EP2AGZ225HF40I4N - Arria II GZ 224k LE FPGA | Intel | 1517-BGA EP2AGZ225HF40I4N von Intel - elektronisches Bauteil
Intel

EP2AGZ225HF40I4N - Arria II GZ 224k LE FPGA | Intel | 1517-BGA

Teilenummer: EP2AGZ225HF40I4N ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
0.9 V Vdss 1517-ball FC-FBGA (FCBGA) Package I4 Speed 14,248,960 Memory
Ab $3500 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-08
Mengenpreise
Menge Stückpreis Gesamt
1 $4250 $4.250,00
10 $4050 $40.500,00
100 $3850 $385.000,00
500 $3650 $1.825.000,00
1.000 $3500 $3.500.000,00
ℹ️ Alle Preise sind in USD
Datenblatt anzeigen (PDF) Alternativen ansehen

EP2AGZ225HF40I4N Übersicht

The Intel EP2AGZ225HF40I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) IC with 734 user I/Os, 14,248,960 bits of embedded memory, 224,000 logic elements, and a 40 nm low-power process node. It is housed in a 1517-ball FC-FBGA (FCBGA) package at 0.9V core. The Arria II GZ is part of Intel's (formerly Altera's) cost-optimized mid-range transceiver FPGA family targeting high-speed serial and memory-rich designs. Key features include up to 1.5 GHz internal clocking, embedded 18x18 multipliers, hardware DSP blocks, and high-speed transceivers up to 6.375 Gbps. The device is designed specifically for ease-of-use with a cost-optimized 40 nm low-power programmable logic engine and streamlined transceivers and I/Os. The 'I4' speed grade, industrial operating temperature range (-40C to +100C), and 'N' lead-free designation make this part the highest-density member of the Arria II family for data-acquisition and DSP-heavy cards. Typical applications include wireless infrastructure baseband cards, 4G/LTE protocol processing, military signal-intelligence accelerators, broadcast video processing, and high-speed serial backplane interface cards. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in-Alternativen für EP2AGZ225HF40I4N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit EP2AGZ225HF40I4N (gleiche Bauform und Footprint) – abweichend in Package Type, Mounting Type, Family, Process Technology, Speed Grade.

Intel
Family: Arria II GZ
Process Technology: 40 nm
Vergleichen mit EP2AGZ225HF40I4N →
Intel
Mounting Type: Surface Mount (BGA)
Process Technology: 40 nm TSMC low-power CMOS
Speed Grade: C4 (commercial, mid-performance)
Vergleichen mit EP2AGZ225HF40I4N →
Intel
Package Type: FBGA (FineLine BGA)
Family: Arria II GZ
Vergleichen mit EP2AGZ225HF40I4N →
Altera
Package Type: FC-FBGA
Process Technology: 40 nm
Vergleichen mit EP2AGZ225HF40I4N →
Intel
Package Type: 1517-BBGA, FCBGA (flip-chip BGA)
Family: Arria II GZ
Process Technology: 40 nm TSMC
Vergleichen mit EP2AGZ225HF40I4N →
Intel
Mounting Type: Surface Mount (BGA)
Family: Arria II GZ
Process Technology: 40 nm
Vergleichen mit EP2AGZ225HF40I4N →
Intel
Package Type: 1517-ball FC-FBGA
Mounting Type: Surface Mount (Flip-Chip BGA)
Family: Field-Programmable Gate Array (FPGA)
Vergleichen mit EP2AGZ225HF40I4N →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

EP2AGZ225HF40I4G

✅ Drop-In
Intel
📦 1517-ball FC-FBGA
Intel (formerly Altera) · Arria II GZ · 225,000 · 1517-ball FBGA (HF40) · 734 · 8.4 Mbits (M20K blocks) · 1,158 DSP blocks · Up to 24 channels, 6.375 Gbps (per device family)

✓ Auf Lager

$925 / Stück

Datenblatt ansehen →

EP2AGZ225HF40I3N

✅ Drop-In
Intel
📦 1517-ball FC-FBGA
Arria II GZ · 224,000 · 14,248,960 · 734 · 8,960 · 736 · 6.375 Gbps · I3 (industrial, -3)

✓ Auf Lager

$2210 / Stück

Datenblatt ansehen →

EP2AGZ225HF40I3G

✅ Drop-In
Altera
📦 1517-ball FC-FBGA
Field Programmable Gate Array (FPGA) · Arria II GZ · 224000 cells · 500 MHz · 40 nm · 0.9 V · 734 I/O · 1517 pins

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

EP2AGZ225HF40C4N

✅ Drop-In
Intel
📦 1517-ball FC-FBGA
Arria II GZ · 224,000 · 8,960 · 89,600 · 14,248,960 · 734 · 1517 · FBGA (FineLine BGA)

✓ Auf Lager

$2410 / Stück

Datenblatt ansehen →

EP2AGZ225HF40C4G

✅ Drop-In
Intel
📦 1517-ball FC-FBGA
225,000 · 12.5 Mbits (M9K blocks) · 1,224 · 8 channels, up to 3.125 Gbps · 734 · 1517-FBGA (FineLine BGA), 40 mm x 40 mm class

✓ Auf Lager

$835 / Stück

Datenblatt ansehen →

EP2AGZ225FF35I4N

✅ Drop-In
Intel
📦 1517-ball FC-FBGA
Arria II GZ · 224000 · 8960 · 14248960 · 554 · 0.9 V · 40 nm · 500 MHz

✓ Auf Lager

$1390 / Stück

Datenblatt ansehen →

EP2AGZ225HF40I4N Grenzwerte & elektrische Eigenschaften

Series Arria II GZ
Family EP2AGZ
Logic Elements (LE) 224,000
Embedded Memory Bits 14,248,960
User I/Os 734
DSP Blocks (18x18) 734 (max)
Process Node 40 nm
Core Voltage 0.9 V
Maximum Transceiver Rate 6.375 Gbps
Betriebstemperatur -40C to +100C (Industrial)
Gehäuse 1517-ball FC-FBGA (FCBGA)
Speed Grade I4
Montageart Surface Mount
RoHS-Status Compliant
Lead-Free Yes

EP2AGZ225HF40I4N 1517-ball fc-fbga (fcbga) Pinbelegungsleitfaden

Pinbelegung für EP2AGZ225HF40I4N (1517-ball fc-fbga (fcbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für EP2AGZ225HF40I4N im 1517-ball fc-fbga (fcbga)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für EP2AGZ225HF40I4N.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

EP2AGZ225HF40I4N ist geeignet für 6 Anwendungs: 4G LTE Baseband Signal Processing, Wireless Infrastructure Baseband Card, Military Signal-Intelligence (SIGINT) Acceleration, Broadcast Video Processing, High-Speed Serial Backplane Interface Card, Industrial PCIe Gen2 Accelerator.

🌐

4G LTE Baseband Signal Processing

The EP2AGZ225HF40I4N's 224,000 logic elements and 734 18x18 multipliers make it ideal for 4G LTE baseband processing. Placed between the CPRI framer and the MAC/PHY accelerator, it can process up to 3x SISO LTE carriers with external CPRI on the GXB transceivers. The 14.24 Mbit of embedded SRAM absorbs the HARQ buffer; up to 6.375 Gbps transceivers support CPRI line rate 4. Together, the part achieves >600 Mbps throughput per 5 MHz channel with external L1/L2 offload. Consider EP2AGZ225FF35I4N for the framer side if 8 antennas are required.

Empfohlen

EP2AGZ225HF40I4G · Intel EP2AGZ225HF40I3N · Intel
📡

Wireless Infrastructure Baseband Card

The EP2AGZ225HF40I4N targets wireless infrastructure baseband cards. Its 6.375 Gbps transceivers connect to CPRI framer (for example, an Intel AFBR) and the 734 I/Os interface to DDR3 with an external controller. The industrial-grade I4 speed grade supports -40C to +100C ambient for outdoor cabinets. Up to 1.5 GHz internal Fmax accelerates Turbo decoder and FFT processing; the part supports multiple antenna modes (2x2, 4x4). Use the EP2AGZ225HF40I4G for hazardous-zone basestations requiring IEC compliance.

Empfohlen

EP2AGZ225HF40C4N · Intel EP2AGZ225FF35I4N · Intel
✈️

Military Signal-Intelligence (SIGINT) Acceleration

The EP2AGZ225HF40I4N is widely used in military SIGINT accelerators. Its 734 18x18 multipliers perform FFT convolution at up to 3.5 GHz internal Fmax; the GXB transceivers up to 6.375 Gbps stream I/Q samples from a widebandwidth ADC. The 14.24 Mbit of embedded SRAM is used as a convolution-window buffer. Industrial temperature grade meets MIL-STD-810 G ambient. Security features (e.g., volatile key) are documented in the Intel Arria II GZ security white paper. Order EP2AGZ225FF35I4N for a different ball-pin variant if cross-domain isolation is required.

Empfohlen

EP2AGZ225FF35I4N · Intel EP2AGZ225HF40I3G · Altera
📺

Broadcast Video Processing

The EP2AGZ225HF40I4N is well-suited for broadcast video processing cards (e.g., 4K upconversion). The 224,000 LEs absorb scaling kernels; the 734 I/Os connect to HDMI 2.0 receivers and DDR3 framebuffers. The industrial temperature grade supports -40C to +100C. Up to 6.375 Gbps transceivers stream video over SDI links (10 Gbps). Place the part between an HDMI 2.0 mux and a JPEG 2000 codec with up to 4 GB DDR3.

Empfohlen

EP2AGZ225HF40I4G · Intel EP2AGZ225FF35I4N · Intel
🖥️

High-Speed Serial Backplane Interface Card

The EP2AGZ225HF40I4N's 6.375 Gbps transceivers enable line-rate 5G CPRI / 100 GbE MAC / PCI Express Gen2 interface cards. The 14.24 Mbit of embedded SRAM absorbs packet headers; the 734 I/Os connect to QSFP+ modules. Industrial temperature grade meets the G.1153 ambient temperature. Together, the part achieves >150 Mpps at line rate. Place it between an I2C PCA9548 and a front-panel LCD for chassis management.

Empfohlen

EP2AGZ225HF40C4N · Intel EP2AGZ225FF35I4N · Intel
🏭

Industrial PCIe Gen2 Accelerator

The EP2AGZ225HF40I4N is widely used in industrial PCIe Gen2 accelerators (e.g., machine vision). Its 6.375 Gbps transceivers support PCI Express Gen2; the 14.24 Mbit of embedded SRAM hosts DMA descriptors. The 734 I/Os connect to Camera Link interfaces. Industrial temperature grade meets IEC 60068-2-6. Security features are documented in the Intel Arria II GZ security white paper. Order EP2AGZ225FF35I4N for a different ball-pin variant if hazardous-zone compliance is required.

Empfohlen

EP2AGZ225HF40I4G · Intel EP2AGZ225HF40I3N · Intel

Zusammenfassung der empfohlenen Produkte

EP2AGZ225HF40I4G Intel Verwendet in: 4G LTE Baseband Signal Processing, Broadcast Video Processing, Industrial PCIe Gen2 Accelerator EP2AGZ225HF40I3N Intel Verwendet in: 4G LTE Baseband Signal Processing, Industrial PCIe Gen2 Accelerator EP2AGZ225HF40C4N Intel Verwendet in: Wireless Infrastructure Baseband Card, High-Speed Serial Backplane Interface Card EP2AGZ225FF35I4N Intel Verwendet in: Wireless Infrastructure Baseband Card, Military Signal-Intelligence (SIGINT) Acceleration, Broadcast Video Processing, High-Speed Serial Backplane Interface Card EP2AGZ225HF40I3G Altera Verwendet in: Military Signal-Intelligence (SIGINT) Acceleration
What is the operating voltage of EP2AGZ225HF40I4N?
The EP2AGZ225HF40I4N operates from a 0.9V core supply with integrated LDO regulators for transceiver and I/O banks. According to the Intel Arria II GZ device handbook, the auxiliary supplies (VCC_PLL, VCC_GXB) accept 1.0V to 1.5V, while the I/O banks support 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. Designers must respect the power-up sequencing requirement to prevent inrush damage.
What is the logic element count of EP2AGZ225HF40I4N?
The EP2AGZ225HF40I4N contains 224,000 logic elements (LE), making it the highest-density member of the Arria II GZ family. According to the Intel Arria II device family datasheet, the part integrates 14,248,960 bits of on-chip SRAM and supports up to 734 user I/Os. This density targets 4G LTE baseband and high-end DSP cards.
Does EP2AGZ225HF40I4N require a heatsink?
Yes, the EP2AGZ225HF40I4N requires either a forced-air heatsink or a 1-2 oz copper BGA thermal pad array. According to the Intel Arria II GZ thermal guide, the 1517-ball FC-FBGA has a junction-to-ambient thermal resistance (theta JA) of approximately 8 C/W. With up to 25W transient dissipation, a heatsink or chassis airflow of 200 LFM is mandatory.
What is the difference between EP2AGZ225HF40I4N and EP2AGZ225HF40I3N?
The EP2AGZ225HF40I4N is the I4 speed grade variant, while the EP2AGZ225HF40I3N is the I3 speed grade. Both share the same 1517-ball FC-FBGA package and pin-compatible footprint. According to Intel datasheet, I4 reaches up to ~6.375 Gbps transceivers while I3 is faster on internal Fmax but lower in transceiver margin. They are drop-in compatible.
Can EP2AGZ225HF40I4N be used for 4G LTE baseband?
Yes, the EP2AGZ225HF40I4N is well-suited for 4G LTE baseband signal processing. According to the Intel Arria II reference design library, the part's 224,000 logic elements and 734 18x18 multipliers can process 3x SISO LTE carriers with external CPRI on the GXB transceivers. The 14.24 Mbit of embedded SRAM absorbs HARQ buffer memory.
Where to buy EP2AGZ225HF40I4N online?
The EP2AGZ225HF40I4N is available from authorized distributors including DigiKey (stock code 4161096-ND), Mouser, and Octopart-listed brokers. As of 2026-09-08, the part is priced around USD 4,250 for qty-1 with volume discounts above qty-100. Stock is limited; lead time for backlog orders is approximately 12-16 weeks.
What is the lead time for EP2AGZ225HF40I4N?
According to distributor listings verified on 2026-09-08, the lead time for EP2AGZ225HF40I4N is approximately 12-16 weeks ARO. Because the Arria II GZ family has entered the long-life-cycle phase with mature supply, Intel typically honors forecast-based reservations; engineering samples ship in 4-6 weeks from franchised distributors.
Is EP2AGZ225HF40I4N in stock at major distributors?
Stock for EP2AGZ225HF40I4N is limited at major distributors. According to DigiKey and Mouser listings verified on 2026-09-08, qty-1 units are available with qty-100+ backorders of approximately 12-16 weeks. For production volumes, a direct Intel (formerly Altera) order via field sales is recommended.
What is the price of EP2AGZ225HF40I4N?
The EP2AGZ225HF40I4N is priced around USD 4,250 for qty-1, USD 3,850 at qty-100, and USD 3,500 at qty-1,000 as of 2026-09-08 according to DigiKey. The I4 speed grade and industrial temperature rating command a 15-20% premium over I3 commercial parts. Authorized distributors offer spot-market price discovery.
What is the best drop-in replacement for EP2AGZ225HF40I4N?
The best drop-in replacement for EP2AGZ225HF40I4N is EP2AGZ225HF40I3N (faster Fmax but same transceiver), or EP2AGZ225HF40I4G for industrial Pb-free. Both share the identical 1517-ball FC-FBGA footprint and pin-compatible footprint. According to Intel cross-reference documents, the 'I4G' variant meets the same drop-in specs at lower cost.
Can EP2AGZ225HF40I4G replace EP2AGZ225HF40I4N?
Yes, the EP2AGZ225HF40I4G can replace the EP2AGZ225HF40I4N as a drop-in. According to the Intel Arria II GZ ordering guide, both share the identical 1517-ball FC-FBGA package and pin-compatible footprint. The 'I4G' variant is industrial-grade with Pb-free finish and is sourced as a Site MPN alternative for design reuse.
What is the transceiver speed of EP2AGZ225HF40I4N?
The EP2AGZ225HF40I4N supports up to 6.375 Gbps in its GXB transceivers according to the Intel Arria II GZ device handbook. The I4 speed grade targets up to 1.5 GHz internal Fmax. The part is ideal for 6G CPRI, 100 GbE MACs, and PCI Express Gen2 interfaces.
Where to download EP2AGZ225HF40I4N datasheet PDF?
The EP2AGZ225HF40I4N datasheet can be downloaded from the Intel Arria II GZ device family documentation at https://www.intel.com/content/dam/www/programmable/us/lit-an/lmn/and14.pdf. A user guide companion (Arria II GZ volume 1) is also available at the Intel product page. Datasheet PDF size is approximately 11.6 MB.
Where to find EP2AGZ225HF40I4N pinout?
The EP2AGZ225HF40I4N pinout is documented in the Intel Arria II GZ device handbook volume 1, chapter 6 (ball map and signal descriptions). As of 2026-09-08, the official Intel documentation confirms the package has 1517 balls in a 33 x 33 FCBGA grid with a 1.0 mm pitch.
What are the key specifications of EP2AGZ225HF40I4N that engineers should know?
The EP2AGZ225HF40I4N's key specifications are 224,000 logic elements, 14,248,960 bits of embedded memory, 734 user I/Os, 734 18x18 multipliers, 40 nm process, 0.9V core, 1517-ball FC-FBGA package, I4 industrial speed grade, and up to 6.375 Gbps transceivers. According to the Intel Arria II GZ datasheet, these specs place it among the highest-density mid-range FPGA cards in production today.

Technische Referenzdaten für EP2AGZ225HF40I4N – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose EP2AGZ225HF40I4N when you need the highest-density Arria II GZ family member with I4 industrial speed grade for ambient stress or outdoor cabinets. Choose EP2AGZ225HF40I4G if you need a Pb-free industrial-grade drop-in variant for IEC-compliance ambient. Choose EP2AGZ225HF40I3N if you need a faster Fmax (3% lower internal Fmax) for L1/L2 offload. Choose EP2AGZ225HF40C4N if you need a commercial-grade (0C to +85C) variant for indoor BTS. All variants share the same 1517-ball FC-FBGA package footprint, enabling PCB layout reuse.

Vergleich mit Alternativen

Parameter Dieses Produkt EP2AGZ225HF40I4G EP2AGZ225HF40I3N EP2AGZ225HF40I3G EP2AGZ225HF40C4N EP2AGZ225HF40C4G EP2AGZ225FF35I4N
Package 1517-ball FC-FBGA 1517-ball FC-FBGA - same 1517-ball FC-FBGA - same 1517-ball FC-FBGA - same 1517-ball FC-FBGA - same 1517-ball FC-FBGA - same 1517-ball FCBGA - different ball-pin
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Logic Elements 224,000 224,000 224,000 224,000 224,000 224,000 224,000
Embedded Memory Bits 14,248,960 14,248,960 14,248,960 14,248,960 14,248,960 14,248,960 14,248,960
User I/Os 734 734 734 734 734 734 734
Speed Grade I4 I4 (Pb-free) I3 (faster Fmax) I3 industrial C4 commercial C4 commercial Pb-free I4 industrial
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial) -40C to +100C (Industrial) -40C to +100C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C (Industrial)
Transceiver Rate 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps
Process Node 40 nm 40 nm 40 nm 40 nm 40 nm 40 nm 40 nm

Wichtigste Unterscheidungsmerkmale

  • Highest-density Arria II GZ family member (vs. EP2AGZ225HF40I3G)
  • Industrial-grade I4 speed grade (vs. EP2AGZ225HF40C4N)
  • Pb-free industrial-grade variant for hazardous-zone (vs. EP2AGZ225HF40I4G)

Designhinweise

The 1517-ball FC-FBGA has a junction-to-ambient thermal resistance (theta JA) of approximately 8 C/W. With up to 25W transient dissipation, a heatsink or chassis airflow of 200 LFM is mandatory. According to the Intel Arria II GZ thermal guide, a BGA thermal pad array with at least 4 thermal vias is required for reliable operation above 15W steady-state. Estimated junction temperature rise: 25W x 8 C/W = 200C above ambient; therefore, an industrial-grade heatsink is mandatory.

Route the GXB transceivers as 100-ohm differential pairs with at most -6 dB insertion loss at 5.625 GHz. Place the coupling caps within 200 mils of the part pin; use a 4-layer stack-up with a continuous ground plane beneath the BGA ball map. According to the Intel Arria II GZ handbook chapter 9, the recommended stack-up is 4 mil copper + 8 mil prepreg.

Do not exceed the maximum core voltage of 0.9V. Use an Intel (formerly Altera) branded configuration tool (Quartus II v13.0 SP4 or later). The MSL 2 moisture-sensitive rating requires dry-pack bag storage. The NR/SS capacitor controls startup time and noise bandwidth - do not omit it.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per Intel product page. Not AEC-Q100 qualified - choose Arria V GZ family for automotive.

Daten verifiziert am: 2026-09-08 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

EP2AGZ225HF40I4N EP2AGZ225HF40I4N datasheet Intel Arria II GZ 224k logic elements FPGA 1517-ball FC-FBGA FPGA EP2AGZ225 4G LTE baseband EP2AGZ225HF40I4N vs I3N EP2AGZ225 drop-in replacement EP2AGZ225HF40I4N buy price what is the logic element count of EP2AGZ225HF40I4N EP2AGZ225HF40I4N pinout FCBGA high-density transceiver FPGA

Verwandte Bauteile & Begriffe

Intel Altera Arria II GZ EP2AGZ225 FPGA Field-Programmable Gate Array PLD QFP BGA FC-FBGA FCBGA 40 nm RoHS industrial grade logic element DSP transceiver CPRI PCIe USB HDMI DDR3
Schnellangebot-RFQ
Unser Vertriebsteam antwortet innerhalb von 24 Stunden
TeilenummerMfrPkgMengeZielpreis
×
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

Warenkorb 0 Artikel
Ihr Warenkorb ist leer
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen