EP20K400EFC672-2X - APEX 20KE FPGA 400K Gates 672-BGA | Intel
MPN: EP20K400EFC672-2X ✗ انتهى عمره الإنتاجيEP20K400EFC672-2X نظرة عامة
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. Architecturally, an FPGA sits within the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SRAM-based FPGAs -> APEX-20KE family. The APEX-20KE architecture combines look-up tables (LUTs) with embedded memory blocks (ESBs) and supports MultiCore integration, which was industry-leading when introduced as one of the first PLDs marketed as a "system-on-a-programmable-chip" (SOPC) building block.
Key features of the EP20K400EFC672-2X include 1,664 logic array blocks (LABs), 488 maximum user I/Os, 212,992 total RAM bits distributed across embedded system blocks, a MultiCore architecture combining LUT-based logic with dual-port RAM, and 4-phase PLL clock management. The "-2X" speed grade designates a faster speed bin than the standard -2 grade; the part operates at junction temperatures between 0 C and 85 C (commercial grade).
Typical applications for the EP20K400EFC672-2X span telecommunications backplanes, industrial automation controllers, high-performance DSP preprocessing, and glue-logic aggregation where high gate count and abundant I/O outweigh the need for the latest process node. Because the APEX-20KE family predates Cyclone and Stratix, designers typically use it only as a long-life mature node or as a second-source drop-in for legacy designs.
When designing with this FPGA, ensure the 1.8 V core and 3.3 V I/O supply rails are properly decoupled near the BGA balls with low-ESR ceramic capacitors. Programming is performed via the Altera ByteBlaster or USB-Blaster download cable through the JTAG or passive serial interface; configuration bitstreams are stored in external PROMs or flash. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the original datasheet.
بدائل مباشرة لـ EP20K400EFC672-2X — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP20K400EFC672-2X (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Operating Temperature, Family, Series.
EP20K400EFC672-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K400EFC672-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K400EFC672-1XN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K400EFC672-1N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K400EFC672-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K300EFC672-2X
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K300EFC672-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K400EFC672-2X الحدود القصوى والخصائص الكهربائية
| Family | APEX-20KE |
| Series | APEX-20KE |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 16,640 |
| Number of LABs/CLBs | 1,664 |
| Total RAM Bits | 212,992 |
| Number of I/O | 488 |
| Number of Gates | 1,052,000 |
| جهد التغذية | 1.71 V to 1.89 V (core); 3.3 V I/O |
| Logic Family | CMOS |
| Process Technology | 0.22 um / 0.18 um CMOS |
| Propagation Delay | 2.5 ns |
| درجة حرارة التشغيل | 0 C to 85 C (TJ) |
| Package Type | 672-BBGA / 672-FBGA |
| نوع التركيب | Surface Mount |
دليل تكوين أطراف EP20K400EFC672-2X 672-bbga / 672-fbga
تكوين الأطراف لـ EP20K400EFC672-2X (حزمة 672-bbga / 672-fbga). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP20K400EFC672-2X.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP20K400EFC672-2X مناسب لـ 6 التطبيقs: Telecommunications Backplane Aggregation, Industrial Automation Controllers, DSP Pre-Processing Front-End, Legacy Test and Measurement Instrumentation, Military / Aerospace Legacy Avionics, High-Density Glue Logic Aggregation.
Telecommunications Backplane Aggregation
The EP20K400EFC672-2X's 488 user I/Os and 400K gates make it well suited for legacy telecom backplane aggregation where parallel bus widths of 32-64 bits must be multiplexed or protocol-converted at line-card interfaces. Placed between a framer ASIC and a network processor, the device's MultiCore architecture lets designers implement STS-1/STM-1 cross-connects with embedded dual-port RAM providing elastic store buffering; the 2.5 ns propagation delay supports 77 MHz system clock rates. Compared to newer Cyclone parts, the -2X speed grade delivers timing margin that legacy backplane designs rely on, although migration to Cyclone IV/V is recommended for new builds.
موصى به
Industrial Automation Controllers
With 488 I/Os and 212 Kbits of embedded RAM, the EP20K400EFC672-2X functions as a high-I/O-count glue-logic aggregator for industrial PLC backplanes and motion-control cards. The commercial 0-85 C junction temperature range suits cabinet-mounted control systems, while the embedded system blocks implement FIFO buffers between encoder counters and DSP processors without external SRAM. The -2X speed grade ensures deterministic timing for real-time deterministic Ethernet or PROFIBUS protocol bridges; design tip: pair with optocouplers on every I/O bank and provide robust 1.8 V / 3.3 V power sequencing.
موصى به
DSP Pre-Processing Front-End
The APEX-20KE MultiCore architecture combines LUT logic with dual-port RAM, which is exploited for FIR filter pre-processing in audio and baseband DSP front-ends. With 16,640 logic elements and 212,992 bits of embedded memory, the EP20K400EFC672-2X supports 64-tap FIR filters with on-chip coefficient storage, eliminating external SRAM. The -2X speed grade enables 100+ MHz sample rates for wideband receivers; trade-off versus dedicated DSP processors is flexibility vs per-MAC energy efficiency, so designers typically use this part for front-end filtering before handing off to a fixed DSP.
موصى به
Legacy Test and Measurement Instrumentation
In long-life test equipment where redesign is not feasible, the EP20K400EFC672-2X delivers 488 I/Os for parallel stimulus/response buses and 400K gates for protocol-format flexibility. The BGA package supports fine-pitch PCB layouts for high-channel-count oscilloscope or logic-analyzer digitizer boards; the 1.71-1.89 V core supply matches the original power tree. Designers maintain production by substituting the -2N or -2 speed grade as the -2X becomes scarce through Intel's NRND channel; identical footprints mean no PCB rework is required when qualifying alternate speed grades.
موصى به
Military / Aerospace Legacy Avionics
Although the EP20K400EFC672-2X is commercial-grade (0-85 C), long-life avionics programs with established configuration baselines continue to qualify it for non-flight-critical subsystems and ground support equipment. Its 488 I/Os aggregate multiple ARINC 429 or MIL-STD-1553 channels into a mission computer, and the 212 Kbits of embedded RAM implement channel buffers. Designers must verify lot traceability and use conformal coating; the -2X speed grade ensures deterministic ARINC 429 bit-timing margins, while lead-free -2N variants support RoHS-compliant production builds.
موصى به
High-Density Glue Logic Aggregation
When system architects need to bridge disparate bus standards (PCI, UART banks, custom parallel buses) on a single board, the EP20K400EFC672-2X serves as a flexible interconnect fabric. The 488 user I/Os handle multiple 32-bit bus segments simultaneously, while the 16,640 logic elements implement protocol translation, parity generation, and address decoding without external CPLDs. The -2X speed grade supports 66 MHz PCI operation; trade-off versus multiple smaller FPGAs is BOM consolidation vs. single-point-of-failure risk - designers should verify in-system programming support before committing to this part in production.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP20K400EFC672-2X — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP20K400EFC672-2N | EP20K400EFC672-2 | EP20K400EFC672-1XN | EP20K300EFC672-2X |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Speed Grade | -2X | -2 | -2 | -1X | -2X |
| System Gates | 400K | 400K | 400K | 400K | 300K |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 11,520 |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Embedded RAM | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits | 147,456 bits |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
أبرز الفروقات
- Highest-density variant in the APEX-20KE 672-BGA footprint (مقابلEP20K300EFC672-2X)
- Faster speed grade for tighter timing margins (مقابلEP20K400EFC672-2)
- Full 488 I/O count preserved across all 672-BGA variants (مقابلEP20K400EBC652-3)
ملاحظات التصميم
The EP20K400EFC672-2X requires two separate supply rails: VCCINT at 1.71-1.89 V for core logic and VCCIO at 3.3 V (or 2.5 V depending on bank) for I/O. Estimated: at full utilization with all 488 I/Os switching and 212 Kbits of RAM active, core current can reach 1.0-1.5 A; designers should provision at least 2 A headroom on the 1.8 V regulator. Place 10 uF bulk + 0.1 uF ceramic decoupling within 5 mm of every VCCINT/VCCIO ball cluster to suppress switching transients.
The 672-BGA Fine-Pitch package has 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad stackup for fan-out. Use 0.5 oz copper inner planes for VCCINT/VCCIO and stitch ground vias around the BGA perimeter to reduce inductance. Estimated: keep all signal traces on outer layers under 0.1 mm width / 0.1 mm spacing to maintain 50 ohm controlled impedance; reflow profile must peak at 245-250 C with 60 sec above 220 C to avoid cold joints on the large thermal mass.
Do not confuse the APEX-20KE family (EP20K...) with the original APEX-20K (EP20K400...) non-E variant; the 'E' suffix indicates enhanced features but different programming files. Configuration bitstreams are NOT interchangeable between EP20K and EP20K[E]. Use Altera Quartus II (version 13.0 or earlier) to compile designs; modern Quartus versions dropped APEX support. For JTAG programming, use the Altera USB-Blaster or ByteBlasterMV download cable; ensure the nCONFIG, nSTATUS, and CONF_DONE pins have proper pull-ups per the APEX-20KE datasheet configuration chapter.
Although the EP20K400EFC672-2X is commercial-grade (0-85 C), high utilization at full clock rates can produce junction temperatures approaching the limit. Estimated: at 100% logic utilization and 100 MHz toggle rate, the BGA package dissipates 2-3 W; designers should attach a small heatsink or provide at least 25 sq cm of unbroken inner copper plane for thermal spreading. Monitor the JTAG Tdi/Tdo temperature-sensing diode if present, or use the on-chip thermal monitoring macro.
معلومات الامتثال
EP20K400EFC672-2X is NRND. The 'N' suffix variants (e.g. EP20K400EFC672-2N) are explicitly lead-free / RoHS-compliant per Altera part-numbering convention; standard -2X and -2 grades predate widespread RoHS adoption. AEC-Q100 not applicable for this commercial-grade FPGA.
