EP3C16U256C7N - 15,408-Cell Cyclone III FPGA | Intel
MPN: EP3C16U256C7N ✓ نشطEP3C16U256C7N نظرة عامة
An FPGA is a programmable logic device that combines configurable logic blocks, embedded memory, input/output resources, and programmable interconnect fabric. Within the semiconductor hierarchy, the EP3C16U256C7N is a field-programmable gate array, or FPGA, within the Cyclone III family of programmable logic devices. Its parallel architecture allows hardware functions to execute concurrently without relying on sequential software instructions.
The device provides 168 logic elements according to its catalog listing, 15,408 logic cells, and 516,096 bits of embedded memory according to the manufacturer-related product information. A maximum frequency of 472.5 MHz supports clocked control logic, interface conditioning, and signal-processing pipelines. The 256-ball package uses a 0.80 mm ball pitch and occupies approximately 14 mm by 14 mm, enabling dense board integration without changing the functional architecture.
The Cyclone III architecture is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its universal-device suffix identifies a device intended for broader system-clock and I/O flexibility than speed-specific variants. Exact pin functions, I/O standards, bank voltage limits, configuration requirements, and recommended decoupling should be assigned from the manufacturer pin-description table and electrical-characteristics documentation.
Typical applications include industrial control modules, communications interfaces, video and image-processing pipelines, sensor acquisition, and compact embedded systems. In these systems, parallel logic can implement protocol conversion, filtering, data formatting, and real-time control in hardware. The 472.5 MHz device class is particularly appropriate where predictable parallel processing and dedicated I/O resources matter more than software flexibility alone.
Board design should preserve the recommended ball pattern, power and ground distribution, and high-speed routing geometry. Configuration signals, clock inputs, decoupling networks, and exposed thermal requirements must be checked against the exact package drawing before layout release. Because this is a large BGA device, assembly inspection and thermal-path planning are as important as logical design.
This page combines package, capacity, speed, and temperature information with practical selection guidance, application analysis, and verified drop-in alternatives. It is intended to help engineers identify whether the EP3C16U256C7N matches the required logic density, memory capacity, package, and operating environment before beginning PCB implementation.
بدائل مباشرة لـ EP3C16U256C7N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C16U256C7N (نفس عامل الشكل والبصمة) — يختلف في Device Type, Logic Elements, Package, Manufacturer, Package Dimensions.
EP3C16U256C7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16F256C7N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C10U256C8N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C16U256C7N الحدود القصوى والخصائص الكهربائية
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Cells | 15,408 cells |
| Logic Elements | 168 elements |
| Embedded Memory | 516,096 bits |
| Maximum Frequency | 472.5 MHz |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.2 V |
| العلبة | 256-ball BGA |
| Package Dimensions | 14 mm x 14 mm |
| Package Height | 2.20 mm |
| Ball Pitch | 0.80 mm |
| درجة حرارة التشغيل | 0°C to +85°C |
| نوع التركيب | Surface Mount |
| Terminal/Ball Count | 256 balls |
| Lead-Free Status | Lead free |
| حالة RoHS | Compliant |
دليل تكوين أطراف EP3C16U256C7N 2.20 mm
تكوين الأطراف لـ EP3C16U256C7N (حزمة 2.20 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C16U256C7N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C16U256C7N مناسب لـ 6 التطبيقs: Industrial Control and Automation, Communications Interface and Protocol Conversion, Signal Processing and Filtering, Sensor Acquisition and Data Conditioning, Embedded Video and Image Processing, Programmable Logic and System Integration.
Industrial Control and Automation
The EP3C16U256C7N fits compact industrial controllers that combine deterministic hardware logic with embedded memory. Its 15,408 logic cells can implement sequencing, interlocks, counters, and communication framing in parallel, while 516,096 memory bits support buffers and lookup functions. The 0°C to +85°C operating range suits equipment controlled inside factory environments. Place the FPGA beside sensor-conditioning and actuator-driver circuits, and keep clock-sensitive logic on short, referenced routes. The 472.5 MHz maximum-frequency rating leaves timing margin for demanding pipelines, but the final design should use the speed grade and I/O constraints listed in the manufacturer documentation.
موصى به
Communications Interface and Protocol Conversion
The EP3C16U256C7N is suitable for communications adapters that must serialize, deserialize, frame, filter, or translate data at deterministic rates. Parallel FPGA logic can maintain multiple channels or perform clock-domain-aware transformations without the scheduling overhead of a microcontroller. The 15,408 logic cells provide ample combinational and sequential resources, and the 516,096 memory bits can hold packet descriptors or line buffers. Its 256-ball package supports a high pin count for external interfaces, although each I/O standard must be selected against the corresponding bank supply. For high-speed interfaces, preserve controlled-impedance routing and use the manufacturer's clocking and pin-location guidance.
موصى به
Signal Processing and Filtering
The EP3C16U256C7N can implement parallel digital filters, correlation functions, waveform analysis, and data-format conversion in dedicated hardware. Its 472.5 MHz maximum operating frequency supports deeply pipelined processing stages, while embedded memory can implement coefficient storage, delay lines, and sample buffers. Partition the design into fixed-latency pipeline stages so that timing closure is predictable across the selected device grade. Use dedicated clock input pins, keep feedback loops short, and constrain every registered interface before implementation. The large BGA package also gives access to numerous user I/O balls, but routing density and simultaneous switching considerations make careful layer planning essential.
موصى به
Sensor Acquisition and Data Conditioning
The EP3C16U256C7N is useful in sensor-acquisition systems that must combine multiple inputs, perform calibration, and format measurements before passing data to another controller. Parallel sampling logic can reduce processing delay and maintain uniform timing across channels. Its 15,408 logic cells support channel multiplexing, digital filtering, thresholding, and error detection, while 516,096 memory bits can buffer bursts of sensor data. The 0°C to +85°C range suits many industrial and embedded installations. Designers should define input voltage standards and bank supplies from the manufacturer pin table, add input conditioning where required, and isolate analog and digital return paths to prevent acquisition noise from entering the FPGA.
موصى به
Embedded Video and Image Processing
The EP3C16U256C7N can support parallel image pipelines that perform pixel classification, thresholding, color conversion, or region extraction. Its 472.5 MHz device class allows multiple pipeline stages to operate concurrently, reducing the memory bandwidth and processor burden associated with sequential software processing. The 516,096 embedded memory bits provide local line or tile storage, although full-frame buffering generally requires external memory. Use the manufacturer-defined memory interfaces and keep high-speed data buses away from sensitive clock and supply paths. Because the 256-ball BGA has substantial routing requirements, a multilayer board with uninterrupted power planes and disciplined ball escape routing is preferable to a two-layer implementation.
موصى به
Programmable Logic and System Integration
The EP3C16U256C7N serves as a programmable logic platform for consolidating glue logic, timing-sensitive control, and peripheral bridging around a processor or ASIC. Its 15,408 cells can absorb address decoding, arbitration, interrupt generation, and peripheral translation, reducing processor workload and board area. A 256-ball package provides a substantial number of configurable I/O resources for external buses and control signals. Designers should assign pins according to bank voltage requirements, verify dedicated configuration and clock pins, and avoid loading user I/O beyond the electrical limits. At the board level, provide local decoupling, continuous return paths, and a manufacturing strategy suited to the 0.80 mm ball pitch.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C16U256C7N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C16U256C7 | EP3C16F256C7N | EP3C10U256C8N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 256-ball BGA | 256-pin UFBGA | FBGA-256 | 256-ball BGA |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Device Variant | Universal C7N ordering code | Universal C7 ordering code | F speed-grade ordering code | 10-cell C8 ordering code |
أبرز الفروقات
- Higher listed operating-frequency class (مقابلEP3C16U256C7)
- Full 15,408-cell resource match (مقابلEP3C10U256C8N)
- Universal device ordering option (مقابلEP3C16F256C7N)
ملاحظات التصميم
Use the manufacturer power architecture for the 1.2 V core and associated I/O supplies. Place the required bulk and high-frequency decoupling capacitance directly on the designated power and ground balls, using separate routing paths for noisy I/O returns. Estimate worst-case power from actual toggle rates, clock activity, and I/O loading; the 472.5 MHz figure is a maximum device rating, not an indication that every design consumes power at that frequency.
The 256-ball BGA uses a 0.80 mm pitch and requires a multilayer PCB with controlled escape routing, uninterrupted power planes, and short ground returns. Follow the package drawing for ball coordinates rather than estimating locations from the 14 mm by 14 mm body dimension. Apply assembly-process rules for pad definition, solder mask, paste deposition, and inspection so that dense ball escape patterns remain manufacturable.
Estimate junction temperature from total dynamic and static dissipation, board thermal resistance, and ambient temperature. Spread heat through the package balls into internal ground planes and add thermal vias only where the package design permits them. Dense logic, high clock rates, and simultaneous I/O switching can increase dissipation, so validate the worst-case workload under both chamber temperature and measured board conditions before approving the enclosure design.
Assign clocks to the manufacturer's recommended clock pins, preserve short return paths, and keep configuration and high-speed user interfaces away from noisy switching outputs. Use the pin-description table to confirm I/O standards and bank supplies before final schematic capture. For external-memory interfaces, follow the documented impedance and topology requirements; otherwise, edge degradation can create timing failures that appear only at temperature, voltage, or process extremes.
معلومات الامتثال
The product listing identifies the device as RoHS compliant and lead free. Automotive qualification, REACH status, halogen-free status, and conflict-minerals status are not stated.
