LPC1815JET100E - 32-Bit 180MHz Cortex-M3 MCU | NXP
MPN: LPC1815JET100E ✓ نشطLPC1815JET100E نظرة عامة
A microcontroller, or MCU, is a semiconductor that integrates a processor core, program memory, data memory, and peripherals into one package. In the electronic-component hierarchy, an MCU belongs to the embedded-processing class, then to microprocessor and microcontroller families, and ultimately to the broader semiconductor category. The LPC1800 family is positioned by NXP as a high-performance embedded family based on the Arm Cortex-M3 core.
The LPC1815JET100E combines a 32-bit Cortex-M3 processor operating up to 180 MHz with 768 KB of Flash memory. Its 100-TFBGA package provides a compact surface-mount solution for embedded systems requiring substantial program storage. The part is specified for a 3.3 V operating supply according to the indexed product information.
The LPC1800 family supports a broad set of embedded connectivity and control functions. Family-level product information identifies Ethernet, two high-speed USB interfaces, LCD support, and EMC-related features. These capabilities allow the LPC1815JET100E to serve as the central controller in connected embedded products rather than as a simple low-performance control element. Exact peripheral configuration and electrical limits should be confirmed against the NXP datasheet before schematic capture.
Typical design roles include industrial control, communications equipment, human-machine interfaces, USB-connected products, and Ethernet-enabled embedded systems. Its 180 MHz Cortex-M3 execution rate suits responsive multitasking and signal-control firmware, while 768 KB of Flash provides room for application code, networking stacks, boot logic, and field-update functions. Package-sensitive designs should preserve the required 100-ball land pattern and provide adequate escape routing around the fine-pitch BGA.
Design planning should begin with the package, power architecture, peripheral assignment, and required software support. Because a 100-pin TFBGA has fine-pitch balls and limited routing escape, high-speed interfaces, external memory, and power nets may require careful layer assignment. Confirm pin multiplexing, voltage domains, decoupling requirements, programming configuration, and thermal performance using the manufacturer datasheet.
This product record combines the exact orderable MPN, indexed manufacturer and distributor information, package and memory characteristics, practical application guidance, and a conservative replacement analysis. It also distinguishes documented identity from engineering details that require direct verification in the NXP technical documentation.
بدائل مباشرة لـ LPC1815JET100E — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع LPC1815JET100E (نفس عامل الشكل والبصمة) — يختلف في Package, Product Type, Architecture, Flash Memory, Package Type.
LPC1812JET100E
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←LPC1822JET100E
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←LPC1823JET100E
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←LPC1815JET100E الحدود القصوى والخصائص الكهربائية
| Product Type | High-performance 32-bit microcontroller (MCU) |
| Processor Core | Arm Cortex-M3 |
| Instruction Set | 32-bit ARM |
| Maximum CPU Frequency | 180 MHz |
| Embedded Flash Memory | 768 KB |
| Flash Organization | 768K x 8 bits |
| جهد التغذية التشغيلي | 3.3 V |
| العلبة | 100-TFBGA (9 mm x 9 mm) |
| Package Type | Thin-film ball grid array (TFBGA) |
| نوع التركيب | Surface mount |
| Package Dimensions | 9 mm x 9 mm |
| Ethernet Support | Supported at LPC1800 family level |
| USB Interface Count | 2 high-speed USB interfaces at LPC1800 family level |
| LCD Support | Supported at LPC1800 family level |
| EMC Support | Supported at LPC1800 family level |
| Family Maximum Flash | Up to 1 MB |
| Family Maximum SRAM | Up to 136 KB |
دليل تكوين أطراف LPC1815JET100E 9 mm x 9 mm
تكوين الأطراف لـ LPC1815JET100E (حزمة 9 mm x 9 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ LPC1815JET100E.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
LPC1815JET100E مناسب لـ 6 التطبيقs: Industrial Embedded Control, Ethernet-Connected Equipment, USB Configuration and Service Port, Human-Machine Interface Controller, Network Communication Gateway, Real-Time Signal and Motion Control.
Industrial Embedded Control
The LPC1815JET100E fits industrial embedded controllers that require a 180 MHz Arm Cortex-M3 core, 32-bit processing, and 768 KB of Flash for supervisory logic, sequencing, communications, and local data handling. Its 100-TFBGA package can support compact board layouts when the PCB process provides adequate BGA escape routing. Ethernet and USB family capabilities can also connect the controller to service networks or configuration equipment. Before committing the design, verify the required peripheral mix, voltage domains, isolation strategy, environmental limits, and safety architecture against the NXP datasheet.
موصى به
Ethernet-Connected Equipment
The LPC1815JET100E is appropriate for Ethernet-enabled embedded equipment because the LPC1800 family supports Ethernet connectivity alongside a 180 MHz Cortex-M3 processor and 768 KB of Flash. A controller can combine network management, protocol processing, diagnostics, and local real-time control in one device. The exact MAC, Ethernet PHY, magnetics, connector, and clock requirements must be established from the manufacturer documentation. Designers should also reserve board area for Ethernet magnetics and controlled-impedance routing while preserving the target’s 9 mm by 9 mm BGA escape requirements.
موصى به
USB Configuration and Service Port
The LPC1815JET100E can serve as the host controller in equipment that uses one of the LPC1800 family’s two high-speed USB interfaces for configuration, firmware recovery, data logging, or peripheral connectivity. Its 180 MHz processor and 768 KB of Flash provide capacity for a USB protocol stack alongside application firmware. The implementation must account for the device’s 3.3 V operating supply, USB transceiver or controller requirements, connector protection, and routing of high-speed differential pairs. Confirm which USB functions and pins are available for the exact device in the NXP pin table.
موصى به
Human-Machine Interface Controller
The LPC1815JET100E is suitable for human-machine interface controllers that combine display updates, input handling, communications, and supervisory control. The LPC1800 family includes LCD support, while the 180 MHz Cortex-M3 core can service responsive display and control tasks and the 768 KB of Flash can store interface firmware. The 100-TFBGA format favors compact multilayer boards, although display and touch interfaces require careful escape routing and signal-integrity review. Verify display-controller compatibility, pin multiplexing, panel voltage requirements, and electrical timing before schematic release.
موصى به
Network Communication Gateway
The LPC1815JET100E can serve as the communications controller in a compact gateway that combines Ethernet, USB, or other embedded-system functions with local real-time processing. The 180 MHz Cortex-M3 core supports responsive protocol handling, while 768 KB of Flash accommodates firmware, protocol stacks, and configuration data. Its 100-TFBGA package enables compact integration but requires deliberate layer planning to escape fine-pitch balls for Ethernet magnetics, connectors, memory, and power circuitry. Confirm the exact peripheral map and pin multiplexing in the NXP documentation for the selected LPC1815 configuration.
موصى به
Real-Time Signal and Motion Control
The LPC1815JET100E fits real-time embedded control tasks that benefit from a 32-bit Cortex-M3 processor operating at 180 MHz. The 768 KB of Flash supports control firmware, parameter tables, communication routines, and update logic, while the 100-TFBGA package allows integration close to power and interface circuitry. Designers must partition real-time and communication workloads and verify interrupt behavior, peripheral timing, and external component requirements. Timing-critical interfaces should be checked against the electrical characteristics and reference designs rather than inferred from CPU frequency alone.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ LPC1815JET100E — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | LPC1812JET100E | LPC1822JET100E | LPC1823JET100E |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) | 100-TFBGA (9 mm x 9 mm) |
| Processor Core | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 768 KB | 512 KB | 128 KB | 512 KB |
| Operating Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Ethernet Support | Supported at LPC1800 family level | Supported | Supported | Supported |
| High-Speed USB Interfaces | 2 at LPC1800 family level | 2 | 2 | 2 |
أبرز الفروقات
- Largest Flash configuration among the listed related members (مقابلLPC1812JET100E)
- Substantially more program memory than the LPC1822 configuration (مقابلLPC1822JET100E)
- Additional Flash space for larger control or communications firmware (مقابلLPC1823JET100E)
ملاحظات التصميم
The 100-TFBGA package uses fine-pitch balls on a 9 mm by 9 mm body, so fan-out and layer assignment should be planned before schematic completion. Place the device near its decoupling, reset, clock, debug, and high-speed interface networks; use inner signal layers for escape routing where the outer layer cannot accommodate clean escape paths. Derive the land pattern and solder-mask geometry from the NXP package drawing rather than scaling a generic BGA footprint.
Route Ethernet and high-speed USB differential pairs as controlled-impedance nets with continuous reference planes and minimal layer changes. Keep switching or high-current paths away from the Cortex-M3 supply and sensitive input routing, and place interface protection close to connector entry points. Although the LPC1800 family supports two high-speed USB interfaces and Ethernet, each enabled interface requires the correct pins, clocking, transceiver arrangement, and signal-integrity treatment shown in the manufacturer reference material.
Do not treat the LPC18xx order codes as automatically interchangeable merely because they use the same 100-TFBGA outline. The LPC1812, LPC1822, and LPC1823 have different Flash capacities and peripheral mixes, which can change firmware size requirements, startup behavior, pin multiplexing, and board functionality. Before substituting any related member, compare the NXP pin tables, memory maps, electrical characteristics, package drawings, and application notes and then rebuild or qualify the affected firmware.
معلومات الامتثال
The indexed product information does not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Obtain the current NXP declarations before production qualification.
