still air at 25 C ambient, the EP1C20F400C6AC in F400 BGA has a typical theta-JA around 15-20 C/W (package-dependent). At 1 W dissipation, junction temperature rises 15-20 C - well within commercial 85 C limit. At 2 W or above, consider thermal vias under the thermal pad (if present) or forced airflow. Industrial-temp grade parts (EP1C20F400I7N) extend the operating range to -40 C to +100 C.
معلومات الامتثال
Cyclone original family predates widespread RoHS categorization; specific EP1C20F400C6AC compliance must be confirmed with Intel/Avnet. Use EP1C20F400C6N variant for confirmed lead-free finish.
