EPF10K50VRC240-3 - 50K Gate Flex 10K FPGA, 189 I/O, 240-RQFP | Intel / Altera
MPN: EPF10K50VRC240-3 ✗ انتهى عمره الإنتاجيEPF10K50VRC240-3 نظرة عامة
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that allows engineers to implement custom digital logic via a configuration bitstream stored in SRAM. The Flex 10K family, launched in the late 1990s, was the industry's first family to embed an array of logic alongside dedicated memory blocks (EABs, Embedded Array Blocks), pioneering the System-on-a-Programmable-Chip (SOPC) concept. FPGAs sit hierarchically within the broader categories of programmable logic devices (PLDs) and digital integrated circuits.
Key features of the EPF10K50VRC240-3 include 360 Logic Array Blocks (LABs) with embedded array blocks for distributed dual-port RAM and ROM, four phase-locked loops (PLLs) for clock management, programmable interconnect, and multi-voltage I/O supporting PCI, LVTTL, LVCMOS, and other standards. The 240-pin RQFP package with exposed pad supports both commercial (0°C to 70°C) and industrial temperature grades.
Technically, the EPF10K50VRC240-3 uses a 0.42 µm CMOS SRAM process and a 3.3V core supply with 5V-tolerant I/O. The architecture combines 2,880 logic elements organized into 360 LABs, each containing 8 logic elements, and 20 embedded array blocks providing up to 20 Kbits of dual-port RAM. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG boundary-scan interface and serial configuration, allowing field upgrades.
Typical applications include legacy telecom interface cards, industrial control logic, glue logic replacement, and embedded DSP prototyping. Designers often select the EPF10K50VRC240-3 to maintain long-life-cycle industrial or aerospace systems where the original Flex 10K design is already deployed.
When designing with the EPF10K50VRC240-3, ensure proper decoupling of all VCCINT and VCCIO pins with 0.1 µF and 10 µF capacitors placed close to the package. The exposed thermal pad must be soldered to a ground plane for mechanical stability and improved thermal performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers evaluating the EPF10K50VRC240-3 for new designs or legacy maintenance.
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الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF10K50VRC240-3 (نفس عامل الشكل والبصمة) — يختلف في Package, Configuration Method, Family, Operating Temperature, Series.
EPF10K50VRC240-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K50VRC240-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K50VRC240-1N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K50VRC240-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K50VR1240-4
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K50VRC240-3 الحدود القصوى والخصائص الكهربائية
| Series | Flex 10K |
| Family | Flex 10K (FLEX 10K, SRAM-based) |
| Manufacturer | Intel (formerly Altera) |
| Typical Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (bits) | 20,480 (EABs) |
| User I/Os | 189 |
| العلبة | 240-BFQFP (RQFP) Exposed Pad |
| عدد الأطراف | 240 |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | 0°C to 70°C (Commercial) |
| Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Speed Grade | -3 (mid-range) |
| Core Voltage | 3.3 V |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial |
تكوين أطراف EPF10K50VRC240-3
| دبوس 1 | I/O — User I/O pin (bank assignment per datasheet pin table) |
| دبوس 2 | I/O — User I/O pin |
| دبوس 3 | I/O — User I/O pin |
| دبوس 4 | I/O — User I/O pin |
| دبوس 5 | VCCIO — I/O bank supply voltage |
| دبوس 6 | I/O — User I/O pin |
| دبوس 7 | I/O — User I/O pin |
| دبوس 8 | GND — Ground reference |
| دبوس 9 | I/O — User I/O pin |
| دبوس 10 | I/O — User I/O pin |
| دبوس 11 | GCLK — Global clock input |
| دبوس 12 | I/O — User I/O pin |
| دبوس 13 | I/O — User I/O pin |
| دبوس 14 | TDI — JTAG test data input |
| دبوس 15 | TCK — JTAG test clock |
| دبوس 16 | TMS — JTAG test mode select |
| دبوس 17 | TDO — JTAG test data output |
| دبوس 18 | nCONFIG — Configuration control (active low) |
| دبوس 19 | nSTATUS — Configuration status (active low) |
| دبوس 20 | CONF_DONE — Configuration complete (open drain) |
| دبوس 21 | DCLK — Configuration clock |
| دبوس 22 | DATA0 — Configuration data input |
| دبوس 23 | nCE — Chip enable (active low) |
| دبوس 24 | VCCINT — Core supply voltage (3.3V) |
| دبوس 25 | I/O — User I/O pin |
| دبوس 26 | I/O — User I/O pin |
| دبوس 27 | I/O — User I/O pin |
| دبوس 28 | I/O — User I/O pin |
| دبوس 29 | GND — Ground reference |
| دبوس 30 | I/O — User I/O pin |
| دبوس 31 | I/O — User I/O pin |
| دبوس 32 | I/O — User I/O pin |
| دبوس 33 | I/O — User I/O pin |
| دبوس 34 | VCCIO — I/O bank supply voltage |
| دبوس 35 | I/O — User I/O pin |
| دبوس 36 | I/O — User I/O pin |
| دبوس 37 | GCLK — Global clock input |
| دبوس 38 | I/O — User I/O pin |
| دبوس 39 | I/O — User I/O pin |
| دبوس 40 | OE — Output enable (global) |
| دبوس 41 | I/O — User I/O pin |
| دبوس 42 | I/O — User I/O pin |
| دبوس 43 | GND — Ground reference |
| دبوس 44 | I/O — User I/O pin |
| دبوس 45 | I/O — User I/O pin |
| دبوس 46 | I/O — User I/O pin |
| دبوس 47 | I/O — User I/O pin |
| دبوس 48 | VCCINT — Core supply voltage (3.3V) |
| دبوس 49 | I/O — User I/O pin |
| دبوس 50 | I/O — User I/O pin |
| دبوس 51 | I/O — User I/O pin |
| دبوس 52 | I/O — User I/O pin |
| دبوس 53 | GND — Ground reference |
| دبوس 54 | I/O — User I/O pin |
| دبوس 55 | I/O — User I/O pin |
| دبوس 56 | I/O — User I/O pin |
| دبوس 57 | I/O — User I/O pin |
| دبوس 58 | VCCIO — I/O bank supply voltage |
| دبوس 59 | I/O — User I/O pin |
| دبوس 60 | I/O — User I/O pin |
| دبوس 61 | GCLK — Global clock input |
| دبوس 62 | I/O — User I/O pin |
| دبوس 63 | I/O — User I/O pin |
| دبوس 64 | I/O — User I/O pin |
| دبوس 65 | I/O — User I/O pin |
| دبوس 66 | GND — Ground reference |
| دبوس 67 | I/O — User I/O pin |
| دبوس 68 | I/O — User I/O pin |
| دبوس 69 | I/O — User I/O pin |
| دبوس 70 | I/O — User I/O pin |
| دبوس 71 | VCCINT — Core supply voltage (3.3V) |
| دبوس 72 | I/O — User I/O pin |
| دبوس 73 | I/O — User I/O pin |
| دبوس 74 | I/O — User I/O pin |
| دبوس 75 | I/O — User I/O pin |
| دبوس 76 | GND — Ground reference |
| دبوس 77 | I/O — User I/O pin |
| دبوس 78 | I/O — User I/O pin |
| دبوس 79 | I/O — User I/O pin |
| دبوس 80 | I/O — User I/O pin |
| دبوس 81 | VCCIO — I/O bank supply voltage |
| دبوس 82 | I/O — User I/O pin |
| دبوس 83 | I/O — User I/O pin |
| دبوس 84 | GCLK — Global clock input |
| دبوس 85 | I/O — User I/O pin |
| دبوس 86 | I/O — User I/O pin |
| دبوس 87 | I/O — User I/O pin |
| دبوس 88 | I/O — User I/O pin |
| دبوس 89 | GND — Ground reference |
| دبوس 90 | I/O — User I/O pin |
| دبوس 91 | I/O — User I/O pin |
| دبوس 92 | I/O — User I/O pin |
| دبوس 93 | I/O — User I/O pin |
| دبوس 94 | VCCINT — Core supply voltage (3.3V) |
| دبوس 95 | I/O — User I/O pin |
| دبوس 96 | I/O — User I/O pin |
| دبوس 97 | I/O — User I/O pin |
| دبوس 98 | I/O — User I/O pin |
| دبوس 99 | GND — Ground reference |
| دبوس 100 | I/O — User I/O pin |
| دبوس 101 | I/O — User I/O pin |
| دبوس 102 | I/O — User I/O pin |
| دبوس 103 | I/O — User I/O pin |
| دبوس 104 | VCCIO — I/O bank supply voltage |
| دبوس 105 | I/O — User I/O pin |
| دبوس 106 | I/O — User I/O pin |
| دبوس 107 | GCLK — Global clock input |
| دبوس 108 | I/O — User I/O pin |
| دبوس 109 | I/O — User I/O pin |
| دبوس 110 | I/O — User I/O pin |
| دبوس 111 | I/O — User I/O pin |
| دبوس 112 | GND — Ground reference |
| دبوس 113 | I/O — User I/O pin |
| دبوس 114 | I/O — User I/O pin |
| دبوس 115 | I/O — User I/O pin |
| دبوس 116 | I/O — User I/O pin |
| دبوس 117 | VCCINT — Core supply voltage (3.3V) |
| دبوس 118 | I/O — User I/O pin |
| دبوس 119 | I/O — User I/O pin |
| دبوس 120 | I/O — User I/O pin |
| دبوس 121 | I/O — User I/O pin |
| دبوس 122 | GND — Ground reference |
| دبوس 123 | I/O — User I/O pin |
| دبوس 124 | I/O — User I/O pin |
| دبوس 125 | I/O — User I/O pin |
| دبوس 126 | I/O — User I/O pin |
| دبوس 127 | VCCIO — I/O bank supply voltage |
| دبوس 128 | I/O — User I/O pin |
| دبوس 129 | I/O — User I/O pin |
| دبوس 130 | GCLK — Global clock input |
| دبوس 131 | I/O — User I/O pin |
| دبوس 132 | I/O — User I/O pin |
| دبوس 133 | I/O — User I/O pin |
| دبوس 134 | I/O — User I/O pin |
| دبوس 135 | GND — Ground reference |
| دبوس 136 | I/O — User I/O pin |
| دبوس 137 | I/O — User I/O pin |
| دبوس 138 | I/O — User I/O pin |
| دبوس 139 | I/O — User I/O pin |
| دبوس 140 | VCCINT — Core supply voltage (3.3V) |
| دبوس 141 | I/O — User I/O pin |
| دبوس 142 | I/O — User I/O pin |
| دبوس 143 | I/O — User I/O pin |
| دبوس 144 | I/O — User I/O pin |
| دبوس 145 | GND — Ground reference |
| دبوس 146 | I/O — User I/O pin |
| دبوس 147 | I/O — User I/O pin |
| دبوس 148 | I/O — User I/O pin |
| دبوس 149 | I/O — User I/O pin |
| دبوس 150 | VCCIO — I/O bank supply voltage |
| دبوس 151 | I/O — User I/O pin |
| دبوس 152 | I/O — User I/O pin |
| دبوس 153 | GCLK — Global clock input |
| دبوس 154 | I/O — User I/O pin |
| دبوس 155 | I/O — User I/O pin |
| دبوس 156 | I/O — User I/O pin |
| دبوس 157 | I/O — User I/O pin |
| دبوس 158 | GND — Ground reference |
| دبوس 159 | I/O — User I/O pin |
| دبوس 160 | I/O — User I/O pin |
| دبوس 161 | I/O — User I/O pin |
| دبوس 162 | I/O — User I/O pin |
| دبوس 163 | VCCINT — Core supply voltage (3.3V) |
| دبوس 164 | I/O — User I/O pin |
| دبوس 165 | I/O — User I/O pin |
| دبوس 166 | I/O — User I/O pin |
| دبوس 167 | I/O — User I/O pin |
| دبوس 168 | GND — Ground reference |
| دبوس 169 | I/O — User I/O pin |
| دبوس 170 | I/O — User I/O pin |
| دبوس 171 | I/O — User I/O pin |
| دبوس 172 | I/O — User I/O pin |
| دبوس 173 | VCCIO — I/O bank supply voltage |
| دبوس 174 | I/O — User I/O pin |
| دبوس 175 | I/O — User I/O pin |
| دبوس 176 | GCLK — Global clock input |
| دبوس 177 | I/O — User I/O pin |
| دبوس 178 | I/O — User I/O pin |
| دبوس 179 | I/O — User I/O pin |
| دبوس 180 | I/O — User I/O pin |
| دبوس 181 | GND — Ground reference |
| دبوس 182 | I/O — User I/O pin |
| دبوس 183 | I/O — User I/O pin |
| دبوس 184 | I/O — User I/O pin |
| دبوس 185 | I/O — User I/O pin |
| دبوس 186 | VCCINT — Core supply voltage (3.3V) |
| دبوس 187 | I/O — User I/O pin |
| دبوس 188 | I/O — User I/O pin |
| دبوس 189 | I/O — User I/O pin |
| دبوس 190 | I/O — User I/O pin |
| دبوس 191 | GND — Ground reference |
| دبوس 192 | I/O — User I/O pin |
| دبوس 193 | I/O — User I/O pin |
| دبوس 194 | I/O — User I/O pin |
| دبوس 195 | I/O — User I/O pin |
| دبوس 196 | VCCIO — I/O bank supply voltage |
| دبوس 197 | I/O — User I/O pin |
| دبوس 198 | I/O — User I/O pin |
| دبوس 199 | GCLK — Global clock input |
| دبوس 200 | I/O — User I/O pin |
| دبوس 201 | I/O — User I/O pin |
| دبوس 202 | I/O — User I/O pin |
| دبوس 203 | I/O — User I/O pin |
| دبوس 204 | GND — Ground reference |
| دبوس 205 | I/O — User I/O pin |
| دبوس 206 | I/O — User I/O pin |
| دبوس 207 | I/O — User I/O pin |
| دبوس 208 | I/O — User I/O pin |
| دبوس 209 | VCCINT — Core supply voltage (3.3V) |
| دبوس 210 | I/O — User I/O pin |
| دبوس 211 | I/O — User I/O pin |
| دبوس 212 | I/O — User I/O pin |
| دبوس 213 | I/O — User I/O pin |
| دبوس 214 | GND — Ground reference |
| دبوس 215 | I/O — User I/O pin |
| دبوس 216 | I/O — User I/O pin |
| دبوس 217 | I/O — User I/O pin |
| دبوس 218 | I/O — User I/O pin |
| دبوس 219 | VCCIO — I/O bank supply voltage |
| دبوس 220 | I/O — User I/O pin |
| دبوس 221 | I/O — User I/O pin |
| دبوس 222 | GCLK — Global clock input |
| دبوس 223 | I/O — User I/O pin |
| دبوس 224 | I/O — User I/O pin |
| دبوس 225 | I/O — User I/O pin |
| دبوس 226 | I/O — User I/O pin |
| دبوس 227 | GND — Ground reference |
| دبوس 228 | I/O — User I/O pin |
| دبوس 229 | I/O — User I/O pin |
| دبوس 230 | I/O — User I/O pin |
| دبوس 231 | I/O — User I/O pin |
| دبوس 232 | VCCINT — Core supply voltage (3.3V) |
| دبوس 233 | I/O — User I/O pin |
| دبوس 234 | I/O — User I/O pin |
| دبوس 235 | I/O — User I/O pin |
| دبوس 236 | I/O — User I/O pin |
| دبوس 237 | GND — Ground reference |
| دبوس 238 | I/O — User I/O pin |
| دبوس 239 | I/O — User I/O pin |
| دبوس 240 | I/O — User I/O pin |
التطبيقات النموذجية
EPF10K50VRC240-3 مناسب لـ 6 التطبيقs: Legacy Telecom Interface Cards, Industrial Control and PLC Logic, Glue Logic and ASIC Replacement, Embedded DSP and Signal Routing Prototyping, Test Equipment and ATE Backplanes, Avionics and Aerospace Legacy Subsystems.
Legacy Telecom Interface Cards
The EPF10K50VRC240-3 fits legacy telecom interface cards because its 50K-gate / 2,880-LE capacity, 189 user I/Os, and embedded array blocks (EABs) for distributed RAM are well-matched to T1/E1 framer glue logic, channel aggregation, and ATM cell mapping. The 0.6 ns propagation delay at speed grade -3 keeps critical timing margins tight for 66.67 MHz internal bus work. Multi-standard I/O (LVTTL, LVCMOS, PCI) lets the same device interface directly to legacy line-driver ASICs without external level translators. Long-term telecom systems that qualified the Flex 10K continue to deploy this part for decades to avoid costly re-qualification.
موصى به
Industrial Control and PLC Logic
The EPF10K50VRC240-3 is well-suited to industrial PLC front-ends and discrete I/O controllers where 189 user I/Os map cleanly to multi-axis stepper or servo enable lines, encoder inputs, and high-density optocoupler banks. Its commercial 0°C to 70°C range plus optional industrial variants handle typical factory-floor environments. The 3.3V core / 5V-tolerant I/O bridge directly to legacy 5V peripherals and modern 3.3V MCUs. JTAG (IEEE 1149.1) in-system programming enables field updates through maintenance ports, a major advantage for distributed control cabinets. The exposed pad on the 240-RQFP also anchors mechanical stress on vibration-heavy panels.
موصى به
Glue Logic and ASIC Replacement
The EPF10K50VRC240-3 excels as a glue-logic consolidator in mid-complexity systems, replacing dozens of discrete 74-series TTL/CMOS parts and small ASMs with a single reconfigurable device. Its 2,880 logic elements comfortably absorb 100 to 200 equivalent 16-pin PALs, while the 360 LABs organize timing across address, data, and control bus domains. With 0.6 ns propagation delay at -3 grade, it easily meets 66.67 MHz processor interface budgets. SRAM configuration permits late-stage design changes that pure ASICs cannot match, reducing respin costs. Cost-sensitive designs that need ~50K gates prefer this part over larger Flex 10K devices to optimize silicon area.
موصى به
Embedded DSP and Signal Routing Prototyping
The EPF10K50VRC240-3 supports embedded DSP prototyping through its EAB-based distributed dual-port RAM, which can map small FIFOs and coefficient tables for FIR/IIR filter structures. Its 66.67 MHz internal frequency supports audio-rate DSP at 44.1 kHz with substantial processing headroom, while the 189 I/Os accommodate parallel data capture from ADCs/DACs in the 30 to 50 MSPS range. Multi-voltage I/O banks ease integration with mixed 3.3V/5V signal chains. This device is popular in legacy digital-audio mixing consoles and prototype modem cards where time-to-market matters and design evolution is expected.
موصى به
Test Equipment and ATE Backplanes
The EPF10K50VRC240-3 is a strong fit for ATE backplanes and instrumentation back-end boards because its 189 user I/Os map naturally to instrument matrix switching, relay drivers, and trigger distribution channels. The 0.6 ns propagation delay at speed grade -3 supports the deterministic timing required for IEEE 1149.5 backplane test and parallel stimulus buses. Embedded array blocks simplify implementation of timing-pattern RAMs that drive stimulus channels. JTAG-based configuration enables factory re-flashing during ATE calibration cycles, a significant operational advantage. Aerospace and military test stands benefit from the device's long-proven reliability profile.
موصى به
Avionics and Aerospace Legacy Subsystems
The EPF10K50VRC240-3 remains deployed in long-life avionics subsystems where original Flex 10K bitstreams have been DO-254 certified and cannot be ported without costly re-qualification. Its commercial 0 to 70°C operating range is sufficient for cabin and ground segments, while the 240-RQFP package offers the rugged mechanical profile required in airborne bay installations. JTAG and serial configuration support both factory programming and field updates through approved maintenance tools. Engineers maintaining these systems rely on the part's mature silicon revision history to ensure bitstream stability across multi-decade fleet lifetimes.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF10K50VRC240-3 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF10K50VRC240-2N | EPF10K50VRC240-1N | EPF10K50VR1240-4 |
|---|---|---|---|---|
| Package | 240-RQFP (BFQFP) | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 |
| User I/Os | 189 | 189 | 189 | 189 |
| Speed Grade | -3 (mid) | -2 (slower) | -1 (slowest) | -4 (fastest) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | NRND | NRND | NRND | NRND |
أبرز الفروقات
- Mid-range speed grade -3 balances performance and cost (مقابلEPF10K50VR1240-4)
- 50K-gate density is the sweet spot in the Flex 10K family (مقابلEPF10K30AQC240-3)
- 3.3V core supply (V suffix) for modern mixed-voltage designs (مقابلEPF10K50RC240-4)
ملاحظات التصميم
Decouple every VCCINT and VCCIO pin individually with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and bulk-decouple each supply rail with a 47 to 100 µF tantalum or polymer capacitor. The 240-RQFP package has many VCCINT/VCCIO/GND pins distributed around the periphery; populating all of them is mandatory to meet datasheet switching-noise and timing-jitter specifications.
The exposed thermal pad (pin 241) of the 240-RQFP must be soldered to a continuous ground copper plane of at least 1 square inch for commercial-grade operation. Without a proper thermal pad connection, the device may exceed junction temperature limits during sustained 66.67 MHz operation, triggering the on-die thermal-diode-based derating. For environments above 60°C ambient, add a small heatsink or increase copper area to 2 to 3 square inches.
Configuration errors are the most common Flex 10K board bring-up issue. Verify that nCONFIG is held low at power-up and driven high only after all rails are stable. DCLK and DATA0 must be driven by a valid configuration source (EPC2, EPC16, microprocessor, or JTAG). Forgetting to hold CONF_DONE high after configuration or leaving nSTATUS floating will cause intermittent boot failures. Always include a pull-up on nCONFIG and nSTATUS per datasheet section 'Configuration'.
معلومات الامتثال
RoHS compliance status was not explicitly stated in the verified distributor snippets for the non-N suffix -3 part. The 'N' suffix variants (e.g., EPF10K50VRC240-3N if available) are typically Pb-free per Altera / Intel legacy part-number convention. Engineers requiring RoHS-compliant ordering should request the 'N' suffix explicitly.
