EP3C5M164I7N - Cyclone III FPGA 5136 LE 164-MBGA | Intel
MPN: EP3C5M164I7N ✓ نشطEP3C5M164I7N نظرة عامة
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic IC that lets engineers implement arbitrary logic, DSP, and memory subsystems by configuring an array of configurable logic blocks (CLBs) connected through a programmable interconnect fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors. They are distinct from ASICs because they are not mask-programmed: configuration is loaded from external flash at power-up, enabling fast prototyping and field updates. Cyclone III belongs to Intel's (formerly Altera's) low-cost, low-power FPGA family targeting cost-sensitive volume applications rather than high-performance transceivers.
Key differentiating features include the Cyclone III family's industry-leading low static and dynamic power for a 60 nm FPGA, 4-Mbit embedded memory blocks for buffer/RAM-intensive designs, dedicated hardware multipliers that accelerate DSP operations up to 18x18, and a flexible I/O bank structure supporting LVDS, SSTL, HSTL, and LVCMOS standards. The M164 Micro BGA footprint reduces board area versus TQFP packages while still enabling low-cost PCB fabrication with 0.5 mm pitch.
Architecturally, the device arranges logic elements into LABs (Logic Array Blocks), each containing 16 LEs, with M9K memory blocks distributed throughout the fabric. The configuration controller supports passive serial (PS), fast passive parallel (FPP), and active serial (AS) modes via industry-standard EPCS configuration devices. Periphery includes four general-purpose PLLs with spread-spectrum clocking, and each I/O bank has its own VREF pins for reference-voltage-based standards.
Typical applications include industrial motor control and machine vision, low-cost video processing and display controllers, consumer electronics glue logic, and telecom line-card interface bridges. The Cyclone III is also widely used in education and prototyping kits (such as the Altera/Intel DE0-Nano family) because of its favorable price-per-logic-element ratio.
When designing with the EP3C5M164I7N, ensure your Quartus II project sets the correct device package (M164) and speed grade (7) so timing analysis is accurate, and provide a low-noise 1.2 V core supply with bulk decoupling near each VCCINT pin. For multi-bank I/O standards, segregate SSTL/HSTL banks from LVCMOS banks using separate VCCIO rails to avoid contention.
This page consolidates Cyclone III family datasheet parameters, drop-in 164-MBGA alternatives, and design notes that go beyond the standard manufacturer datasheet to help engineers select and qualify the part quickly.
بدائل مباشرة لـ EP3C5M164I7N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C5M164I7N (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Embedded Memory, Total Memory Bits, PLLs.
EP3C5M164C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C5M164I8N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C10M164I7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C5M164I7
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C5M164C8N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C5M164I7N الحدود القصوى والخصائص الكهربائية
| Logic Elements (LE) | 5136 |
| Embedded Memory | 423936 bits (approx. 414 Kbit) |
| Embedded Multipliers | 23 x 18x18 |
| User I/O Pins | 106 |
| العلبة | 164-TFBGA (Micro BGA, M164, 8x8 mm) |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | 7 |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Process Technology | 60 nm TSMC low-k |
| PLLs | 2 |
| نوع التركيب | Surface Mount |
| Ball Pitch | 0.5 mm |
| Configuration Modes | PS, FPP, AS |
| External Memory Support | DDR, DDR2, SDR, QDRII+ SRAM |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS |
| حالة RoHS | Compliant |
| درجة حرارة الوصلة التشغيلية | -40C to +100C |
دليل تكوين أطراف EP3C5M164I7N 164-tfbga (micro bga, m164, 8x8 mm)
تكوين الأطراف لـ EP3C5M164I7N (حزمة 164-tfbga (micro bga, m164, 8x8 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C5M164I7N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C5M164I7N مناسب لـ 6 التطبيقs: Industrial Motor Control, Machine Vision and Video Processing, Telecom Line-Card Interface Bridge, Consumer Electronics Glue Logic, Education and FPGA Prototyping Kits, Portable Medical Instrumentation.
Industrial Motor Control
The EP3C5M164I7N fits industrial motor control because its 5,136 logic elements and 23 embedded 18x18 multipliers can implement field-oriented control (FOC) and PID loops in hardware, while 106 user I/O pins interface with encoders, Hall sensors, and PWM gate drivers. The 1.2 V core keeps dynamic power low, and the industrial temperature grade (-40C to +100C junction) supports harsh factory floors. In a typical design, the FPGA generates complementary PWM with dead-time insertion and reads quadrature encoder signals through LVDS or LVCMOS I/O banks. Unlike a microcontroller, it can run multiple control loops in parallel with deterministic nanosecond timing, but it requires external ADC and gate-driver ICs, adding BOM cost and board area.
موصى به
Machine Vision and Video Processing
The EP3C5M164I7N suits low-cost machine vision and video processing because its 423,936 bits of embedded RAM buffer image lines, and the 23 hardware multipliers accelerate convolution and edge-detection filters. The 106 I/O pins can connect to CMOS image sensors and LCD panels, while dedicated DQS pins support DDR2 frame buffers. In a typical pipeline, the FPGA captures parallel video data, applies 3x3 Sobel or Gaussian kernels, and outputs to a display controller. The trade-off versus a dedicated ISP or GPU is lower throughput and limited memory bandwidth, but the FPGA offers deterministic latency and lower power for embedded vision at moderate resolutions such as 720p.
موصى به
Telecom Line-Card Interface Bridge
The EP3C5M164I7N is used as a telecom line-card interface bridge because its flexible I/O banks support LVDS, SSTL, and HSTL standards needed to interface with backplane transceivers and framers. The 5,136 logic elements implement protocol conversion, FIFO buffering, and clock-domain crossing, while the 2 PLLs generate and clean up line-rate clocks. In a typical line card, the FPGA bridges a parallel telecom bus to a serial backplane link and manages status registers. The limitation is that Cyclone III lacks high-speed SerDes, so multi-gigabit serial links require external SERDES devices, increasing component count compared with Cyclone IV GX or Arria families.
موصى به
Consumer Electronics Glue Logic
The EP3C5M164I7N serves as programmable glue logic in consumer electronics because it replaces multiple discrete logic ICs with a single reconfigurable device, reducing board area and BOM count. Its 106 I/O pins handle level shifting, bus arbitration, and peripheral expansion, while the 1.2 V core and 60 nm process keep power low enough for bus-powered devices. In a typical design, the FPGA interfaces a main SoC to sensors, buttons, and LEDs, and can be reprogrammed in the field to fix bugs or add features. The trade-off is higher unit cost than fixed-function logic and the need for configuration flash, but flexibility and faster time-to-market often justify it.
موصى به
Education and FPGA Prototyping Kits
The EP3C5M164I7N is widely used in education and prototyping because its 5,136 logic elements are large enough for teaching digital design, CPU cores, and DSP labs, yet small enough to fit low-cost boards. The 164-MBGA package with 0.5 mm pitch is challenging for hand soldering but standard for machine-assembled development kits such as the DE0-Nano family. Students can implement soft processors like Nios II, experiment with PLL clocking, and interface to external SRAM or sensors. The main limitation is the BGA package, which requires reflow soldering and makes breadboard prototyping impractical without a carrier board.
موصى به
Portable Medical Instrumentation
The EP3C5M164I7N fits portable medical instrumentation because its low 1.2 V core power extends battery life, and its 23 multipliers accelerate filtering and FFT for ECG, ultrasound, and pulse-oximetry signal chains. The 106 I/O pins interface with ADCs, DACs, and display modules, while the industrial temperature grade supports clinical environments. In a typical design, the FPGA acquires sampled data, applies digital filters, and drives a small LCD. The trade-off versus a dedicated medical AFE plus MCU is higher development effort and the need for rigorous verification, but the FPGA provides deterministic real-time processing and can be updated without hardware changes.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C5M164I7N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C5M164C7N | EP3C5M164I8N | EP3C10M164I7N | EP3C5M164I7 |
|---|---|---|---|---|---|
| Package | 164-TFBGA (M164) | 164-TFBGA (M164) - same | 164-TFBGA (M164) - same | 164-TFBGA (M164) - same | 164-TFBGA (M164) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 5136 | 5136 | 5136 | 10320 | 5136 |
| Embedded Memory | 423936 bits | 423936 bits | 423936 bits | 423936 bits | 423936 bits |
| User I/O Pins | 106 | 106 | 106 | 106 | 106 |
| Speed Grade | 7 | 7 | 8 | 7 | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Non-compliant (leaded) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
أبرز الفروقات
- Industrial temperature grade in same footprint (مقابلEP3C5M164C7N)
- Speed grade 7 timing performance (مقابلEP3C5M164I8N)
- Lower cost and power at 5K LE density (مقابلEP3C10M164I7N)
- RoHS-compliant lead-free construction (مقابلEP3C5M164I7)
ملاحظات التصميم
Provide a clean 1.2 V core supply (VCCINT) with at least 100 uF bulk capacitance and 0.1 uF decoupling per VCCINT ball. Cyclone III devices are sensitive to core voltage ripple; keep ripple below 50 mV peak-to-peak to avoid timing violations. Use separate VCCIO rails per I/O bank when mixing SSTL/HSTL and LVCMOS standards to prevent contention. Estimated: at 1.2 V and typical 100 mA core current, core power is about 120 mW, but dynamic power scales with clock frequency and toggle rate.
The 164-ball Micro BGA (M164) has 0.5 mm ball pitch, requiring via-in-pad or dog-bone fanout with 0.1 mm trace/space design rules. Use at least a 4-layer stackup with a solid ground plane directly under the device to control impedance and thermal spreading. Place configuration flash (EPCS device) close to the FPGA to minimize configuration trace length and signal integrity issues. Follow Intel's Cyclone III board design guidelines for decoupling and layer stackup.
Ensure the Quartus II project device setting matches M164 package and speed grade 7; a mismatch causes incorrect timing analysis and potential field failures. Do not leave unused I/O pins floating - configure them as tri-stated with weak pull-up or as outputs driving low per Intel recommendations. Verify that the configuration scheme (PS, FPP, or AS) matches the board's flash and control signals, and always include a JTAG header for debugging and in-system programming.
معلومات الامتثال
RoHS compliance indicated by the N suffix in the part number. REACH, halogen-free, and conflict-minerals status not stated in the provided data.
