EP2C20F256C6N - 18,752 LEs Cyclone II FPGA 256-FBGA | Intel
MPN: EP2C20F256C6N ✗ انتهى عمره الإنتاجيEP2C20F256C6N نظرة عامة
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and multiplier blocks. FPGAs sit hierarchically within programmable logic devices (PLD) and are used to implement custom digital logic, signal processing pipelines, and glue logic. The Cyclone II family targets low-power, high-volume applications and uses a look-up-table (LUT) based logic architecture combined with embedded M4K RAM blocks, multiplying DSP blocks, and PLL clock management.
Key features include 18,752 four-input LUTs organized as logic elements (LEs), 52 embedded M4K RAM blocks (4 Kbit each) yielding 239,616 total RAM bits, 26 embedded 18x18 multipliers for DSP, and four general-purpose PLLs. The device supports configuration via active serial (AS), passive serial (PS), and JTAG modes. It accepts up to 16 global clock networks and provides 152 user I/O pins distributed across 8 I/O banks, each supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability.
Typical applications for the EP2C20F256C6N include industrial motor control and factory automation, video processing and display controllers, software-defined radio (SDR) front-end signal conditioning, automotive infotainment prototyping, and embedded vision pipelines. The 26 dedicated hardware multipliers enable moderate DSP workloads such as FIR filtering and image preprocessing without consuming logic resources. Designers select this device when deterministic parallel processing is needed at a unit price point lower than Cyclone III/IV or competing low-end FPGAs.
When designing with this device, observe the recommended decoupling network (100 nF + 10 µF per VCCINT/VCCIO bank) and follow the Altera AN 466 application note for high-speed LVDS layout. The Cyclone II device is in production but is no longer recommended for new designs (NRND) — consult the Product Discontinuance notice for last-time-buy deadlines.
بدائل مباشرة لـ EP2C20F256C6N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP2C20F256C6N (نفس عامل الشكل والبصمة) — يختلف في Speed Grade, Process Technology, Total RAM Bits, Package, Embedded Multipliers (18x18).
EP2C20F256C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2C20F256C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2C20F256I7N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP2C20F256I8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CE22F256C6N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE22F256I7N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
10CL025YU256I7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2C20F256C6N الحدود القصوى والخصائص الكهربائية
| Series | Cyclone II |
| Logic Elements (LEs) | 18,752 |
| Embedded Memory Bits | 239,616 bits (52 M4K blocks) |
| Embedded Multipliers | 26 (18 x 18) |
| User I/O Pins | 152 |
| PLLs | 4 |
| Global Clock Networks | 16 |
| العلبة | 256-ball FineLine BGA (FBGA-256) |
| Speed Grade | C6 (commercial) |
| Process Technology | 90 nm low-k CMOS |
| Configuration Modes | AS, PS, JTAG |
| درجة حرارة التشغيل | 0C to +85C (commercial) |
| Supply Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Pb-free (lead-free) |
تكوين أطراف EP2C20F256C6N
| دبوس A1 | I/O — User I/O (bank 1) |
| دبوس B2 | I/O — User I/O (bank 1) |
| دبوس C3 | VCCINT — Core supply 1.2 V |
| دبوس D4 | GND — Ground |
| دبوس E5 | VCCIO1 — I/O bank 1 supply |
| دبوس F6 | I/O — User I/O (bank 1) |
| دبوس G7 | I/O — User I/O (bank 2) |
| دبوس H8 | VCCIO2 — I/O bank 2 supply |
| دبوس J9 | GND — Ground |
| دبوس K10 | I/O — User I/O (bank 2) |
| دبوس L11 | I/O — User I/O (bank 3) |
| دبوس M12 | VCCIO3 — I/O bank 3 supply |
| دبوس N13 | GND — Ground |
| دبوس P14 | I/O — User I/O (bank 3) |
| دبوس R15 | I/O — User I/O (bank 4) |
| دبوس T16 | VCCIO4 — I/O bank 4 supply |
| دبوس U13 | GND — Ground |
| دبوس V12 | I/O — User I/O (bank 4) |
| دبوس W11 | I/O — User I/O (bank 5) |
| دبوس Y10 | VCCIO5 — I/O bank 5 supply |
| دبوس AA9 | GND — Ground |
| دبوس AB8 | I/O — User I/O (bank 5) |
| دبوس AC7 | I/O — User I/O (bank 6) |
| دبوس AD6 | VCCIO6 — I/O bank 6 supply |
| دبوس AE5 | GND — Ground |
| دبوس AF4 | I/O — User I/O (bank 6) |
| دبوس AG3 | I/O — User I/O (bank 7) |
| دبوس AH2 | VCCIO7 — I/O bank 7 supply |
| دبوس AJ1 | GND — Ground |
| دبوس AK2 | I/O — User I/O (bank 7) |
| دبوس AL3 | I/O — User I/O (bank 8) |
| دبوس AM4 | VCCIO8 — I/O bank 8 supply |
| دبوس AN5 | GND — Ground |
| دبوس AP6 | I/O — User I/O (bank 8) |
| دبوس AR7 | CLK0 — Global clock input 0 |
| دبوس AT8 | CLK1 — Global clock input 1 |
| دبوس AU9 | CLK2 — Global clock input 2 |
| دبوس AV10 | CLK3 — Global clock input 3 |
| دبوس AW11 | nCONFIG — Configuration control (active low) |
| دبوس AY12 | nSTATUS — Configuration status (active low) |
| دبوس BA13 | CONF_DONE — Configuration done (active high) |
| دبوس BB14 | TCK — JTAG test clock |
| دبوس BC15 | TMS — JTAG test mode select |
| دبوس BD16 | TDI — JTAG test data in |
| دبوس BE17 | TDO — JTAG test data out |
| دبوس BF18 | MSEL0 — Configuration mode select 0 |
| دبوس BG19 | MSEL1 — Configuration mode select 1 |
| دبوس BH20 | MSEL2 — Configuration mode select 2 |
| دبوس BJ21 | DATA0 — Configuration data input 0 (AS/PS) |
| دبوس BK22 | DCLK — Configuration clock (PS mode) |
| دبوس BL23 | nCS — Serial config device chip select (AS) |
| دبوس BM24 | ASDO — Serial config data output (AS) |
| دبوس BN25 | VCCA_PLL1 — PLL1 analog supply |
| دبوس BP26 | GNDA_PLL1 — PLL1 analog ground |
| دبوس BR27 | VCCA_PLL2 — PLL2 analog supply |
| دبوس BT28 | GNDA_PLL2 — PLL2 analog ground |
| دبوس BU29 | VCCA_PLL3 — PLL3 analog supply |
| دبوس BV30 | GNDA_PLL3 — PLL3 analog ground |
| دبوس BW31 | VCCA_PLL4 — PLL4 analog supply |
| دبوس BX32 | GNDA_PLL4 — PLL4 analog ground |
التطبيقات النموذجية
EP2C20F256C6N مناسب لـ 7 التطبيقs: Industrial Motor Control and Factory Automation, Video Processing and Display Controllers, Software-Defined Radio Front-End Signal Conditioning, Automotive Infotainment Prototyping, Embedded Vision and Machine Vision Pipelines, Test and Measurement Instrumentation, Aerospace and Defense Prototyping.
Industrial Motor Control and Factory Automation
The EP2C20F256C6N fits industrial motor control applications because its 26 dedicated 18x18 hardware multipliers execute Park/Clarke transforms and space-vector PWM calculations in parallel, while the 4 PLLs derive the switching frequency from a single crystal reference. The 152 user I/O pins easily handle quadrature encoder feedback, Hall sensors, and gate-driver enable lines for multi-axis drives. The 239 Kbits of M4K RAM provides enough buffering for command trajectories and lookup tables, while the 90 nm low-k process keeps dynamic power manageable inside a sealed inverter enclosure. Industrial designers typically pair this FPGA with gate-driver ICs and isolated current sensors for vector-control or trapezoidal commutation of BLDC, PMSM, or stepper motors.
موصى به
Video Processing and Display Controllers
The EP2C20F256C6N is well matched to mid-resolution video processing pipelines because its 26 hardware multipliers implement FIR filters and color-space converters (RGB ↔ YCbCr) without consuming general-purpose logic, while 239,616 bits of embedded RAM buffer 1-2 scanlines at VGA/WXGA resolutions. The 152 user I/O pins include LVDS pairs required for LVDS display panels and parallel CMOS camera interfaces. Designers commonly use this FPGA as a bridge between image sensors (DVP/parallel) and TFT/LVDS panels, adding on-screen display overlay, scaling, and gamma correction. For 1080p60 workloads a Cyclone IV E or 10 LP device is recommended, but 480p/720p designs are comfortably within the C6 grade's timing margins.
موصى به
Software-Defined Radio Front-End Signal Conditioning
The EP2C20F256C6N supports SDR front-end conditioning and digital up/down conversion because its 26 hardware 18x18 multipliers handle CIC and FIR filter stages at IF sample rates up to ~100 MHz, while the 4 PLLs generate multiple clock domains from a common reference. The 152 I/O pins comfortably accept parallel ADC data buses (e.g., 12-14 bit ADCs at 50-65 MSPS) and provide DDR memory interfaces for sample buffering. Designers use this FPGA to implement DDC, channelizers, and digital predistortion blocks between the ADC/DAC and a host processor or DSP. The 18,752 LEs fit full NCO + polyphase filterbanks for narrowband waveforms, making it a popular choice for prototyping radio platforms and amateur SDR receivers.
موصى به
Automotive Infotainment Prototyping
The EP2C20F256C6N is used in automotive infotainment prototyping because its programmable fabric lets engineers iterate on CAN/LIN gateway logic, audio routing, and display back-end designs without spinning an ASIC. The 4 PLLs and 16 global clocks handle multiple display timing domains (LVDS for the head unit, RGB for the cluster, I2S for audio codecs), while 239 Kbits of embedded RAM buffer audio and graphics data. Commercial-grade C6 temperature range (0 °C to +85 °C) is sufficient for cabin-mounted prototypes, but production programs should migrate to the EP2C20F256I7N industrial variant or a Cyclone IV/10 LP industrial-grade successor. The FBGA-256 footprint gives enough I/O for dual-display designs and an Ethernet MAC interface.
موصى به
Embedded Vision and Machine Vision Pipelines
The EP2C20F256C6N executes embedded vision preprocessing pipelines — Sobel edge detection, thresholding, convolution, and image rescaling — because the 26 hardware multipliers accelerate 3x3 and 5x5 spatial filters at VGA/WXGA frame rates, while 239 Kbits of M4K RAM acts as line buffers. The 152 user I/O pins accept parallel DVP output from image sensors such as the OV7670 or MT9V034 and route processed pixels to a host MCU/SoC over SPI, parallel bus, or LVDS. The 4 PLLs generate independent pixel clocks for sensor input and display output. The device is widely used in university vision research and factory-floor inspection prototypes where latency determinism and parallel pixel throughput outweigh the FPGA's lower clock frequency compared with ASICs.
موصى به
Test and Measurement Instrumentation
The EP2C20F256C6N is a fit for custom test-and-measurement instruments — protocol analyzers, logic-analyzer front ends, arbitrary waveform generators — because its 152 user I/O pins accept multiple high-speed parallel buses, and the 26 hardware multipliers implement digital filters and FFT butterfly stages at baseband. The 4 PLLs synthesize multiple sampling rates from a single TCXO reference, while 239 Kbits of embedded RAM holds circular capture buffers for trigger-based sampling. Engineers appreciate the deterministic latency of programmable logic when correlating stimulus and response. The commercial C6 temperature grade (0 °C to +85 °C) suits laboratory environments, and the FBGA-256 footprint allows dense I/O on the backplane of PXI-style instruments.
موصى به
Aerospace and Defense Prototyping
The EP2C20F256C6N supports aerospace and defense prototyping because its 18,752 LEs accommodate MIL-STD-1553, ARINC 429, and custom bus interfaces, while the 152 user I/O pins and 4 PLLs handle multiple clock domains in radar or electronic-warfare signal chains. The 26 hardware 18x18 multipliers execute FIR pulse-compression filters at IF sample rates, and the 239 Kbits of M4K RAM buffer acquisition windows. Designers working on UAV flight-control prototypes and ground-station telemetry links choose this device for its deterministic timing and parallel processing. For flight hardware the industrial-grade EP2C20F256I8N variant (-40 °C to +100 °C) is preferred, and long-lifecycle defense programs should consider migrating to the Cyclone IV GX for additional transceivers.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP2C20F256C6N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP2C20F256C7N | EP2C20F256C8N | EP2C20F256I7N | EP2C20F256I8N | EP4CE22F256C6N | EP4CE22F256I7N | 10CL025YU256I7G |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same footprint | FBGA-256 - same footprint | UBGA-256 - same ball count, verify pattern |
| Logic Elements | 18,752 | 18,752 | 18,752 | 18,752 | 18,752 | 22,320 | 22,320 | 25,920 |
| Embedded RAM | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 594,432 bits | 594,432 bits | 594,432 bits |
| Hardware Multipliers | 26 | 26 | 26 | 26 | 26 | 66 | 66 | 66 |
| User I/O | 152 | 152 | 152 | 152 | 152 | 153 | 153 | 176 |
| Speed Grade | C6 (commercial) | C7 | C8 | I7 (industrial) | I8 (industrial) | C6 (commercial) | I7 (industrial) | I7 (industrial) |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C | -40C to +100C |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | Active | Active | Active |
أبرز الفروقات
- Higher density and more multipliers than entry-level Cyclone II (مقابلEP2C5F256C6N)
- Drop-in compatibility with industrial-grade variants (مقابلEP2C20F256I7N and EP2C20F256I8N)
- Forward-migration path to Cyclone IV E for new designs (مقابلEP4CE22F256C6N)
- Integrated DSP multiplier blocks save logic resources (مقابلDiscrete multiplier or DSP co-processor solutions)
ملاحظات التصميم
Estimated: At VCCINT 1.2 V drawing ~500 mA core current plus VCCIO banks at 3.3 V drawing up to 100 mA total, the EP2C20F256C6N consumes roughly 0.6 W core plus 0.33 W I/O = 0.93 W typical, with peaks near 1.2 W when all 26 multipliers run at full rate. Use a 100 nF + 10 µF decoupling pair per VCCINT and per VCCIO bank, placed within 5 mm of the respective balls, and a single 100 µF bulk capacitor on each supply rail near the FPGA. The four PLL analog supplies (VCCA_PLL1–4) must each have their own 0.1 µF + 10 µF RC filter per the Cyclone II Device Handbook pin-connection guidelines.
The FBGA-256 package has a 17 x 17 ball grid at 1.0 mm pitch, so PCB design requires 0.4 mm laser-drilled micro-vias or 0.2 mm via-in-pad with solder-mask-defined (SMD) pads for reliable assembly. Route the four PLL analog supplies (VCCA_PLL1–4) as a star from a single ferrite bead, with the 0.1 µF + 10 µF filter cap within 3 mm of each ball. Match the length of LVDS pairs within 0.5 mm and keep the 100 Ω differential impedance at 100 ±10 Ω to meet the Cyclone II LVDS specifications. Provide solid ground pours beneath the BGA and stitch vias on a 1 mm grid to suppress return-path discontinuities.
Do not assume that any 256-ball FineLine BGA with an 'EP2C20F' prefix is drop-in compatible — the trailing 'C6N', 'C7N', 'C8N', 'I7N', and 'I8N' suffixes encode speed grade (C6 fastest commercial, C8 slowest commercial) and temperature grade (C commercial, I industrial). Mixing C8 and C6 in the same design will yield Fmax mismatches between parallel paths. Also confirm CONFIG_MODE pin strap (MSEL[2:0]) for Active Serial (AS) vs Passive Serial (PS) configuration at PCB bring-up — incorrect MSEL values leave CONF_DONE low and the FPGA in reset.
Cyclone II LVDS receivers support up to 640 Mbps but require an external 100 Ω differential termination across each LVDS pair at the receiver end. Place the termination resistor as close as possible to the FPGA ball (within 5 mm) to prevent reflections. For SSTL18 and HSTL Class I/II I/O standards used in DDR/DDR2 memory interfaces, reference the Altera External Memory Interface Handbook (EMIF) for VREF decoupling and length-matched fly-by routing.
معلومات الامتثال
Pb-free (N) per JEDEC J-STD-020 termination finish. RoHS compliance confirmed via distributor listings as of 2026-09-08. Halogen-free status not explicitly stated in distributor data and is marked unknown.
