EP1C20F400C6AC - Cyclone 20,060 LEs 301 I/O FPGA | Intel
부품 번호: EP1C20F400C6AC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78 | $780.00 |
| 100 | $68 | $6,800.00 |
| 500 | $59.5 | $29,750.00 |
| 1,000 | $52 | $52,000.00 |
EP1C20F400C6AC 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and embedded memory, all controlled by a user-defined bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA) within the digital IC category. Unlike fixed-function ASICs, FPGAs allow post-manufacture hardware reconfiguration, making them ideal for prototyping, low-volume production, and designs requiring parallel processing or hardware acceleration.
Key features of the EP1C20F400C6AC include 20,060 logic elements, 294,912 bits of embedded RAM organized into M4K memory blocks, up to 301 user I/O, and on-board LVDS support. The device also integrates phase-locked loops (PLLs) for clock management, supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, PCI), and provides True-LVDS and LVPECL signaling capability. The 400-ball FineLine BGA package enables dense board placement while preserving signal integrity for high-speed interfaces.
The Cyclone architecture employs a 2-D row-and-column interconnect fabric with embedded multiplier blocks optimized for DSP arithmetic. The four input look-up tables (LUTs) drive arithmetic carry chains, supporting efficient implementation of adders, accumulators, and counters. Memory blocks operate in true dual-port, simple dual-port, and single-port modes with optional parity bits and shift-register configurations.
Typical applications include industrial motor control, video processing pipelines, telecommunications line cards, low-cost ASIC prototyping, and embedded control systems. The combination of moderate logic density, generous I/O count, and BGA packaging suits designs that require many board-edge connections, such as baseband processing or peripheral bridging.
When designing with this device, use the Altera Quartus II design suite for synthesis, place-and-route, and bitstream generation. Ensure proper decoupling per Cyclone reference designs and verify signal-integrity at LVDS speeds with the IBIS models published by Intel. The BGA package requires X-ray inspection and reflow profiling compatible with lead-free assembly.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design guidance drawn from the manufacturer datasheet and reference designs - content not available from any single distributor catalog page.
드롭인 대체품: EP1C20F400C6AC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1C20F400C6AC (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, PLLs, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C20F400C6
✅ 드롭인✓ 재고 있음
$18.95 / 개
데이터시트 보기 →EP1C20F400C6AB
✅ 드롭인✓ 재고 있음
$65.8 / 개
데이터시트 보기 →EP1C20F400C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$53.1 / 개
데이터시트 보기 →EP1C20F400I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$76.9 / 개
데이터시트 보기 →EP1C20F400
✅ 드롭인✓ 재고 있음
$58.9 / 개
데이터시트 보기 →EP1C20F40017
✅ 드롭인✓ 재고 있음
$24.8 / 개
데이터시트 보기 →EP1C20F400C6AC 최대 정격 & 전기적 특성
| Family | Cyclone |
| Logic Elements | 20,060 |
| Embedded RAM Bits | 294,912 |
| Number of User I/O | 301 |
| Number of Logic Blocks / Cells | 20060 |
| Total RAM Bits | 294912 |
| Core Voltage | 1.5 V |
| 공급 전압 | 1.5 V |
| 패키지 | 400-BGA (FineLine BGA, 1.0 mm pitch, ~2.2 mm height) |
| 실장 유형 | Surface Mount |
| Process Technology | 0.13 µm SRAM |
| Number of PLLs | 2 |
| 동작 온도 | 0C to +85C (Commercial grade 'C') |
| Speed Grade | 6 (slowest commercial) |
| Design Tool | Altera Quartus II |
EP1C20F400C6AC 400-bga (fineline bga, 1.0 mm pitch, ~2.2 mm height) 핀 구성 가이드
EP1C20F400C6AC(400-bga (fineline bga, 1.0 mm pitch, ~2.2 mm height) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1C20F400C6AC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1C20F400C6AC 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing and Display Pipelines, Telecommunications Line Cards, Low-Cost ASIC Prototyping, Embedded Control Systems, ASIC Replacement and Glue Logic.
Industrial Motor Control
The EP1C20F400C6AC fits industrial motor-control designs where its 20,060 logic elements and 301 user I/O simultaneously drive PWM generation, encoder feedback decoding, and serial communication links. Its on-chip PLLs generate the high-resolution clocks required for field-oriented control loops. With 1.5 V core operation and 3.3 V tolerant I/O banks, the part interfaces directly to industrial 24 V-referenced drivers via optocouplers, simplifying board design and reducing component count.
추천
Video Processing and Display Pipelines
The EP1C20F400C6AC suits video-processing pipelines requiring simultaneous parallel pixel operations. With 294,912 bits of embedded RAM and 301 I/O pins, it can buffer full D1 video frames and route RGB/YCbCr data to LCD drivers. The True-LVDS support enables direct connection to LVDS-panel timing controllers without external serializers. Designers typically instantiate color-space converters and scalers in the logic fabric while using M4K blocks as line buffers.
추천
Telecommunications Line Cards
The EP1C20F400C6AC's 301 user I/O make it well-suited for telecommunications line cards where TDM buses, control processors, and glue logic must coexist. Its LVDS capability handles high-speed backplane signaling, while the 1.5 V core minimizes per-port power. The BGA package provides the dense I/O required for multi-port T1/E1 aggregation, and embedded M4K RAM blocks store packet buffers without external memory in many configurations.
추천
Low-Cost ASIC Prototyping
The EP1C20F400C6AC serves as a low-cost ASIC prototyping vehicle for designs targeting 20K-gate densities. Designers map RTL directly into the 20,060 logic elements, validate functionality at near-ASIC speeds, and then commit to mask production. The Quartus II toolchain supports incremental compilation and pin preservation, allowing iterative refinement without ground-up redesign. The F400 BGA footprint also mirrors common ASIC packages for early board bring-up.
추천
Embedded Control Systems
The EP1C20F400C6AC operates as a controller hub in embedded systems, integrating UART, SPI, I2C, GPIO, and PWM peripherals in a single device while leaving headroom for custom logic. The 20,060 LEs handle protocol stacks (Modbus, CAN, EtherCAT) alongside timing-critical tasks, and 294,912 RAM bits provide buffer space for message queues. The 1.5 V core with selectable VCCIO banks enables direct 3.3 V peripheral connection without level shifters.
추천
ASIC Replacement and Glue Logic
The EP1C20F400C6AC replaces multiple discrete logic ICs by integrating bus bridges, address decoders, interrupt controllers, and timing generators in a single FPGA. With 301 user I/O and 294,912 RAM bits, it absorbs mid-complexity board functions while reducing BOM cost and assembly time. The Quartus II toolchain ships with reference designs for common glue-logic patterns (PCI, I2C, memory controllers), shortening development cycles.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1C20F400C6AC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C20F400C6 | EP1C20F400C6AB | EP1C20F400C6N | EP1C20F400I7N | EP1C20F400 | EP1C20F40017 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 400-BGA (FineLine BGA) | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same | 400-BGA (FineLine BGA) - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 |
| Embedded RAM (bits) | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 |
| User I/O | 301 | 301 | 301 | 301 | 301 | 301 | 301 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Full 400-BGA I/O exposure with 301 user I/O pins (vs EP1C20F324C6)
- Highest-density Cyclone original family member (vs EP1C12F400C6)
- Industrial temperature option available in same package (vs EP1C20F400I7N)
설계 노트
Estimated: the 400-BGA FineLine package uses 1.0 mm ball pitch. Place at least 4 via-in-pad microvias under the BGA for thermal and signal escape, with a 0.5 mm via diameter and 0.2 mm drill. Use 1-oz copper on outer layers and 0.5-oz on inner layers for controlled-impedance routing of LVDS pairs. Per Altera's Cyclone Device Handbook, dedicate continuous ground and VCCIO planes under the device to minimize power-supply inductance.
Estimated: at typical utilization (60% LEs, 50% RAM, 100 MHz operation), the EP1C20 core draws approximately 300-500 mA from the 1.5 V rail. Use a low-dropout regulator such as the TI TPS7A4533 or Linear LT1963 with at least 20% headroom. Decouple with 10 uF bulk + 0.1 uF + 1 nF ceramic capacitors within 5 mm of each VCC/VCCIO pin pair.
Do not confuse the EP1C20F400C6AC (Cyclone original) with the EP1C20F324C6 (different package - F324 BGA, 249 I/O); they are NOT pin-compatible. Also, the 'AC' suffix indicates a customer-specific variant - verify with your Intel FAE that the AC marking is drop-in compatible with the standard EP1C20F400C6 before committing to PCB layout.
Estimated: in still air at 25 C ambient, the EP1C20F400C6AC in F400 BGA has a typical theta-JA around 15-20 C/W (package-dependent). At 1 W dissipation, junction temperature rises 15-20 C - well within commercial 85 C limit. At 2 W or above, consider thermal vias under the thermal pad (if present) or forced airflow. Industrial-temp grade parts (EP1C20F400I7N) extend the operating range to -40 C to +100 C.
규정 준수 정보
Cyclone original family predates widespread RoHS categorization; specific EP1C20F400C6AC compliance must be confirmed with Intel/Avnet. Use EP1C20F400C6N variant for confirmed lead-free finish.
