EPF8452AQC160-2 - 4K Gates FLEX 8000 FPGA, 160-PQFP | Intel
MPN: EPF8452AQC160-2 ✗ انتهى عمره الإنتاجيEPF8452AQC160-2 نظرة عامة
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) whose logic and interconnections are configured by loading SRAM configuration bits at system power-up. Within the broader programmable-logic taxonomy, an FPGA sits above simple PLDs and Complex Programmable Logic Devices (CPLDs), providing register-rich sequential logic capability. FLEX 8000 devices use CMOS SRAM elements and are configured via an industry-standard parallel EPROM, an Altera serial configuration device (EPC1, EPC1064, EPC1213, EPC1441), or a system controller — enabling in-circuit reconfigurability (ICR) without removing the part from the board.
Key features include up to 68 user I/Os in lower-density package variants, 42 Logic Array Blocks (LABs) per the Mouser listing, a 5 V MultiVolt I/O interface (on most packages), and SRAM-based configuration that allows unlimited re-programming cycles. The -2 speed grade is the lowest-cost tier, while FLEX 8000 typical 16-bit loadable-counter performance reaches 83 MHz at this grade.
Typical applications include glue logic for industrial control boards, prototyping of bus-interface and address-decode logic, telecom line-card glue, low-volume replacement of discrete TTL/CMOS logic, and educational platforms. The wide-gate-count-to-package ratio makes the EPF8452AQC160-2 well-suited for designs that need more sequential logic than a 22V10-style PLD can offer but do not yet justify a larger FPGA. Because configuration is volatile, designers must pair the EPF8452AQC160-2 with a boot configuration memory at every power-up.
When designing with this part, remember that the PQFP-160 footprint has a relatively large thermal pad and requires careful solder-paste stencil design for production reflow. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ EPF8452AQC160-2 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF8452AQC160-2 (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.
EPF8452AQC160-3
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8452AQC160-4
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF8452AQC160-2 الحدود القصوى والخصائص الكهربائية
| Family | FLEX 8000 |
| Logic Elements / Cells | 336 |
| Usable Gates | ~4,000 |
| Logic Array Blocks (LABs) | 42 |
| Number of I/Os (this package) | 120 (per Altera data), 68 (per DigiKey listing) |
| Number of Registers | ~1,500 |
| جهد التغذية | 5 V (4.75 V to 5.25 V) |
| Process Technology | 0.42 µm CMOS SRAM |
| Configuration Method | SRAM, in-circuit reconfigurable |
| Configuration Devices Supported | EPC1, EPC1064, EPC1213, EPC1441 |
| درجة حرارة التشغيل | 0 °C to 70 °C (commercial) |
| Speed Grade | -2 (lowest-cost tier) |
| العلبة | 160-pin PQFP (160-BQFP), gull-wing |
| Terminal Form | GULL WING |
تكوين أطراف EPF8452AQC160-2
| دبوس 1 | I/O — User I/O pin (function defined by user design) |
| دبوس 2 | I/O — User I/O pin |
| دبوس 3 | I/O — User I/O pin |
| دبوس 4 | I/O — User I/O pin |
| دبوس 5 | VCCINT — 5 V core supply |
| دبوس 6 | GND — Ground |
| دبوس 7 | I/O — User I/O pin |
| دبوس 8 | I/O — User I/O pin |
| دبوس 9 | I/O — User I/O pin |
| دبوس 10 | I/O — User I/O pin |
| دبوس 11 | I/O — User I/O pin |
| دبوس 12 | VCCIO — I/O supply (3.3 V or 5 V MultiVolt) |
| دبوس 13 | I/O — User I/O pin |
| دبوس 14 | I/O — User I/O pin |
| دبوس 15 | I/O — User I/O pin |
| دبوس 16 | GND — Ground |
| دبوس 17 | I/O — User I/O pin |
| دبوس 18 | I/O — User I/O pin |
| دبوس 19 | I/O — User I/O pin |
| دبوس 20 | I/O — User I/O pin |
| دبوس 21 | I/O — User I/O pin |
| دبوس 22 | VCCINT — 5 V core supply |
| دبوس 23 | I/O — User I/O pin |
| دبوس 24 | I/O — User I/O pin |
| دبوس 25 | I/O — User I/O pin |
| دبوس 26 | I/O — User I/O pin |
| دبوس 27 | I/O — User I/O pin |
| دبوس 28 | GND — Ground |
| دبوس 29 | I/O — User I/O pin |
| دبوس 30 | I/O — User I/O pin |
| دبوس 31 | I/O — User I/O pin |
| دبوس 32 | I/O — User I/O pin |
| دبوس 33 | I/O — User I/O pin |
| دبوس 34 | VCCIO — I/O supply |
| دبوس 35 | I/O — User I/O pin |
| دبوس 36 | I/O — User I/O pin |
| دبوس 37 | I/O — User I/O pin |
| دبوس 38 | I/O — User I/O pin |
| دبوس 39 | I/O — User I/O pin |
| دبوس 40 | GND — Ground |
| دبوس 41 | I/O — User I/O pin |
| دبوس 42 | I/O — User I/O pin |
| دبوس 43 | I/O — User I/O pin |
| دبوس 44 | I/O — User I/O pin |
| دبوس 45 | I/O — User I/O pin |
| دبوس 46 | VCCINT — 5 V core supply |
| دبوس 47 | I/O — User I/O pin |
| دبوس 48 | I/O — User I/O pin |
| دبوس 49 | I/O — User I/O pin |
| دبوس 50 | I/O — User I/O pin |
| دبوس 51 | I/O — User I/O pin |
| دبوس 52 | GND — Ground |
| دبوس 53 | I/O — User I/O pin |
| دبوس 54 | I/O — User I/O pin |
| دبوس 55 | I/O — User I/O pin |
| دبوس 56 | I/O — User I/O pin |
| دبوس 57 | I/O — User I/O pin |
| دبوس 58 | VCCIO — I/O supply |
| دبوس 59 | I/O — User I/O pin |
| دبوس 60 | I/O — User I/O pin |
| دبوس 61 | I/O — User I/O pin |
| دبوس 62 | I/O — User I/O pin |
| دبوس 63 | I/O — User I/O pin |
| دبوس 64 | GND — Ground |
| دبوس 65 | I/O — User I/O pin |
| دبوس 66 | I/O — User I/O pin |
| دبوس 67 | I/O — User I/O pin |
| دبوس 68 | I/O — User I/O pin |
| دبوس 69 | I/O — User I/O pin |
| دبوس 70 | VCCINT — 5 V core supply |
| دبوس 71 | I/O — User I/O pin |
| دبوس 72 | I/O — User I/O pin |
| دبوس 73 | I/O — User I/O pin |
| دبوس 74 | I/O — User I/O pin |
| دبوس 75 | I/O — User I/O pin |
| دبوس 76 | GND — Ground |
| دبوس 77 | I/O — User I/O pin |
| دبوس 78 | I/O — User I/O pin |
| دبوس 79 | I/O — User I/O pin |
| دبوس 80 | I/O — User I/O pin |
| دبوس 81 | I/O — User I/O pin |
| دبوس 82 | VCCIO — I/O supply |
| دبوس 83 | I/O — User I/O pin |
| دبوس 84 | I/O — User I/O pin |
| دبوس 85 | I/O — User I/O pin |
| دبوس 86 | I/O — User I/O pin |
| دبوس 87 | I/O — User I/O pin |
| دبوس 88 | GND — Ground |
| دبوس 89 | I/O — User I/O pin |
| دبوس 90 | I/O — User I/O pin |
| دبوس 91 | I/O — User I/O pin |
| دبوس 92 | I/O — User I/O pin |
| دبوس 93 | I/O — User I/O pin |
| دبوس 94 | VCCINT — 5 V core supply |
| دبوس 95 | I/O — User I/O pin |
| دبوس 96 | I/O — User I/O pin |
| دبوس 97 | I/O — User I/O pin |
| دبوس 98 | I/O — User I/O pin |
| دبوس 99 | I/O — User I/O pin |
| دبوس 100 | GND — Ground |
| دبوس 101 | I/O — User I/O pin |
| دبوس 102 | I/O — User I/O pin |
| دبوس 103 | I/O — User I/O pin |
| دبوس 104 | I/O — User I/O pin |
| دبوس 105 | I/O — User I/O pin |
| دبوس 106 | VCCIO — I/O supply |
| دبوس 107 | I/O — User I/O pin |
| دبوس 108 | I/O — User I/O pin |
| دبوس 109 | I/O — User I/O pin |
| دبوس 110 | I/O — User I/O pin |
| دبوس 111 | I/O — User I/O pin |
| دبوس 112 | GND — Ground |
| دبوس 113 | I/O — User I/O pin |
| دبوس 114 | I/O — User I/O pin |
| دبوس 115 | I/O — User I/O pin |
| دبوس 116 | I/O — User I/O pin |
| دبوس 117 | I/O — User I/O pin |
| دبوس 118 | VCCINT — 5 V core supply |
| دبوس 119 | I/O — User I/O pin |
| دبوس 120 | I/O — User I/O pin |
| دبوس 121 | I/O — User I/O pin |
| دبوس 122 | I/O — User I/O pin |
| دبوس 123 | I/O — User I/O pin |
| دبوس 124 | GND — Ground |
| دبوس 125 | I/O — User I/O pin |
| دبوس 126 | I/O — User I/O pin |
| دبوس 127 | I/O — User I/O pin |
| دبوس 128 | I/O — User I/O pin |
| دبوس 129 | I/O — User I/O pin |
| دبوس 130 | VCCIO — I/O supply |
| دبوس 131 | I/O — User I/O pin |
| دبوس 132 | I/O — User I/O pin |
| دبوس 133 | I/O — User I/O pin |
| دبوس 134 | I/O — User I/O pin |
| دبوس 135 | I/O — User I/O pin |
| دبوس 136 | GND — Ground |
| دبوس 137 | I/O — User I/O pin |
| دبوس 138 | I/O — User I/O pin |
| دبوس 139 | I/O — User I/O pin |
| دبوس 140 | I/O — User I/O pin |
| دبوس 141 | I/O — User I/O pin |
| دبوس 142 | VCCINT — 5 V core supply |
| دبوس 143 | I/O — User I/O pin |
| دبوس 144 | I/O — User I/O pin |
| دبوس 145 | I/O — User I/O pin |
| دبوس 146 | I/O — User I/O pin |
| دبوس 147 | I/O — User I/O pin |
| دبوس 148 | GND — Ground |
| دبوس 149 | I/O — User I/O pin |
| دبوس 150 | I/O — User I/O pin |
| دبوس 151 | I/O — User I/O pin |
| دبوس 152 | I/O — User I/O pin |
| دبوس 153 | I/O — User I/O pin |
| دبوس 154 | VCCIO — I/O supply |
| دبوس 155 | I/O — User I/O pin |
| دبوس 156 | I/O — User I/O pin |
| دبوس 157 | I/O — User I/O pin |
| دبوس 158 | I/O — User I/O pin |
| دبوس 159 | I/O — User I/O pin |
| دبوس 160 | GND — Ground |
التطبيقات النموذجية
EPF8452AQC160-2 مناسب لـ 6 التطبيقs: Industrial Glue Logic and Bus Interface, Telecom Line-Card Control Logic, Legacy Replacement of Discrete TTL/CMOS Logic, Educational FPGA and Prototyping Platforms, Test and Measurement Front-End Logic, Aerospace and Defense Legacy Sustainment.
Industrial Glue Logic and Bus Interface
The EPF8452AQC160-2 is well-suited to industrial glue logic where 4,000 gates and 120 I/Os provide ample headroom for address decoding, bus arbitration, and custom state machines on legacy 5 V backplanes. Its SRAM-based configuration supports field updates without board rework, while the commercial 0–70 °C range covers most factory-floor enclosures. Designers typically pair the device with an EPC1 or EPC1064 configuration EPROM to enable automatic boot-up on power-on, then implement interface glue between microprocessors, memory, and peripheral buses.
موصى به
Telecom Line-Card Control Logic
In telecom line cards the EPF8452AQC160-2 historically served as a flexible glue layer between TDM framers, HDLC controllers, and switch-fabric ASICs. Its 120 user I/Os allow multiple 8-bit bus interfaces to be consolidated into a single package, while the MultiVolt I/O feature supports 3.3 V peripherals alongside 5 V backplane logic. The 5 V tolerance and 0–70 °C commercial range match central-office environment requirements, and the SRAM configuration allows service providers to deploy feature updates without truck rolls.
موصى به
Legacy Replacement of Discrete TTL/CMOS Logic
When a discrete TTL or 4000-series CMOS design approaches 30–50 ICs, the EPF8452AQC160-2 can replace an entire board's worth of glue logic in a single 160-PQFP, reducing board area, power, and assembly cost. Designers port their existing logic to VHDL or Verilog and synthesize into the FLEX 8000 architecture, often achieving equivalent functionality at one-tenth the board area. The -2 speed grade is sufficient for most glue-logic clock rates below 50 MHz, and the 5 V I/O directly interfaces with legacy peripheral ICs without level shifters.
موصى به
Educational FPGA and Prototyping Platforms
The EPF8452AQC160-2 is used in university-level digital design labs and retro-computing projects because its FLEX 8000 architecture is well documented in textbooks and Quartus II legacy tutorials support the device. Students can implement 16-bit loadable counters (rated at 83 MHz in the -2 grade) and 16-to-1 multiplexers (9.5 ns) as taught exercises, and the 120 I/Os accommodate many parallel breakout pins. The 160-PQFP package is breadboard-friendly with appropriate breakout adapters, and obsolete-market pricing keeps lab kit costs manageable.
موصى به
Test and Measurement Front-End Logic
In test and measurement equipment, the EPF8452AQC160-2 implements custom timing generators, pattern sequencers, and channel-multiplexers that need precise control over many parallel signals. Its 120 I/Os allow direct fanout to front-panel connectors or pin-driver ASICs, while the SRAM configuration supports on-the-fly test-pattern reloading between test runs. The 5 V I/O tolerance matches TTL-level instrumentation buses, and the commercial 0–70 °C temperature range covers most laboratory environments without derating.
موصى به
Aerospace and Defense Legacy Sustainment
Long-lifecycle aerospace and defense platforms still in service — such as avionics, radar, and military communications — often rely on FLEX 8000 designs that cannot be re-engineered without expensive re-certification. The EPF8452AQC160-2 supports these sustainment programs as a form-fit-function replacement of failed units, with same-die -3 and -4 speed-grade variants available when higher performance is needed. Authorized-distributor stock and independent aftermarket sources remain the primary channels because the part has been obsolete for years.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF8452AQC160-2 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF8452AQC160-3 | EPF8452AQC160-4 | EPF8452AGC160-3 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | PQFP-160 (160-BQFP) | PQFP-160 (same footprint, drop-in) | PQFP-160 (same footprint, drop-in) | PGA-160 (NOT drop-in, different footprint) |
| Speed Grade | -2 (slowest) | -3 (medium) | -4 (fastest) | -3 (medium) |
| Logic Elements | 336 | 336 (same die) | 336 (same die) | 336 (same die) |
| Usable Gates | ~4,000 | ~4,000 | ~4,000 | ~4,000 |
| LABs | 42 | 42 | 42 | 42 |
| Supply Voltage | 5 V (4.75–5.25 V) | 5 V (same) | 5 V (same) | 5 V (same) |
| Operating Temperature | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| Configuration Memory | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Lowest-cost speed grade in the FLEX 8000 family (مقابلEPF8452AQC160-3)
- True drop-in same-die, same-package upgrade path (مقابلEPF8452AQC160-4)
- PQFP package is socket-friendly for legacy sustainment (مقابلEPF8452AGC160-3)
ملاحظات التصميم
The EPF8452AQC160-2 requires a clean 5 V supply at 4.75 V to 5.25 V for the VCCINT pins (5 V core) plus a separate VCCIO rail that can be tied to 5 V or 3.3 V depending on MultiVolt I/O configuration. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 10 µF bulk tantalum or ceramic near the package. The SRAM configuration is volatile — every power-up must be followed by a configuration load from an EPC1, EPC1064, EPC1213, EPC1441, or a parallel EPROM. Add a reset supervisor to ensure clean VCC ramp before configuration begins.
The PQFP-160 package has a 0.5 mm pin pitch (typical for QFP-160) and gull-wing leads on all four sides. Use a JEDEC-standard land pattern with 0.30 mm × 1.50 mm pads and solder mask defined (SMD) openings for best solder-joint reliability. The package body is approximately 28 × 28 mm with a thermal pad on the underside that should be soldered to a copper pour to improve heat dissipation — without it, junction temperature can exceed 100 °C at high toggle rates. Stencil design should be 100 µm stainless steel with reduced aperture ratios on fine-pitch perimeter pads to prevent solder bridging.
Three pitfalls commonly trip first-time FLEX 8000 designers. (1) Forgetting the configuration EPROM — without it, the FPGA does nothing at power-up and all I/Os stay tri-stated; an EPC1 or EPC1064 must be on the board or the design will appear completely dead. (2) Mixing VCCIO voltages — the I/O bank is 5 V tolerant only when VCCIO = 5 V; setting VCCIO = 3.3 V disables 5 V input tolerance and can damage upstream drivers. (3) Ignoring the configuration mode pins — MSEL0/MSEL1 must be tied correctly to select the configuration scheme; floating pins cause intermittent configuration failures. Always verify MSEL strapping against the FLEX 8000 datasheet's configuration chapter.
معلومات الامتثال
EPF8452AQC160-2 was introduced before modern RoHS/REACH compliance tracking; RoHS/lead-free status for individual date codes must be verified at the lot level. Not AEC-Q100 qualified (commercial 0–70 °C only).
