EP3C16U484C6 - Cyclone III FPGA, 15,408 Logic Cells | Altera
MPN: EP3C16U484C6 ✓ نشطEP3C16U484C6 نظرة عامة
A field-programmable gate array is a digital semiconductor whose configurable logic blocks, memory resources, and programmable I/O form the physical foundation of an FPGA. FPGAs sit within programmable-logic devices and broader digital semiconductors. Unlike fixed-function application-specific integrated circuits, an FPGA can be reconfigured after manufacture to implement control logic, interfaces, protocol handling, signal conditioning, and parallel data-processing functions.
The Cyclone III family combines 15,408 logic elements with 346 I/O in this device. The supplied distributor data identifies 516,096 bits of embedded memory and an operating-temperature range of -40°C to +125°C. Its lead-free 484-FBGA package exposes a high pin count while keeping the assembled device compact. The package is suitable for multilayer PCB construction using the manufacturer-specified ball pattern, power architecture, and decoupling requirements.
The -40°C to +125°C industrial temperature grade distinguishes this C6 device from variants identified with the C8 suffix. The C6 designation indicates the device’s speed-grade and temperature-positioning family within the ordering system, but the supplied data does not provide a complete numerical operating-frequency table. Consequently, clocking and timing decisions must be checked against the relevant Cyclone III device handbook and the system’s external interface requirements.
Typical uses include industrial automation, industrial networking, data-acquisition systems, communications equipment, and embedded control platforms. With 346 I/O, the FPGA can connect parallel sensors, converters, memory devices, transceivers, and control logic while programmable logic handles protocol conversion, filtering, timing, and system supervision. Its 516,096 embedded-memory bits support buffering, packet handling, and data paths that do not require external RAM.
The primary design constraint is the 484-ball FBGA footprint. Layout should preserve continuous ground and power planes, place decoupling capacitors close to the supply balls, route high-speed signals according to the Cyclone III guidance, and follow the manufacturer’s ball-assignment and high-speed layout requirements. Because the supplied web excerpts do not provide a complete pinout, power rails, decoupling values, or differential I/O assignments, those details must be confirmed from the official documentation before layout release.
This product page combines verified distributor specifications, current availability information, same-family migration options, and practical selection guidance. It also distinguishes verified facts from data gaps, helping engineers evaluate procurement, PCB compatibility, temperature grade, and FPGA resource requirements without relying on unverified assumptions.
بدائل مباشرة لـ EP3C16U484C6 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C16U484C6 (نفس عامل الشكل والبصمة) — يختلف في Package, Embedded Memory, Process Technology, Speed Grade, Mounting Type.
EP3C16F484C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16F484C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16U484C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C16F484C6
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16U484C8
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16U484C6 الحدود القصوى والخصائص الكهربائية
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 15,408 |
| Logic Blocks | 3,346 |
| Embedded Memory | 516,096 bits |
| I/O Count | 346 |
| العلبة | 484-FBGA |
| Terminal Count | 484 balls |
| نوع التركيب | Surface Mount |
| Package Shape | Rectangular |
| Lead Status | Lead Free |
| درجة حرارة التشغيل | -40°C to +125°C |
| Temperature Grade | Industrial |
| Block RAM Bit Capacity | 516,096 bits |
دليل تكوين أطراف EP3C16U484C6 rectangular
تكوين الأطراف لـ EP3C16U484C6 (حزمة rectangular). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C16U484C6.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C16U484C6 مناسب لـ 6 التطبيقs: Industrial Automation and Control, Industrial Networking Gateways, High-Speed Data Acquisition, Communications Signal Processing, Test and Measurement Instruments, Embedded Consumer and Communication Products.
Industrial Automation and Control
EP3C16U484C6 fits compact industrial controllers that coordinate sensors, motion-control logic, interlocks, and communications. Its 15,408 logic elements can implement state machines and control algorithms, while 346 I/O provide substantial parallel connectivity for encoders, discrete inputs, actuators, and field-bus bridges. The verified -40°C to +125°C operating range supports deployment across industrial temperature conditions. The 516,096 embedded-memory bits can hold buffer descriptors, sequence tables, or local protocol state without requiring external memory for modest workloads. Designers should preserve the manufacturer-specified power and ground planes in the 484-FBGA layout and validate timing against the required control-loop latency.
موصى به
Industrial Networking Gateways
The EP3C16U484C6 can serve as the programmable fabric inside protocol-conversion and industrial-networking equipment. Its 346 I/O support connections to Ethernet PHYs, serial transceivers, memory, status indicators, and service interfaces, while the embedded-memory capacity provides useful packet buffering and descriptor storage. Compared with a small microcontroller, the FPGA fabric allows parallel packet inspection, custom framing, and hardware-assisted filtering. Its industrial temperature range is suitable for factory-floor equipment. A practical design should use the manufacturer’s Cyclone III high-speed layout guidance for transceiver interfaces and confirm the required clock rate, because the supplied verified excerpts do not publish a numerical maximum frequency.
موصى به
High-Speed Data Acquisition
EP3C16U484C6 is suitable for data-acquisition front ends that must capture parallel converter output and perform real-time filtering or channel multiplexing. The 15,408 logic elements can implement parallel-to-serial conversion, digital filtering, trigger logic, and interface formatting, while 346 I/O accommodate converters, counters, and acquisition-control signals. The 516,096 embedded-memory bits can provide acquisition windows or intermediate sample storage when external memory is unnecessary. Using the -40°C to +125°C grade can support industrial measurement systems. Designers must verify converter timing, clock-jitter tolerance, input voltage standards, and the Cyclone III I/O implementation before schematic release.
موصى به
Communications Signal Processing
EP3C16U484C6 supports programmable communications equipment requiring parallel datapaths, digital filtering, and multiple physical interfaces. Its 15,408 logic elements can be partitioned among modulation, symbol processing, framing, error detection, and control functions, while 516,096 embedded-memory bits accommodate short buffers and working state. The 346-I/O count permits simultaneous access to transceivers, configuration memory, status buses, and diagnostics. For industrial or telecommunications-adjacent equipment, the verified -40°C to +125°C range is valuable. The design must nevertheless establish achievable throughput from the actual clock and I/O timing data rather than inferring performance from the logic-element count alone.
موصى به
Test and Measurement Instruments
EP3C16U484C6 can implement the digital control, sequencing, and data-processing core of programmable test equipment. Programmable logic can coordinate stimulus patterns, analyze captured data, generate timing sequences, and interface with instruments through parallel or serial buses. Its 15,408 logic elements and 516,096 embedded-memory bits are useful for parallel algorithms and intermediate buffers without requiring a large external memory subsystem. The -40°C to +125°C grade allows operation in temperature-controlled industrial test environments. Designers should evaluate acquisition bandwidth, I/O standards, clocking resources, and pin assignments against the exact Cyclone III documentation before selecting the device for a high-performance instrument.
موصى به
Embedded Consumer and Communication Products
EP3C16U484C6 is suitable for programmable embedded products that require extensive parallel I/O, such as display controllers, media-processing modules, protocol engines, and multifunction peripherals. The 346 I/O can connect memory, converters, control interfaces, and external peripherals, while the embedded-memory resources support control tables, frame descriptors, and protocol state. The 484-FBGA package limits board area but requires careful escape routing, solid thermal design, and adherence to the manufacturer’s ball-assignment documentation. For commercial products, engineers should verify RoHS, REACH, halogen-free, and conflict-minerals declarations directly because those compliance values are not present in the supplied verified excerpts.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C16U484C6 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C16F484C6N | EP3C16F484C8N | EP3C16U484C6N | EP3C16F484C6 | EP3C16U484C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Device Configuration | U-series, C6 suffix | F-series, C6 suffix | F-series, C8 suffix | U-series, C6 suffix | F-series, C6 suffix | U-series, C8 suffix |
أبرز الفروقات
- Verified U-series resource configuration (مقابلEP3C16F484C6N)
- Exact C6 ordering configuration (مقابلEP3C16F484C8N)
- High I/O connectivity in a compact package (مقابلEP3C16U484C6N)
ملاحظات التصميم
The 484-FBGA footprint requires a multilayer PCB with uninterrupted power and ground planes, short escape routes, and placement of decoupling capacitors close to the relevant supply balls. Use the official package drawing and Cyclone III power-supply recommendations rather than inferring connectivity from distributor excerpts. Confirm ball assignments, voltage domains, configuration pins, and I/O standards before releasing the layout because the supplied web data does not contain the complete 484-ball map.
Route high-speed clocks and I/O as short, properly terminated transmission paths, with return paths available through a continuous reference plane. The 346 available I/O make differential and parallel interfaces practical, but routing effectiveness depends on the selected standards, trace impedance, and adjacent-ball assignments. Review the Cyclone III high-speed design guidance for clock skew, series termination, on-chip-die termination, and simultaneous-switching-noise limits before component placement.
Do not select core and I/O power rails or estimate dissipation from the supplied distributor excerpts because those values are absent. Obtain the official Cyclone III electrical-characteristics documentation, then calculate worst-case dynamic, static, and I/O power at the intended clock and activity level. Validate the result against the package thermal limits and board copper. The verified -40°C to +125°C operating range describes environmental capability, not permissible power dissipation or automatic adequacy of a particular board design.
Do not treat a shared EP3C16 and 484-FBGA naming convention as proof of automatic interchangeability. The F, U, C6, C8, and N suffixes can represent differences in embedded resources, speed grade, temperature positioning, or ordering status. Before substituting any alternative, compare the complete ball map, power-up behavior, configuration method, I/O standards, memory capability, timing limits, and Quartus-compatible device file. A redesign or PCB change may be necessary if any of those items differ.
معلومات الامتثال
Lead-free construction is verified by the ChipDig specification excerpt. Explicit RoHS, REACH, halogen-free, and conflict-minerals declarations for EP3C16U484C6 were not included in the supplied verified data. AEC-Q100 is not applicable because the part is an FPGA rather than an automotive-qualified discrete semiconductor.
