Intel

EP3C16U256C7N - 15,408-Cell Cyclone III FPGA | Intel

Name: EP3C16U256C7N - 15,408-Cell Cyclone III FPGA | Intel
Brand: Intel
SKU: EP3C16U256C7N

部品番号: EP3C16U256C7N ✓ 生産中

1.2 V Vdss 256-ball BGA Package 472.5 MHz Speed 516,096 bits Memory

見積もり依頼

MOQ: 1 |

データシートを見る (PDF) 代替品を見る

数量

EP3C16U256C7N 概要

The Intel EP3C16U256C7N is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 memory bits, a maximum operating frequency of 472.5 MHz, and a 256-ball BGA package. The universal-device designation and industrial 0°C to +85°C temperature range suit programmable control, signal-processing, communications, and embedded-system designs.

An FPGA is a programmable logic device that combines configurable logic blocks, embedded memory, input/output resources, and programmable interconnect fabric. Within the semiconductor hierarchy, the EP3C16U256C7N is a field-programmable gate array, or FPGA, within the Cyclone III family of programmable logic devices. Its parallel architecture allows hardware functions to execute concurrently without relying on sequential software instructions.

The device provides 168 logic elements according to its catalog listing, 15,408 logic cells, and 516,096 bits of embedded memory according to the manufacturer-related product information. A maximum frequency of 472.5 MHz supports clocked control logic, interface conditioning, and signal-processing pipelines. The 256-ball package uses a 0.80 mm ball pitch and occupies approximately 14 mm by 14 mm, enabling dense board integration without changing the functional architecture.

The Cyclone III architecture is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its universal-device suffix identifies a device intended for broader system-clock and I/O flexibility than speed-specific variants. Exact pin functions, I/O standards, bank voltage limits, configuration requirements, and recommended decoupling should be assigned from the manufacturer pin-description table and electrical-characteristics documentation.

Typical applications include industrial control modules, communications interfaces, video and image-processing pipelines, sensor acquisition, and compact embedded systems. In these systems, parallel logic can implement protocol conversion, filtering, data formatting, and real-time control in hardware. The 472.5 MHz device class is particularly appropriate where predictable parallel processing and dedicated I/O resources matter more than software flexibility alone.

Board design should preserve the recommended ball pattern, power and ground distribution, and high-speed routing geometry. Configuration signals, clock inputs, decoupling networks, and exposed thermal requirements must be checked against the exact package drawing before layout release. Because this is a large BGA device, assembly inspection and thermal-path planning are as important as logical design.

This page combines package, capacity, speed, and temperature information with practical selection guidance, application analysis, and verified drop-in alternatives. It is intended to help engineers identify whether the EP3C16U256C7N matches the required logic density, memory capacity, package, and operating environment before beginning PCB implementation.

ドロップイン代替品: EP3C16U256C7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3C16U256C7N （同一形状・フットプリント） — 相違点: Device Type, Logic Elements, Package, Manufacturer, Package Dimensions.

EP3C16U256C7

Intel

Device Type: Cyclone III Field Programmable Gate Array (FPGA)

Logic Elements: 15,408

Package: 256-LFBGA

比較対象 EP3C16U256C7N →

EP3C16U256C8

Intel

Device Type: Cyclone III field-programmable gate array (FPGA)

Logic Elements: 15,408 logic elements

Package: 256-ball UFBGA package

比較対象 EP3C16U256C7N →

EP3C16U256C7

✅ ドロップイン

Intel

📦 BGA-256

Cyclone III Field Programmable Gate Array (FPGA) · 15,408 · 516,096 bits · 168 · 256-LFBGA · 65 nm · 1.2 V · 437.5 MHz

価格はお問い合わせください

データシートを見る →

EP3C16F256C7N

✅ ドロップイン

📦 BGA-256

Uses the F device suffix and is listed at up to 437.5 MHz versus 472.5 MHz for EP3C16U256C7N; both have 15,408 logic cells and 516,096 memory bits.

📋 参考代替品（カタログ未掲載）

EP3C10U256C8N

✅ ドロップイン

📦 BGA-256

The smaller Cyclone III device has approximately 10,000 logic cells versus 15,408 for EP3C16U256C7N, a 35% capacity reduction, while retaining the 256-ball package.

📋 参考代替品（カタログ未掲載）

EP3C16U256C7N 最大定格＆電気的特性

Device Type	Field Programmable Gate Array (FPGA)
FPGA Family	Cyclone III
Logic Cells	15,408 cells
Logic Elements	168 elements
Embedded Memory	516,096 bits
Maximum Frequency	472.5 MHz
Process Technology	65 nm CMOS
Core Supply Voltage	1.2 V
パッケージ	256-ball BGA
Package Dimensions	14 mm x 14 mm
Package Height	2.20 mm
Ball Pitch	0.80 mm
動作温度	0°C to +85°C
実装タイプ	Surface Mount
Terminal/Ball Count	256 balls
Lead-Free Status	Lead free
RoHS ステータス	Compliant

EP3C16U256C7N 2.20 mm ピン配置ガイド

EP3C16U256C7N (2.20 mm パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

詳細なピン配置データはありません: EP3C16U256C7N.

詳細はデータシートをご参照ください。

主な用途

EP3C16U256C7N の用途: 6 件s: Industrial Control and Automation, Communications Interface and Protocol Conversion, Signal Processing and Filtering, Sensor Acquisition and Data Conditioning, Embedded Video and Image Processing, Programmable Logic and System Integration.

🏭

Industrial Control and Automation

The EP3C16U256C7N fits compact industrial controllers that combine deterministic hardware logic with embedded memory. Its 15,408 logic cells can implement sequencing, interlocks, counters, and communication framing in parallel, while 516,096 memory bits support buffers and lookup functions. The 0°C to +85°C operating range suits equipment controlled inside factory environments. Place the FPGA beside sensor-conditioning and actuator-driver circuits, and keep clock-sensitive logic on short, referenced routes. The 472.5 MHz maximum-frequency rating leaves timing margin for demanding pipelines, but the final design should use the speed grade and I/O constraints listed in the manufacturer documentation.

おすすめ

EP3C16U256C7 · Intel EP3C10U256C8N (Lower-capacity Cyclone III control option)

🌐

Communications Interface and Protocol Conversion

The EP3C16U256C7N is suitable for communications adapters that must serialize, deserialize, frame, filter, or translate data at deterministic rates. Parallel FPGA logic can maintain multiple channels or perform clock-domain-aware transformations without the scheduling overhead of a microcontroller. The 15,408 logic cells provide ample combinational and sequential resources, and the 516,096 memory bits can hold packet descriptors or line buffers. Its 256-ball package supports a high pin count for external interfaces, although each I/O standard must be selected against the corresponding bank supply. For high-speed interfaces, preserve controlled-impedance routing and use the manufacturer's clocking and pin-location guidance.

おすすめ

EP3C16F256C7N (Same-capacity speed-grade alternative) EP3C16U256C7 · Intel

📺

Signal Processing and Filtering

The EP3C16U256C7N can implement parallel digital filters, correlation functions, waveform analysis, and data-format conversion in dedicated hardware. Its 472.5 MHz maximum operating frequency supports deeply pipelined processing stages, while embedded memory can implement coefficient storage, delay lines, and sample buffers. Partition the design into fixed-latency pipeline stages so that timing closure is predictable across the selected device grade. Use dedicated clock input pins, keep feedback loops short, and constrain every registered interface before implementation. The large BGA package also gives access to numerous user I/O balls, but routing density and simultaneous switching considerations make careful layer planning essential.

おすすめ

EP3C16F256C7N (Same-capacity processing alternative) EP3C10U256C8N (Lower-resource processing option)

🧩

Sensor Acquisition and Data Conditioning

The EP3C16U256C7N is useful in sensor-acquisition systems that must combine multiple inputs, perform calibration, and format measurements before passing data to another controller. Parallel sampling logic can reduce processing delay and maintain uniform timing across channels. Its 15,408 logic cells support channel multiplexing, digital filtering, thresholding, and error detection, while 516,096 memory bits can buffer bursts of sensor data. The 0°C to +85°C range suits many industrial and embedded installations. Designers should define input voltage standards and bank supplies from the manufacturer pin table, add input conditioning where required, and isolate analog and digital return paths to prevent acquisition noise from entering the FPGA.

おすすめ

EP3C16U256C7 · Intel EP3C10U256C8N (Lower-capacity acquisition alternative)

📺

Embedded Video and Image Processing

The EP3C16U256C7N can support parallel image pipelines that perform pixel classification, thresholding, color conversion, or region extraction. Its 472.5 MHz device class allows multiple pipeline stages to operate concurrently, reducing the memory bandwidth and processor burden associated with sequential software processing. The 516,096 embedded memory bits provide local line or tile storage, although full-frame buffering generally requires external memory. Use the manufacturer-defined memory interfaces and keep high-speed data buses away from sensitive clock and supply paths. Because the 256-ball BGA has substantial routing requirements, a multilayer board with uninterrupted power planes and disciplined ball escape routing is preferable to a two-layer implementation.

おすすめ

EP3C16F256C7N (Same-capacity video pipeline alternative) EP3C10U256C8N (Reduced-capacity image-processing option)

🔧

Programmable Logic and System Integration

The EP3C16U256C7N serves as a programmable logic platform for consolidating glue logic, timing-sensitive control, and peripheral bridging around a processor or ASIC. Its 15,408 cells can absorb address decoding, arbitration, interrupt generation, and peripheral translation, reducing processor workload and board area. A 256-ball package provides a substantial number of configurable I/O resources for external buses and control signals. Designers should assign pins according to bank voltage requirements, verify dedicated configuration and clock pins, and avoid loading user I/O beyond the electrical limits. At the board level, provide local decoupling, continuous return paths, and a manufacturing strategy suited to the 0.80 mm ball pitch.

おすすめ

EP3C16U256C7 · Intel EP3C16F256C7N (Same-capacity programmable logic option)

おすすめ製品の概要

EP3C16U256C7 Intel 使用用途: Industrial Control and Automation, Communications Interface and Protocol Conversion, Sensor Acquisition and Data Conditioning, Programmable Logic and System Integration EP3C10U256C8N Lower-capacity Cyclone III control option 使用用途: Industrial Control and Automation, Signal Processing and Filtering, Sensor Acquisition and Data Conditioning, Embedded Video and Image Processing EP3C16F256C7N Same-capacity speed-grade alternative 使用用途: Communications Interface and Protocol Conversion, Signal Processing and Filtering, Embedded Video and Image Processing, Programmable Logic and System Integration

What is the EP3C16U256C7N?

The EP3C16U256C7N is an Intel Cyclone III field-programmable gate array with 15,408 logic cells, 516,096 bits of embedded memory, and a maximum operating frequency of 472.5 MHz. It is packaged in a 256-ball BGA measuring approximately 14 mm by 14 mm. According to the manufacturer product information, the device uses a 65 nm CMOS process and a 1.2 V core supply, making it suitable for parallel control, communications, and embedded signal-processing systems.

What are the key specifications of EP3C16U256C7N?

The key specifications of the EP3C16U256C7N include 15,408 logic cells, 516,096 memory bits, a 472.5 MHz maximum frequency, a 65 nm CMOS process, and a 1.2 V core supply. The device is offered in a 256-ball BGA package with a 0.80 mm ball pitch and approximately 14 mm by 14 mm body size. Its specified operating-temperature range is 0°C to +85°C. These figures position it as a medium-density Cyclone III device for industrial and embedded applications.

Where can I download the EP3C16U256C7N datasheet PDF?

The EP3C16U256C7N datasheet can be accessed through the linked documentation page for this device. The document should be used to confirm the 256-ball pin assignment, supported I/O standards, configuration pins, power-supply requirements, and recommended operating conditions. The linked Octopart documentation page identifies Intel/Altera as the source manufacturer and provides access to the latest available datasheet files. Always match the PDF revision to the package and ordering information for EP3C16U256C7N.

Where can I find the EP3C16U256C7N pinout?

The EP3C16U256C7N pinout is defined by its 256-ball BGA package drawing and the manufacturer's pin-description table. The available catalog information confirms a 256-ball package, 0.80 mm pitch, and approximately 14 mm by 14 mm dimensions. Use the manufacturer documentation to identify power, ground, configuration, clock, and user I/O balls, because no public ball-by-ball pin list is reproduced on this page. Also confirm each ball's I/O standard against the selected board voltage.

Is the EP3C16U256C7N suitable for industrial applications?

The EP3C16U256C7N is suitable for industrial applications that require a 0°C to +85°C operating range and a medium-density programmable logic fabric. Its 15,408 logic cells and 516,096 memory bits support control, interface, and signal-processing functions, while the 472.5 MHz maximum frequency supports demanding clocked pipelines. The device is marked lead free and RoHS compliant. Qualification for a finished industrial system still requires checking the complete power, thermal, EMC, and lifecycle requirements.

What can replace the EP3C16U256C7N?

The EP3C16U256C7N can be considered for replacement by EP3C16U256C7, EP3C16F256C7N, or EP3C10U256C8N when their electrical ratings and configuration requirements match the original design. Each candidate belongs to the same Cyclone III family and uses a 256-ball package, but the C7, F, C8, and U suffixes can indicate different speed grades, temperature grades, or device variants. Validate pinout, timing, configuration, and memory requirements before approving a substitution.

EP3C16U256C7N vs EP3C16U256C7 - which is better?

EP3C16U256C7N and EP3C16U256C7 are closely related Cyclone III devices with the same 15,408 logic cells, 516,096 memory bits, 65 nm process, 1.2 V core supply, and 256-ball package. The available comparison lists a 472.5 MHz maximum frequency for EP3C16U256C7N and 437.5 MHz for EP3C16U256C7. EP3C16U256C7N is therefore the stronger choice when the higher frequency rating is needed, while the latter may suit designs whose timing closes at the lower grade.

Is EP3C16U256C7N the same as EP3C16F256C7N?

No, the EP3C16U256C7N and EP3C16F256C7N are not automatically interchangeable even though both are 15,408-cell Cyclone III devices in 256-ball packages. The F and U suffixes identify different device variants, and the documented maximum-frequency rating shown for EP3C16U256C7N is 472.5 MHz versus 437.5 MHz for EP3C16F256C7N. A replacement also requires checking configuration compatibility, I/O behavior, timing constraints, and the manufacturer's ordering guide.

When should I choose EP3C16U256C7N over EP3C10U256C8N?

Choose the EP3C16U256C7N when the design requires more than 10,000 logic cells, 516,096 bits of memory, or its higher listed performance class. EP3C10U256C8N belongs to the smaller 10,000-cell Cyclone III family and uses a different speed-grade suffix, so it may not close the same timing or support the same resource requirements. The 256-ball format is useful for board-layout continuity, but logical capacity and timing—not package similarity alone—determine suitability.

Can EP3C16U256C7N replace EP3C16F256C7N?

The EP3C16U256C7N may serve as a candidate replacement for the EP3C16F256C7N only after configuration and timing validation. Both devices are identified as 15,408-cell Cyclone III parts in 256-ball packages, but the listed maximum frequencies are 472.5 MHz and 437.5 MHz respectively, and the F versus U suffix denotes a meaningful variant distinction. Confirm the pinout, supported I/O standards, configuration method, and timing constraints before using one in an existing design.

What is the best Intel equivalent for EP3C16U256C7N?

The closest documented Intel alternatives are EP3C16U256C7, EP3C16F256C7N, and EP3C10U256C8N because all appear in Cyclone III 256-ball-package comparisons. EP3C16U256C7 provides the closest resource match, EP3C16F256C7N retains the same 15,408-cell capacity but has a lower listed maximum frequency, and EP3C10U256C8N has a smaller logic capacity. No verified cross-brand drop-in replacement was identified, so an exact Intel or Altera device should be preferred.

Where can I buy EP3C16U256C7N online?

Use the Request a Quote form on this page to request EP3C16U256C7N availability, current lead time, and minimum order quantity. The Request a Quote workflow provides a direct response for the exact 256-ball industrial-temperature ordering code without relying on generic search results. Include your target quantity, delivery location, and date of need in the request so procurement can confirm the appropriate supply channel and traceability requirements.

What is the price of EP3C16U256C7N?

Submit the EP3C16U256C7N part number and required quantity through the Request a Quote form on this page for current commercial terms. FPGA pricing can depend on quantity, package suffix, production status, and supply continuity, so a historical or family-level figure should not be treated as a quote. The form lets procurement return an exact ordering-code response for your volume and delivery requirements.

What is the lead time for EP3C16U256C7N?

Request the current lead time through the Request a Quote form on this page and provide the required quantity, ship-to location, and production schedule. Lead time for a large BGA FPGA may depend on available factory inventory, planned production, and order volume. The form allows the sourcing team to confirm a delivery commitment for EP3C16U256C7N rather than presenting an unverified interval that may not apply to the ordered quantity.

Is EP3C16U256C7N in stock?

Request EP3C16U256C7N stock confirmation through the Request a Quote form on this page. Include the quantity and delivery date so procurement can check the exact MPN and provide a current availability response. A listing page indicates where the part is offered, but it does not establish how many units can be allocated for a specific order or the delivery schedule for your requirement.

How do I design the power and thermal system for EP3C16U256C7N?

Design the EP3C16U256C7N around its 1.2 V core supply and the exact power rails identified in the manufacturer electrical documentation. Place decoupling capacitors at the designated supply and ground balls, use continuous power and ground planes, and preserve the manufacturer-recommended via arrangement. The 256-ball package also requires careful thermal assessment because dynamic power depends on logic activity, clock rate, I/O loading, and device utilization. Estimate total dissipation from the actual design rather than using a generic package value.

エンジニアリング参考データ: EP3C16U256C7N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP3C16U256C7N when a design needs the full 15,408-cell Cyclone III resource set, 516,096 memory bits, and the higher listed 472.5 MHz performance class in a 256-ball package. Select EP3C16U256C7 when the design closes comfortably at 437.5 MHz and the universal C7 ordering option meets all configuration and lifecycle requirements. EP3C16F256C7N is a candidate only when its F-variant behavior, 437.5 MHz rating, and configuration requirements are acceptable. Consider EP3C10U256C8N only for smaller logic budgets and verify its timing, memory, and suffix-specific ratings. Package similarity does not guarantee interchangeability: confirm pin assignments, I/O standards, timing constraints, configuration compatibility, and thermal requirements before releasing a replacement design.

代替品との比較

パラメータ	この製品	EP3C16U256C7	EP3C16F256C7N	EP3C10U256C8N
Brand	Intel	Intel	Intel	Intel
Package	256-ball BGA	256-pin UFBGA	FBGA-256	256-ball BGA
FPGA Family	Cyclone III	Cyclone III	Cyclone III	Cyclone III
Device Variant	Universal C7N ordering code	Universal C7 ordering code	F speed-grade ordering code	10-cell C8 ordering code

主な差別化要因

Higher listed operating-frequency class （vs EP3C16U256C7)
Full 15,408-cell resource match （vs EP3C10U256C8N)
Universal device ordering option （vs EP3C16F256C7N)

設計ノート

Use the manufacturer power architecture for the 1.2 V core and associated I/O supplies. Place the required bulk and high-frequency decoupling capacitance directly on the designated power and ground balls, using separate routing paths for noisy I/O returns. Estimate worst-case power from actual toggle rates, clock activity, and I/O loading; the 472.5 MHz figure is a maximum device rating, not an indication that every design consumes power at that frequency.

The 256-ball BGA uses a 0.80 mm pitch and requires a multilayer PCB with controlled escape routing, uninterrupted power planes, and short ground returns. Follow the package drawing for ball coordinates rather than estimating locations from the 14 mm by 14 mm body dimension. Apply assembly-process rules for pad definition, solder mask, paste deposition, and inspection so that dense ball escape patterns remain manufacturable.

Estimate junction temperature from total dynamic and static dissipation, board thermal resistance, and ambient temperature. Spread heat through the package balls into internal ground planes and add thermal vias only where the package design permits them. Dense logic, high clock rates, and simultaneous I/O switching can increase dissipation, so validate the worst-case workload under both chamber temperature and measured board conditions before approving the enclosure design.

Assign clocks to the manufacturer's recommended clock pins, preserve short return paths, and keep configuration and high-speed user interfaces away from noisy switching outputs. Use the pin-description table to confirm I/O standards and bank supplies before final schematic capture. For external-memory interfaces, follow the documented impedance and topology requirements; otherwise, edge degradation can create timing failures that appear only at temperature, voltage, or process extremes.

コンプライアンス情報

RoHS

Compliant

REACH

Unknown

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Unknown

The product listing identifies the device as RoHS compliant and lead free. Automotive qualification, REACH status, halogen-free status, and conflict-minerals status are not stated.

データ検証日: 2026-11-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています