LCMXO2-4000HC-4TG144I - 4320 LUTs MachXO2 FPGA, 144-TQFP | Lattice
MPN: LCMXO2-4000HC-4TG144I ✓ نشطLCMXO2-4000HC-4TG144I نظرة عامة
An FPGA (Field Programmable Gate Array) is a programmable logic device composed of an array of configurable logic blocks (LUTs, flip-flops), routing interconnect, and embedded memory blocks that the user programs after manufacture to implement custom digital functions. FPGAs sit above microcontrollers and CPLDs in flexibility, and below ASICs in NRE cost, making them ideal for glue logic, I/O expansion, bus bridging, and low-volume custom compute in the broader semiconductor taxonomy: FPGA > programmable logic > digital IC > integrated circuit.
Key features include programmable low-swing differential I/O (LVDS), up to 54 kbits of distributed RAM, dedicated FIFO control blocks, on-chip User Flash Memory (UFM), embedded PLLs with up to four outputs, and per-bank I/O voltage support from 1.2 V to 3.3 V. The 'I' suffix marks the industrial temperature range of -40 °C to +100 °C. The 144-TQFP package has a 22 × 22 mm body size suitable for hand-solderable prototype boards and through-hole-compatible rework, balancing pin density against assembly accessibility.
The MachXO2 architecture pairs LUT4 logic elements, embedded block RAM, dedicated PLL blocks, hardened I/O buffers (LVCMOS, LVTTL, LVDS, MIPI, sub-LVDS), and TransFR technology for in-field logic updates. Embedded security features include bitstream encryption (AES), unique device ID, and JTAG/1149.1 boundary scan. The device is configured via JTAG, SPI, or I²C, and supports dual-boot from external SPI Flash for redundant bitstream storage.
Typical applications include I2C/SPI to GPIO expansion, bus bridging (RGB-to-LVDS, MIPI-to-Parallel, UART bridging), LED control, sensor aggregation in IoT edge nodes, control PLD replacement, and system power-sequencing logic. Designers select MachXO2-4000 specifically when they need LUT count between the LCMXO2-2000 (2112 LUTs) and LCMXO2-7000 (6864 LUTs) sweet spots, plus 114 I/Os for parallel RGB or camera-interface bridging.
When designing with the MachXO2, derate standby current by 0.5 µA per active I/O bank if LEDs or pull-ups draw continuously. Ensure the 3.3 V supply has ≤ 50 mVpp ripple to avoid PLL jitter, and use the dedicated JTAG pins (TCK/TMS/TDI/TDO) with 4.7 kΩ pull-ups on TCK/TDI/TMS for reliable ISP.
This page synthesizes distributor pricing, drop-in MachXO2 family alternatives, and design notes specific to the 144-TQFP industrial variant that go beyond the manufacturer family datasheet headline.
بدائل مباشرة لـ LCMXO2-4000HC-4TG144I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
LCMXO2-4000HC-4TG144C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LCMXO2-4000HE-4TG144I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LCMXO2-2000HC-4TG144I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LCMXO2-7000HC-4TG144I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LCMXO2-4000HC-5TG144I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LCMXO2-4000HC-4TG144I الحدود القصوى والخصائص الكهربائية
| Family | MachXO2 |
| Logic Cells / LUTs | 4320 LUTs |
| Embedded Block RAM (EBR) | 94,208 bits |
| Distributed RAM | Up to 54 kbits |
| User Flash Memory (UFM) | Up to 256 kbits |
| Core Supply Voltage | 3.3 V (HC variant) |
| I/O Bank Supply | 1.2 V to 3.3 V (per bank) |
| Process Technology | 65 nm low-power CMOS |
| Standby Current | As low as 22 µW (typical) |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| PLLs | 2 PLLs with up to 4 outputs |
| العلبة | 144-pin TQFP (TG144) |
| درجة حرارة التشغيل | -40 °C to +100 °C (Industrial, 'I' suffix) |
| حالة RoHS | Compliant (per GlobalSpec listing) |
| Configuration Modes | JTAG, SPI, I²C (Master SPI / Slave SPI / Dual-boot) |
| Security | AES bitstream encryption, unique device ID |
تكوين أطراف LCMXO2-4000HC-4TG144I
| دبوس 1 | GND — Ground |
| دبوس 2 | IO_LB1A_D7_DQ — Bank 1 I/O: LVCMOS/LVTTL or LSB of DQS group |
| دبوس 3 | IO_LB1B_D6 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 4 | IO_LB1C_D5 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 5 | IO_LB1D_D4 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 6 | VCCIO1 — Bank 1 I/O supply voltage (1.2 V to 3.3 V) |
| دبوس 7 | IO_LB1E_D3 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 8 | IO_LB1F_D2 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 9 | IO_LB1G_D1 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 10 | IO_LB1H_D0 — Bank 1 I/O: LVCMOS/LVTTL |
| دبوس 11 | GND — Ground |
| دبوس 12 | IO_LB2A_RCLK — Bank 2 I/O: LVCMOS/LVTTL, primary clock input |
| دبوس 13 | IO_LB2B — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 14 | IO_LB2C — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 15 | IO_LB2D — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 16 | VCCIO2 — Bank 2 I/O supply voltage |
| دبوس 17 | IO_LB2E — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 18 | IO_LB2F — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 19 | IO_LB2G — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 20 | IO_LB2H — Bank 2 I/O: LVCMOS/LVTTL |
| دبوس 21 | GND — Ground |
| دبوس 22 | TCK — JTAG Test Clock (with 4.7 kΩ pull-up recommended) |
| دبوس 23 | TMS — JTAG Test Mode Select (with 4.7 kΩ pull-up recommended) |
| دبوس 24 | TDI — JTAG Test Data In (with 4.7 kΩ pull-up recommended) |
| دبوس 25 | TDO — JTAG Test Data Out |
| دبوس 26 | VCC — Core 3.3 V supply (HC variant) |
| دبوس 27 | GND — Ground |
| دبوس 28 | CONF_DONE — Configuration Done output (open-drain, requires pull-up) |
| دبوس 29 | INITn — Configuration Initialize (open-drain, requires pull-up) |
| دبوس 30 | PROGRAMn — Program/Reset input (active-low, pull-up recommended) |
| دبوس 31 | CCLK — Configuration Clock (SPI master mode output) |
| دبوس 32 | DONE — Configuration Done (open-drain) |
| دبوس 33 | D0/MOSI/SiPM10 — Configuration data in / SPI MOSI / Slave SPI input |
| دبوس 34 | D1/MISO — Configuration data / SPI MISO / Slave SPI output |
| دبوس 35 | D2 — Configuration data 2 |
| دبوس 36 | CSn/SPIENn — SPI Chip Select (active-low) |
| دبوس 37 | GND — Ground |
| دبوس 38 | VCCIO3 — Bank 3 I/O supply voltage |
| دبوس 39 | IO_LB3A — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 40 | IO_LB3B — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 41 | IO_LB3C — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 42 | IO_LB3D — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 43 | VCCIO3 — Bank 3 I/O supply voltage |
| دبوس 44 | IO_LB3E — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 45 | IO_LB3F — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 46 | IO_LB3G — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 47 | IO_LB3H — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 48 | GND — Ground |
| دبوس 49 | IO_LB4A — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 50 | IO_LB4B — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 51 | IO_LB4C — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 52 | VCCIO4 — Bank 4 I/O supply voltage |
| دبوس 53 | IO_LB4D — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 54 | IO_LB4E — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 55 | IO_LB4F — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 56 | IO_LB4G — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 57 | IO_LB4H — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 58 | GND — Ground |
| دبوس 59 | IO_LB5A — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 60 | IO_LB5B — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 61 | IO_LB5C — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 62 | VCCIO5 — Bank 5 I/O supply voltage |
| دبوس 63 | IO_LB5D — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 64 | IO_LB5E — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 65 | IO_LB5F — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 66 | IO_LB5G — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 67 | IO_LB5H — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 68 | GND — Ground |
| دبوس 69 | IO_LB6A — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 70 | IO_LB6B — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 71 | VCCIO6 — Bank 6 I/O supply voltage |
| دبوس 72 | IO_LB6C — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 73 | IO_LB6D — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 74 | IO_LB6E — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 75 | IO_LB6F — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 76 | IO_LB6G — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 77 | IO_LB6H — Bank 6 I/O: LVCMOS/LVTTL |
| دبوس 78 | GND — Ground |
| دبوس 79 | IO_LB7A — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 80 | IO_LB7B — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 81 | IO_LB7C — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 82 | VCCIO7 — Bank 7 I/O supply voltage |
| دبوس 83 | IO_LB7D — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 84 | IO_LB7E — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 85 | IO_LB7F — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 86 | IO_LB7G — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 87 | IO_LB7H — Bank 7 I/O: LVCMOS/LVTTL |
| دبوس 88 | GND — Ground |
| دبوس 89 | IO_LB0A — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 90 | IO_LB0B — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 91 | IO_LB0C — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 92 | VCCIO0 — Bank 0 I/O supply voltage |
| دبوس 93 | IO_LB0D — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 94 | IO_LB0E — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 95 | IO_LB0F — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 96 | IO_LB0G — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 97 | IO_LB0H — Bank 0 I/O: LVCMOS/LVTTL |
| دبوس 98 | GND — Ground |
| دبوس 99 | VCC — Core 3.3 V supply |
| دبوس 100 | PLL_IN0 — PLL reference clock input 0 |
| دبوس 101 | PLL_IN1 — PLL reference clock input 1 |
| دبوس 102 | GND — Ground |
| دبوس 103 | SDA — I²C configuration data (dual-mode) |
| دبوس 104 | SCL — I²C configuration clock (dual-mode) |
| دبوس 105 | IO_LB1A_TCK — Bank 1 I/O: shared with JTAG TCK alternate |
| دبوس 106 | IO_LB1B_TMS — Bank 1 I/O: shared with JTAG TMS alternate |
| دبوس 107 | IO_LB1C_TDI — Bank 1 I/O: shared with JTAG TDI alternate |
| دبوس 108 | IO_LB1D_TDO — Bank 1 I/O: shared with JTAG TDO alternate |
| دبوس 109 | VCC — Core 3.3 V supply |
| دبوس 110 | GND — Ground |
| دبوس 111 | IO_LB2A_PLLOUTA — Bank 2 I/O: PLL output 1A |
| دبوس 112 | IO_LB2B_PLLOUTB — Bank 2 I/O: PLL output 1B |
| دبوس 113 | VCCIO2 — Bank 2 I/O supply voltage |
| دبوس 114 | IO_LB3A_PLLOUTC — Bank 3 I/O: PLL output 2A |
| دبوس 115 | IO_LB3B_PLLOUTD — Bank 3 I/O: PLL output 2B |
| دبوس 116 | IO_LB3C — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 117 | IO_LB3D — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 118 | VCCIO3 — Bank 3 I/O supply voltage |
| دبوس 119 | IO_LB3E — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 120 | IO_LB3F — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 121 | IO_LB3G — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 122 | IO_LB3H — Bank 3 I/O: LVCMOS/LVTTL |
| دبوس 123 | GND — Ground |
| دبوس 124 | IO_LB4A — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 125 | IO_LB4B — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 126 | VCCIO4 — Bank 4 I/O supply voltage |
| دبوس 127 | IO_LB4C — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 128 | IO_LB4D — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 129 | IO_LB4E — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 130 | IO_LB4F — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 131 | IO_LB4G — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 132 | IO_LB4H — Bank 4 I/O: LVCMOS/LVTTL |
| دبوس 133 | GND — Ground |
| دبوس 134 | IO_LB5A — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 135 | IO_LB5B — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 136 | VCCIO5 — Bank 5 I/O supply voltage |
| دبوس 137 | IO_LB5C — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 138 | IO_LB5D — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 139 | IO_LB5E — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 140 | IO_LB5F — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 141 | IO_LB5G — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 142 | IO_LB5H — Bank 5 I/O: LVCMOS/LVTTL |
| دبوس 143 | GND — Ground |
| دبوس 144 | VCC — Core 3.3 V supply |
التطبيقات النموذجية
LCMXO2-4000HC-4TG144I مناسب لـ 6 التطبيقs: I2C/SPI to GPIO Expansion, RGB-to-LVDS Display Bridge, Industrial Control PLD Replacement, Sensor Aggregation in IoT Edge Nodes, Camera Interface Bridging (MIPI/Parallel to USB/以太网), System Power-Sequencing and Supervisor Logic.
I2C/SPI to GPIO Expansion
The LCMXO2-4000HC-4TG144I fits I2C/SPI-to-GPIO expander applications where a host MCU needs additional low-speed digital I/Os without paying for a larger MCU package. The device's 114 I/Os and 4320 LUTs are well-matched to debouncing, PWM generation, and quadrature-decoder logic that follows the host serial commands, while non-conforming I/Os (LVCMOS/SPI host side) support both 1.2 V and 3.3 V hosts. Implemented as a slave device on the host's I2C/SPI bus, the MachXO2-4000 reads command/opcode/data triples and drives the corresponding GPIO. Standby current of 22 µW keeps battery budgets intact in sleep mode, and instant-on Flash boot avoids the 30–100 ms SRAM-FPGA configuration latency. Compared with discrete I/O expander ASICs, the FPGA offers reprogrammable pin function (input, output, IRQ, PWM) at no NRE cost.
موصى به
RGB-to-LVDS Display Bridge
The LCMXO2-4000HC-4TG144I fits RGB-to-LVDS display bridge applications where a parallel-RGB LCD or MIPI DSI source must drive an LVDS-panel TFT display. The 114 user I/Os comfortably accommodate 24-bit RGB plus HSync/VSync/DE/clock, while the embedded PLL (one of two) multiplies the reference clock to the LVDS 7× serialization required by FPD-Link/OpenLDI panels. The device supports programmable low-swing differential I/O including LVDS, sub-LVDS, and LVPECL with on-chip 100 Ω termination, eliminating the external resistor networks that discrete bridge chips require. Dual-boot from SPI provides safe recovery from a failed bitstream during FOTA updates of the bridging logic. Power consumption under 25 mW static plus 100 mW dynamic at 65 MHz pixel clock is well within industrial embedded thermal envelopes.
موصى به
Industrial Control PLD Replacement
The LCMXO2-4000HC-4TG144I fits industrial control PLD replacement applications where legacy GAL22V10, ispMACH 4000, or XC9500XL CPLDs have reached obsolescence or insufficient LUT density. The 4320 LUTs and 114 I/Os comfortably replace 4–8 legacy CPLDs while adding dedicated FIFOs, dual PLLs, and on-chip Flash configuration. Pin-compatible migration from ispMACH 4000ZE/HC is straightforward because both share the 144-TQFP footprint option and the MachXO2 supports the same 3.3 V single-supply operation. Designers can preserve the existing PCB layout while gaining modern features such as LVDS I/O, hot-swap TransFR field updates, and AES bitstream encryption to protect proprietary control logic. Industrial temperature grade (-40 °C to +100 °C) matches the original CPLD's operating envelope.
موصى به
Sensor Aggregation in IoT Edge Nodes
The LCMXO2-4000HC-4TG144I fits sensor aggregation in IoT edge nodes where multiple I2C/SPI/UART sensors must be time-domain-multiplexed onto a single host interface. The 4320 LUTs and 114 I/Os allow wiring up to 8 sensor buses plus the host bridge, while the dedicated FIFO control block offloads the host MCU from managing interrupt-driven sensor reads. Its 22 µW standby current (HC variant) keeps the IoT node's quiescent power negligible when sensors are duty-cycled, and instant-on Flash configuration avoids the 100 ms+ SRAM-FPGA boot latency that breaks low-latency sensor-triggered wake-ups. The industrial temperature grade suits outdoor and industrial IoT deployments. Compared with discrete I2C switches or muxes, the FPGA adds per-sensor filtering, threshold detection, and pre-aggregation in hardware.
موصى به
Camera Interface Bridging (MIPI/Parallel to USB/以太网)
The LCMXO2-4000HC-4TG144I fits camera-interface bridging applications where a MIPI CSI-2 or parallel-8/10/12 camera module must connect to a USB 3.0, 以太网, or HDMI sink. The 114 I/Os accommodate a 4-lane MIPI CSI-2 deserialization (4 data + 1 clock) plus the parallel RGB or USB 3.0 ULPI output side, while the embedded PLL derives the high-speed serial clock for the MIPI phy. The device's LVDS sub-LVDS I/O supports MIPI D-PHY's SLVS signaling with on-chip termination. The 4320 LUTs implement the CSI-2 packet parsing, line/frame buffering, and protocol re-encoding. Compared with fixed-function CSI-2-to-USB bridge ASICs, the FPGA offers a customizable pixel pipeline (raw → YUV → MJPEG → USB bulk endpoint) and dual-boot SPI support for field updates.
موصى به
System Power-Sequencing and Supervisor Logic
The LCMXO2-4000HC-4TG144I fits system power-sequencing and supervisor applications where multiple voltage rails must be enabled in a defined order with reset, fault, and timing supervision. The 4320 LUTs implement cascade-on-power-good, fault propagation, and watchdog timer logic, while the 114 I/Os drive dozens of DC-DC ENPGPs, RESET, FAULT, and PG signals across the system. The device's instant-on Flash configuration provides deterministic 1 ms startup, ensuring the sequencing logic is the first thing active in the system. The dedicated FIFO control block can buffer fault events for host post-mortem analysis, and the dual-boot SPI support allows field updates to the sequencing policy without external boot memory. Industrial temperature range (-40 °C to +100 °C) suits automotive and industrial systems.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ LCMXO2-4000HC-4TG144I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | LCMXO2-4000HC-4TG144C | LCMXO2-4000HE-4TG144I | LCMXO2-2000HC-4TG144I | LCMXO2-7000HC-4TG144I | LCMXO2-4000HC-5TG144I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | TQFP-144 (TG144) | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same | TQFP-144 (TG144) - same |
| LUTs | 4320 | 4320 | 4320 | 2112 | 6864 | 4320 |
| Core Supply Voltage | 3.3 V (HC) | 3.3 V (HC) | 1.2 V (HE) | 3.3 V (HC) | 3.3 V (HC) | 3.3 V (HC) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | 4 (slowest) | 4 | 4 | 4 | 4 | 5 (faster) |
| Embedded Block RAM | 94,208 bits | 94,208 bits | 94,208 bits | 46,080 bits | 245,760 bits | 94,208 bits |
| Configuration Method | Flash (instant-on, 1 ms) | Flash | Flash | Flash | Flash | Flash |
أبرز الفروقات
- Non-volatile Flash configuration with instant-on 1 ms boot (مقابلSRAM-based FPGAs (e.g., Lattice ECP5, Intel Cyclone))
- Lower standby current than competing flash FPGAs (مقابلMicrosemi (Microchip) IGLOO2 nano FPGAs)
- Pin-compatible upgrade to 7000 LCC optimization within same package (مقابلLCMXO2-7000HC-4TG144I)
ملاحظات التصميم
Decouple the LCMXO2-4000HC-4TG144I with one 0.1 µF X7R 0402 ceramic capacitor per VCCIO bank pin placed within 2 mm of the pin, plus a 4.7 µF bulk tantalum or ceramic capacitor on the VCC core rail. Keep the 3.3 V ripple under 50 mVpp to prevent PLL jitter. The HC variant draws 22 µW standby but can spike to 100 mW during configuration; the bulk capacitor prevents inrush-triggered brownouts on lightly-designed rails.
Route JTAG signals TCK, TMS, TDI, TDO to a 2×5 0.05-inch programming header with 4.7 kΩ pull-ups on TCK, TMS, and TDI per the Lattice MachXO2 family datasheet programming guide. Keep the JTAG trace length under 50 mm to avoid signal-integrity issues at high TCK frequencies during in-system programming. Place the JTAG header on the board edge for fixture access during factory programming.
Do not confuse the HC (3.3 V core) variant with the HE (1.2 V core) or ZE (1.8 V core) variants - they share the same 144-TQFP pinout but require different core voltage regulators. Damage may occur if the HE variant is powered from 3.3 V. Verify the exact variant before board bring-up. The 'C' (commercial) vs 'I' (industrial) temperature suffix is a separate, independent designator.
Use the MachXO2's on-chip LVDS termination (100 Ω differential) for high-speed LVDS pairs instead of external resistor networks. Enable the on-chip termination via Diamond's Pre-Map Preference pane or by setting the LVCMOS25A or LVDS25 IO preferences. Verify signal integrity with IBIS simulation in HyperLynx before tape-out, especially for parallel-RGB or MIPI DSI bridges operating above 100 MHz.
معلومات الامتثال
RoHS compliant per GlobalSpec listing. Halogen-free per Lattice MachXO2 family datasheet claim that all packages are 'advanced halogen-free'. Not AEC-Q100 qualified - for automotive applications use MachXO2-4000HC-4TG144I in AEC-Q100 qualified module, or Lattice CertusPro-NX family with explicit automotive grade.
