EP20K400EFC672-2X - APEX 20KE FPGA 400K Gates 672-BGA | Intel
Teilenummer: EP20K400EFC672-2X ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1.685,00 |
| 100 | $148.75 | $14.875,00 |
| 500 | $132.2 | $66.100,00 |
| 1.000 | $118.9 | $118.900,00 |
EP20K400EFC672-2X Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. Architecturally, an FPGA sits within the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SRAM-based FPGAs -> APEX-20KE family. The APEX-20KE architecture combines look-up tables (LUTs) with embedded memory blocks (ESBs) and supports MultiCore integration, which was industry-leading when introduced as one of the first PLDs marketed as a "system-on-a-programmable-chip" (SOPC) building block.
Key features of the EP20K400EFC672-2X include 1,664 logic array blocks (LABs), 488 maximum user I/Os, 212,992 total RAM bits distributed across embedded system blocks, a MultiCore architecture combining LUT-based logic with dual-port RAM, and 4-phase PLL clock management. The "-2X" speed grade designates a faster speed bin than the standard -2 grade; the part operates at junction temperatures between 0 C and 85 C (commercial grade).
Typical applications for the EP20K400EFC672-2X span telecommunications backplanes, industrial automation controllers, high-performance DSP preprocessing, and glue-logic aggregation where high gate count and abundant I/O outweigh the need for the latest process node. Because the APEX-20KE family predates Cyclone and Stratix, designers typically use it only as a long-life mature node or as a second-source drop-in for legacy designs.
When designing with this FPGA, ensure the 1.8 V core and 3.3 V I/O supply rails are properly decoupled near the BGA balls with low-ESR ceramic capacitors. Programming is performed via the Altera ByteBlaster or USB-Blaster download cable through the JTAG or passive serial interface; configuration bitstreams are stored in external PROMs or flash. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the original datasheet.
Drop-in-Alternativen für EP20K400EFC672-2X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K400EFC672-2X (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Operating Temperature, Family, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K400EFC672-2N
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP20K400EFC672-2
✅ Drop-In✓ Auf Lager
$92.75 / Stück
Datenblatt ansehen →EP20K400EFC672-1XN
✅ Drop-In✓ Auf Lager
$215 / Stück
Datenblatt ansehen →EP20K400EFC672-1N
✅ Drop-In✓ Auf Lager
$175 / Stück
Datenblatt ansehen →EP20K400EFC672-1
✅ Drop-In✓ Auf Lager
$110 / Stück
Datenblatt ansehen →EP20K300EFC672-2X
✅ Drop-In✓ Auf Lager
$99.5 / Stück
Datenblatt ansehen →EP20K300EFC672-2N
✅ Drop-In✓ Auf Lager
$59.2 / Stück
Datenblatt ansehen →EP20K400EFC672-2X Grenzwerte & elektrische Eigenschaften
| Family | APEX-20KE |
| Series | APEX-20KE |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 16,640 |
| Number of LABs/CLBs | 1,664 |
| Total RAM Bits | 212,992 |
| Number of I/O | 488 |
| Number of Gates | 1,052,000 |
| Versorgungsspannung | 1.71 V to 1.89 V (core); 3.3 V I/O |
| Logic Family | CMOS |
| Process Technology | 0.22 um / 0.18 um CMOS |
| Propagation Delay | 2.5 ns |
| Betriebstemperatur | 0 C to 85 C (TJ) |
| Package Type | 672-BBGA / 672-FBGA |
| Montageart | Surface Mount |
EP20K400EFC672-2X 672-bbga / 672-fbga Pinbelegungsleitfaden
Pinbelegung für EP20K400EFC672-2X (672-bbga / 672-fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP20K400EFC672-2X.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP20K400EFC672-2X ist geeignet für 6 Anwendungs: Telecommunications Backplane Aggregation, Industrial Automation Controllers, DSP Pre-Processing Front-End, Legacy Test and Measurement Instrumentation, Military / Aerospace Legacy Avionics, High-Density Glue Logic Aggregation.
Telecommunications Backplane Aggregation
The EP20K400EFC672-2X's 488 user I/Os and 400K gates make it well suited for legacy telecom backplane aggregation where parallel bus widths of 32-64 bits must be multiplexed or protocol-converted at line-card interfaces. Placed between a framer ASIC and a network processor, the device's MultiCore architecture lets designers implement STS-1/STM-1 cross-connects with embedded dual-port RAM providing elastic store buffering; the 2.5 ns propagation delay supports 77 MHz system clock rates. Compared to newer Cyclone parts, the -2X speed grade delivers timing margin that legacy backplane designs rely on, although migration to Cyclone IV/V is recommended for new builds.
Empfohlen
Industrial Automation Controllers
With 488 I/Os and 212 Kbits of embedded RAM, the EP20K400EFC672-2X functions as a high-I/O-count glue-logic aggregator for industrial PLC backplanes and motion-control cards. The commercial 0-85 C junction temperature range suits cabinet-mounted control systems, while the embedded system blocks implement FIFO buffers between encoder counters and DSP processors without external SRAM. The -2X speed grade ensures deterministic timing for real-time deterministic Ethernet or PROFIBUS protocol bridges; design tip: pair with optocouplers on every I/O bank and provide robust 1.8 V / 3.3 V power sequencing.
Empfohlen
DSP Pre-Processing Front-End
The APEX-20KE MultiCore architecture combines LUT logic with dual-port RAM, which is exploited for FIR filter pre-processing in audio and baseband DSP front-ends. With 16,640 logic elements and 212,992 bits of embedded memory, the EP20K400EFC672-2X supports 64-tap FIR filters with on-chip coefficient storage, eliminating external SRAM. The -2X speed grade enables 100+ MHz sample rates for wideband receivers; trade-off versus dedicated DSP processors is flexibility vs per-MAC energy efficiency, so designers typically use this part for front-end filtering before handing off to a fixed DSP.
Empfohlen
Legacy Test and Measurement Instrumentation
In long-life test equipment where redesign is not feasible, the EP20K400EFC672-2X delivers 488 I/Os for parallel stimulus/response buses and 400K gates for protocol-format flexibility. The BGA package supports fine-pitch PCB layouts for high-channel-count oscilloscope or logic-analyzer digitizer boards; the 1.71-1.89 V core supply matches the original power tree. Designers maintain production by substituting the -2N or -2 speed grade as the -2X becomes scarce through Intel's NRND channel; identical footprints mean no PCB rework is required when qualifying alternate speed grades.
Empfohlen
Military / Aerospace Legacy Avionics
Although the EP20K400EFC672-2X is commercial-grade (0-85 C), long-life avionics programs with established configuration baselines continue to qualify it for non-flight-critical subsystems and ground support equipment. Its 488 I/Os aggregate multiple ARINC 429 or MIL-STD-1553 channels into a mission computer, and the 212 Kbits of embedded RAM implement channel buffers. Designers must verify lot traceability and use conformal coating; the -2X speed grade ensures deterministic ARINC 429 bit-timing margins, while lead-free -2N variants support RoHS-compliant production builds.
Empfohlen
High-Density Glue Logic Aggregation
When system architects need to bridge disparate bus standards (PCI, UART banks, custom parallel buses) on a single board, the EP20K400EFC672-2X serves as a flexible interconnect fabric. The 488 user I/Os handle multiple 32-bit bus segments simultaneously, while the 16,640 logic elements implement protocol translation, parity generation, and address decoding without external CPLDs. The -2X speed grade supports 66 MHz PCI operation; trade-off versus multiple smaller FPGAs is BOM consolidation vs. single-point-of-failure risk - designers should verify in-system programming support before committing to this part in production.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K400EFC672-2X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K400EFC672-2N | EP20K400EFC672-2 | EP20K400EFC672-1XN | EP20K300EFC672-2X |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Speed Grade | -2X | -2 | -2 | -1X | -2X |
| System Gates | 400K | 400K | 400K | 400K | 300K |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 11,520 |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Embedded RAM | 212,992 bits | 212,992 bits | 212,992 bits | 212,992 bits | 147,456 bits |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
Wichtigste Unterscheidungsmerkmale
- Highest-density variant in the APEX-20KE 672-BGA footprint (vs. EP20K300EFC672-2X)
- Faster speed grade for tighter timing margins (vs. EP20K400EFC672-2)
- Full 488 I/O count preserved across all 672-BGA variants (vs. EP20K400EBC652-3)
Designhinweise
The EP20K400EFC672-2X requires two separate supply rails: VCCINT at 1.71-1.89 V for core logic and VCCIO at 3.3 V (or 2.5 V depending on bank) for I/O. Estimated: at full utilization with all 488 I/Os switching and 212 Kbits of RAM active, core current can reach 1.0-1.5 A; designers should provision at least 2 A headroom on the 1.8 V regulator. Place 10 uF bulk + 0.1 uF ceramic decoupling within 5 mm of every VCCINT/VCCIO ball cluster to suppress switching transients.
The 672-BGA Fine-Pitch package has 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad stackup for fan-out. Use 0.5 oz copper inner planes for VCCINT/VCCIO and stitch ground vias around the BGA perimeter to reduce inductance. Estimated: keep all signal traces on outer layers under 0.1 mm width / 0.1 mm spacing to maintain 50 ohm controlled impedance; reflow profile must peak at 245-250 C with 60 sec above 220 C to avoid cold joints on the large thermal mass.
Do not confuse the APEX-20KE family (EP20K...) with the original APEX-20K (EP20K400...) non-E variant; the 'E' suffix indicates enhanced features but different programming files. Configuration bitstreams are NOT interchangeable between EP20K and EP20K[E]. Use Altera Quartus II (version 13.0 or earlier) to compile designs; modern Quartus versions dropped APEX support. For JTAG programming, use the Altera USB-Blaster or ByteBlasterMV download cable; ensure the nCONFIG, nSTATUS, and CONF_DONE pins have proper pull-ups per the APEX-20KE datasheet configuration chapter.
Although the EP20K400EFC672-2X is commercial-grade (0-85 C), high utilization at full clock rates can produce junction temperatures approaching the limit. Estimated: at 100% logic utilization and 100 MHz toggle rate, the BGA package dissipates 2-3 W; designers should attach a small heatsink or provide at least 25 sq cm of unbroken inner copper plane for thermal spreading. Monitor the JTAG Tdi/Tdo temperature-sensing diode if present, or use the on-chip thermal monitoring macro.
Compliance-Informationen
EP20K400EFC672-2X is NRND. The 'N' suffix variants (e.g. EP20K400EFC672-2N) are explicitly lead-free / RoHS-compliant per Altera part-numbering convention; standard -2X and -2 grades predate widespread RoHS adoption. AEC-Q100 not applicable for this commercial-grade FPGA.
