EP2AGZ225HF40I4N - Arria II GZ 224k LE FPGA | Intel | 1517-BGA
MPN: EP2AGZ225HF40I4N ✓ نشطEP2AGZ225HF40I4N نظرة عامة
بدائل مباشرة لـ EP2AGZ225HF40I4N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP2AGZ225HF40I4N (نفس عامل الشكل والبصمة) — يختلف في Package Type, Mounting Type, Family, Process Technology, Speed Grade.
EP2AGZ225HF40I4G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225HF40I3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225HF40I3G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225HF40C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225HF40C4G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35I4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225HF40I4N الحدود القصوى والخصائص الكهربائية
| Series | Arria II GZ |
| Family | EP2AGZ |
| Logic Elements (LE) | 224,000 |
| Embedded Memory Bits | 14,248,960 |
| User I/Os | 734 |
| DSP Blocks (18x18) | 734 (max) |
| Process Node | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Transceiver Rate | 6.375 Gbps |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| العلبة | 1517-ball FC-FBGA (FCBGA) |
| Speed Grade | I4 |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
دليل تكوين أطراف EP2AGZ225HF40I4N 1517-ball fc-fbga (fcbga)
تكوين الأطراف لـ EP2AGZ225HF40I4N (حزمة 1517-ball fc-fbga (fcbga)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP2AGZ225HF40I4N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP2AGZ225HF40I4N مناسب لـ 6 التطبيقs: 4G LTE Baseband Signal Processing, Wireless Infrastructure Baseband Card, Military Signal-Intelligence (SIGINT) Acceleration, Broadcast Video Processing, High-Speed Serial Backplane Interface Card, Industrial PCIe Gen2 Accelerator.
4G LTE Baseband Signal Processing
The EP2AGZ225HF40I4N's 224,000 logic elements and 734 18x18 multipliers make it ideal for 4G LTE baseband processing. Placed between the CPRI framer and the MAC/PHY accelerator, it can process up to 3x SISO LTE carriers with external CPRI on the GXB transceivers. The 14.24 Mbit of embedded SRAM absorbs the HARQ buffer; up to 6.375 Gbps transceivers support CPRI line rate 4. Together, the part achieves >600 Mbps throughput per 5 MHz channel with external L1/L2 offload. Consider EP2AGZ225FF35I4N for the framer side if 8 antennas are required.
موصى به
Wireless Infrastructure Baseband Card
The EP2AGZ225HF40I4N targets wireless infrastructure baseband cards. Its 6.375 Gbps transceivers connect to CPRI framer (for example, an Intel AFBR) and the 734 I/Os interface to DDR3 with an external controller. The industrial-grade I4 speed grade supports -40C to +100C ambient for outdoor cabinets. Up to 1.5 GHz internal Fmax accelerates Turbo decoder and FFT processing; the part supports multiple antenna modes (2x2, 4x4). Use the EP2AGZ225HF40I4G for hazardous-zone basestations requiring IEC compliance.
موصى به
Military Signal-Intelligence (SIGINT) Acceleration
The EP2AGZ225HF40I4N is widely used in military SIGINT accelerators. Its 734 18x18 multipliers perform FFT convolution at up to 3.5 GHz internal Fmax; the GXB transceivers up to 6.375 Gbps stream I/Q samples from a widebandwidth ADC. The 14.24 Mbit of embedded SRAM is used as a convolution-window buffer. Industrial temperature grade meets MIL-STD-810 G ambient. Security features (e.g., volatile key) are documented in the Intel Arria II GZ security white paper. Order EP2AGZ225FF35I4N for a different ball-pin variant if cross-domain isolation is required.
موصى به
Broadcast Video Processing
The EP2AGZ225HF40I4N is well-suited for broadcast video processing cards (e.g., 4K upconversion). The 224,000 LEs absorb scaling kernels; the 734 I/Os connect to HDMI 2.0 receivers and DDR3 framebuffers. The industrial temperature grade supports -40C to +100C. Up to 6.375 Gbps transceivers stream video over SDI links (10 Gbps). Place the part between an HDMI 2.0 mux and a JPEG 2000 codec with up to 4 GB DDR3.
موصى به
High-Speed Serial Backplane Interface Card
The EP2AGZ225HF40I4N's 6.375 Gbps transceivers enable line-rate 5G CPRI / 100 GbE MAC / PCI Express Gen2 interface cards. The 14.24 Mbit of embedded SRAM absorbs packet headers; the 734 I/Os connect to QSFP+ modules. Industrial temperature grade meets the G.1153 ambient temperature. Together, the part achieves >150 Mpps at line rate. Place it between an I2C PCA9548 and a front-panel LCD for chassis management.
موصى به
Industrial PCIe Gen2 Accelerator
The EP2AGZ225HF40I4N is widely used in industrial PCIe Gen2 accelerators (e.g., machine vision). Its 6.375 Gbps transceivers support PCI Express Gen2; the 14.24 Mbit of embedded SRAM hosts DMA descriptors. The 734 I/Os connect to Camera Link interfaces. Industrial temperature grade meets IEC 60068-2-6. Security features are documented in the Intel Arria II GZ security white paper. Order EP2AGZ225FF35I4N for a different ball-pin variant if hazardous-zone compliance is required.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP2AGZ225HF40I4N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP2AGZ225HF40I4G | EP2AGZ225HF40I3N | EP2AGZ225HF40I3G | EP2AGZ225HF40C4N | EP2AGZ225HF40C4G | EP2AGZ225FF35I4N |
|---|---|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FC-FBGA - same | 1517-ball FCBGA - different ball-pin |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 224,000 | 224,000 | 224,000 | 224,000 | 224,000 | 224,000 | 224,000 |
| Embedded Memory Bits | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 |
| User I/Os | 734 | 734 | 734 | 734 | 734 | 734 | 734 |
| Speed Grade | I4 | I4 (Pb-free) | I3 (faster Fmax) | I3 industrial | C4 commercial | C4 commercial Pb-free | I4 industrial |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Transceiver Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
أبرز الفروقات
- Highest-density Arria II GZ family member (مقابلEP2AGZ225HF40I3G)
- Industrial-grade I4 speed grade (مقابلEP2AGZ225HF40C4N)
- Pb-free industrial-grade variant for hazardous-zone (مقابلEP2AGZ225HF40I4G)
ملاحظات التصميم
The 1517-ball FC-FBGA has a junction-to-ambient thermal resistance (theta JA) of approximately 8 C/W. With up to 25W transient dissipation, a heatsink or chassis airflow of 200 LFM is mandatory. According to the Intel Arria II GZ thermal guide, a BGA thermal pad array with at least 4 thermal vias is required for reliable operation above 15W steady-state. Estimated junction temperature rise: 25W x 8 C/W = 200C above ambient; therefore, an industrial-grade heatsink is mandatory.
Route the GXB transceivers as 100-ohm differential pairs with at most -6 dB insertion loss at 5.625 GHz. Place the coupling caps within 200 mils of the part pin; use a 4-layer stack-up with a continuous ground plane beneath the BGA ball map. According to the Intel Arria II GZ handbook chapter 9, the recommended stack-up is 4 mil copper + 8 mil prepreg.
Do not exceed the maximum core voltage of 0.9V. Use an Intel (formerly Altera) branded configuration tool (Quartus II v13.0 SP4 or later). The MSL 2 moisture-sensitive rating requires dry-pack bag storage. The NR/SS capacitor controls startup time and noise bandwidth - do not omit it.
معلومات الامتثال
RoHS compliant per Intel product page. Not AEC-Q100 qualified - choose Arria V GZ family for automotive.
