Intel

EPF8452AQC160-2 - 4K Gates FLEX 8000 FPGA, 160-PQFP | Intel

MPN: EPF8452AQC160-2 ✗ Akhir Hidup

5 V (4.75 V to 5.25 V) Vdss 120 (per Altera data), 68 (per DigiKey listing) Package -2 (lowest-cost tier) Speed

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EPF8452AQC160-2 Ringkasan

The Intel (formerly Altera) EPF8452AQC160-2 is a member of the FLEX 8000 family of CMOS SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering approximately 4,000 usable gates and 336 logic elements (LEs) housed in a 160-pin Plastic Quad Flat Pack (PQFP / 160-BQFP) package. It is fabricated on a 0.42 µm CMOS process, operates from a single 5 V supply (4.75 V to 5.25 V), and supports 120 user I/O pins in this package with a -2 (slower) speed grade targeting cost-sensitive designs. The device is rated for commercial temperature operation from 0 °C to 70 °C.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) whose logic and interconnections are configured by loading SRAM configuration bits at system power-up. Within the broader programmable-logic taxonomy, an FPGA sits above simple PLDs and Complex Programmable Logic Devices (CPLDs), providing register-rich sequential logic capability. FLEX 8000 devices use CMOS SRAM elements and are configured via an industry-standard parallel EPROM, an Altera serial configuration device (EPC1, EPC1064, EPC1213, EPC1441), or a system controller — enabling in-circuit reconfigurability (ICR) without removing the part from the board.

Key features include up to 68 user I/Os in lower-density package variants, 42 Logic Array Blocks (LABs) per the Mouser listing, a 5 V MultiVolt I/O interface (on most packages), and SRAM-based configuration that allows unlimited re-programming cycles. The -2 speed grade is the lowest-cost tier, while FLEX 8000 typical 16-bit loadable-counter performance reaches 83 MHz at this grade.

Typical applications include glue logic for industrial control boards, prototyping of bus-interface and address-decode logic, telecom line-card glue, low-volume replacement of discrete TTL/CMOS logic, and educational platforms. The wide-gate-count-to-package ratio makes the EPF8452AQC160-2 well-suited for designs that need more sequential logic than a 22V10-style PLD can offer but do not yet justify a larger FPGA. Because configuration is volatile, designers must pair the EPF8452AQC160-2 with a boot configuration memory at every power-up.

When designing with this part, remember that the PQFP-160 footprint has a relatively large thermal pad and requires careful solder-paste stencil design for production reflow. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

Alternatif penggantian untuk EPF8452AQC160-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF8452AQC160-2 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Process Technology, Speed Grade, Configuration Method.

EPF8452AQC160-3

Altera

Package: 160-pin PQFP (BQFP)

Operating Temperature: 0 °C to +70 °C (Commercial)

Speed Grade: -3