Intel

EPF10K50VRC240-3 - 50K Gate Flex 10K FPGA, 189 I/O, 240-RQFP | Intel / Altera

Name: EPF10K50VRC240-3 - 50K Gate Flex 10K FPGA, 189 I/O, 240-RQFP | Intel / Altera
Brand: Intel
SKU: EPF10K50VRC240-3

MPN: EPF10K50VRC240-3 ✗ Akhir Hidup

3.3 V Vdss 240-BFQFP (RQFP) Exposed Pad Package 66.67 MHz Speed 20,480 (EABs) Memory

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MOQ: 1 |

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EPF10K50VRC240-3 Ringkasan

The Intel / Altera EPF10K50VRC240-3 is a member of the classic Flex 10K FPGA family, delivering 50,000 typical gates and 2,880 logic elements in a 240-pin RQFP (BFQFP with exposed pad) package. It is built on a SRAM-based CMOS process and provides 189 user I/Os, 20,480 bits of embedded memory, and supports an internal frequency up to 66.67 MHz with up to 125 MHz performance grades.

An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that allows engineers to implement custom digital logic via a configuration bitstream stored in SRAM. The Flex 10K family, launched in the late 1990s, was the industry's first family to embed an array of logic alongside dedicated memory blocks (EABs, Embedded Array Blocks), pioneering the System-on-a-Programmable-Chip (SOPC) concept. FPGAs sit hierarchically within the broader categories of programmable logic devices (PLDs) and digital integrated circuits.

Key features of the EPF10K50VRC240-3 include 360 Logic Array Blocks (LABs) with embedded array blocks for distributed dual-port RAM and ROM, four phase-locked loops (PLLs) for clock management, programmable interconnect, and multi-voltage I/O supporting PCI, LVTTL, LVCMOS, and other standards. The 240-pin RQFP package with exposed pad supports both commercial (0°C to 70°C) and industrial temperature grades.

Technically, the EPF10K50VRC240-3 uses a 0.42 µm CMOS SRAM process and a 3.3V core supply with 5V-tolerant I/O. The architecture combines 2,880 logic elements organized into 360 LABs, each containing 8 logic elements, and 20 embedded array blocks providing up to 20 Kbits of dual-port RAM. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG boundary-scan interface and serial configuration, allowing field upgrades.

Typical applications include legacy telecom interface cards, industrial control logic, glue logic replacement, and embedded DSP prototyping. Designers often select the EPF10K50VRC240-3 to maintain long-life-cycle industrial or aerospace systems where the original Flex 10K design is already deployed.

When designing with the EPF10K50VRC240-3, ensure proper decoupling of all VCCINT and VCCIO pins with 0.1 µF and 10 µF capacitors placed close to the package. The exposed thermal pad must be soldered to a ground plane for mechanical stability and improved thermal performance.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers evaluating the EPF10K50VRC240-3 for new designs or legacy maintenance.

Alternatif penggantian untuk EPF10K50VRC240-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF10K50VRC240-3 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Configuration Method, Family, Operating Temperature, Series.

EPF10K50VR1240-4

Altera

Package: 240-BFQFP Exposed Pad

Configuration Method: SRAM, JTAG (ByteBlaster/BitBlaster)

Family: FLEX 10K Embedded Programmable Logic Device