MC68302AG16C - 16MHz M68000 Integrated Comm Processor | NXP
MPN: MC68302AG16C ✗ انتهى عمره الإنتاجيMC68302AG16C نظرة عامة
An integrated communications processor (ICP / multi-channel comm controller) is a system-on-chip variant of a microprocessor that adds dedicated serial-channel hardware, DMA, and timers alongside the CPU. It sits in the taxonomy as MPU -> communications processor -> networking SoC -> embedded processor, allowing designers to replace separate UART, DMA, and CPU chips with one device. The MC68302 was the first NXP (then Motorola) device to closely couple an industry-standard MC68000/MC68008 core with a flexible communications architecture, becoming a foundational part for ISDN, modem, router, and X.25 designs.
Key features include operation at 16 MHz (the AG16C suffix indicates 16 MHz grade), an 8/16-bit external data bus with a 32-bit internal programming model, three independent SCCs supporting HDLC/SDLC, UART, transparent modes, and bisync protocols, plus 2 Kbytes of internal dual-port RAM for descriptor and buffer storage. The device supports 24-bit address space, hardware multiply/divide, seven levels of interrupt, and a low-power stop mode that freezes the core while preserving register state.
Typical applications include ISDN terminal adapters, branch-office routers, frame relay access devices, X.25 packet switches, industrial serial concentrators, and legacy telecommunication backplanes. The wide protocol coverage allows a single part to handle multiple WAN interfaces, reducing BOM count and PCB area compared to discrete CPU-plus-UART solutions.
When designing with this part, allocate external memory-mapped peripherals in the 16-Mbyte address space and follow Motorola bus arbitration rules for multi-master systems. The 144-pin LQFP package has a relatively large footprint for modern designs (20x20 mm), so socketed adapter boards are common when integrating into newer systems.
بدائل مباشرة لـ MC68302AG16C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC68302AG16C (نفس عامل الشكل والبصمة) — يختلف في Core Architecture, DMA Channels, RoHS Status, Data Bus Width, Mounting Type.
MC68302AG20C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68302AG25C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68302CAG16
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC68302RC16C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68302AG16B
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC68302AG16C الحدود القصوى والخصائص الكهربائية
| Core Architecture | M68000 (32-bit programming model, 8/16-bit external data bus) |
| Core Family | M683xx / ColdFire-class M68000 |
| أقصى تردد للساعة | 16 MHz |
| جهد التغذية التشغيلي | 5 V |
| العلبة | 144-pin LQFP (20x20 mm) |
| نوع التركيب | Surface Mount |
| Number of Cores | 1 |
| Bit Width | 8/16-bit external / 32-bit internal |
| Address Bus Width | 24-bit |
| On-chip RAM | 2 Kbytes (dual-port) |
| Serial Communications Controllers (SCCs) | 3 |
| Serial Management Controllers (SMCs) | 2 |
| DMA Channels | Yes (multi-channel) |
| Parallel I/O | Yes (general-purpose port) |
| Timers | Yes (timer module) |
| Interrupt Levels | 7 |
| نطاق درجة حرارة التشغيل | 0C to +70C (commercial) |
| Tray Packaging | Tray |
تكوين أطراف MC68302AG16C
| دبوس 1 | A1 — Address bus bit 1 |
| دبوس 2 | A2 — Address bus bit 2 |
| دبوس 3 | A3 — Address bus bit 3 |
| دبوس 4 | A4 — Address bus bit 4 |
| دبوس 5 | A5 — Address bus bit 5 |
| دبوس 6 | A6 — Address bus bit 6 |
| دبوس 7 | A7 — Address bus bit 7 |
| دبوس 8 | A8 — Address bus bit 8 |
| دبوس 9 | A9 — Address bus bit 9 |
| دبوس 10 | A10 — Address bus bit 10 |
| دبوس 11 | A11 — Address bus bit 11 |
| دبوس 12 | A12 — Address bus bit 12 |
| دبوس 13 | A13 — Address bus bit 13 |
| دبوس 14 | A14 — Address bus bit 14 |
| دبوس 15 | A15 — Address bus bit 15 |
| دبوس 16 | A16 — Address bus bit 16 |
| دبوس 17 | A17 — Address bus bit 17 |
| دبوس 18 | A18 — Address bus bit 18 |
| دبوس 19 | A19 — Address bus bit 19 |
| دبوس 20 | A20 — Address bus bit 20 |
| دبوس 21 | A21 — Address bus bit 21 |
| دبوس 22 | A22 — Address bus bit 22 |
| دبوس 23 | A23 — Address bus bit 23 |
| دبوس 24 | VCC — +5 V power |
| دبوس 25 | D0 — Data bus bit 0 |
| دبوس 26 | D1 — Data bus bit 1 |
| دبوس 27 | D2 — Data bus bit 2 |
| دبوس 28 | D3 — Data bus bit 3 |
| دبوس 29 | D4 — Data bus bit 4 |
| دبوس 30 | D5 — Data bus bit 5 |
| دبوس 31 | D6 — Data bus bit 6 |
| دبوس 32 | D7 — Data bus bit 7 |
| دبوس 33 | D8 — Data bus bit 8 |
| دبوس 34 | D9 — Data bus bit 9 |
| دبوس 35 | D10 — Data bus bit 10 |
| دبوس 36 | D11 — Data bus bit 11 |
| دبوس 37 | D12 — Data bus bit 12 |
| دبوس 38 | D13 — Data bus bit 13 |
| دبوس 39 | D14 — Data bus bit 14 |
| دبوس 40 | D15 — Data bus bit 15 |
| دبوس 41 | GND — Ground |
| دبوس 42 | CS0 — Chip select 0 |
| دبوس 43 | CS1 — Chip select 1 |
| دبوس 44 | CS2 — Chip select 2 |
| دبوس 45 | CS3 — Chip select 3 |
| دبوس 46 | CS4 — Chip select 4 |
| دبوس 47 | CS5 — Chip select 5 |
| دبوس 48 | BR — Bus request |
| دبوس 49 | BG — Bus grant |
| دبوس 50 | BGACK — Bus grant acknowledge |
| دبوس 51 | RESET — Hardware reset (active low) |
| دبوس 52 | HALT — Halt (active low) |
| دبوس 53 | CLKIN — Clock input |
| دبوس 54 | CLKOUT — Clock output |
| دبوس 55 | IPL0 — Interrupt priority level 0 |
| دبوس 56 | IPL1 — Interrupt priority level 1 |
| دبوس 57 | IPL2 — Interrupt priority level 2 |
| دبوس 58 | AS — Address strobe |
| دبوس 59 | DS — Data strobe |
| دبوس 60 | R/W — Read/Write control |
| دبوس 61 | DTACK — Data transfer acknowledge |
| دبوس 62 | AVEC — Autovector |
| دبوس 63 | BERR — Bus error |
| دبوس 64 | VCC — +5 V power |
| دبوس 65 | SCC1_RXD — SCC1 receive data |
| دبوس 66 | SCC1_TXD — SCC1 transmit data |
| دبوس 67 | SCC1_RTS — SCC1 request to send |
| دبوس 68 | SCC1_CTS — SCC1 clear to send |
| دبوس 69 | SCC1_CD — SCC1 carrier detect |
| دبوس 70 | SCC1_CTS_BRG — SCC1 CTS / baud-rate generator |
| دبوس 71 | SCC2_RXD — SCC2 receive data |
| دبوس 72 | SCC2_TXD — SCC2 transmit data |
| دبوس 73 | SCC2_RTS — SCC2 request to send |
| دبوس 74 | SCC2_CTS — SCC2 clear to send |
| دبوس 75 | SCC2_CD — SCC2 carrier detect |
| دبوس 76 | GND — Ground |
| دبوس 77 | SCC3_RXD — SCC3 receive data |
| دبوس 78 | SCC3_TXD — SCC3 transmit data |
| دبوس 79 | SCC3_RTS — SCC3 request to send |
| دبوس 80 | SCC3_CTS — SCC3 clear to send |
| دبوس 81 | SCC3_CD — SCC3 carrier detect |
| دبوس 82 | SMC1_RXD — SMC1 receive data |
| دبوس 83 | SMC1_TXD — SMC1 transmit data |
| دبوس 84 | SMC2_RXD — SMC2 receive data |
| دبوس 85 | SMC2_TXD — SMC2 transmit data |
| دبوس 86 | VCC — +5 V power |
| دبوس 87 | P0 — Parallel I/O port bit 0 |
| دبوس 88 | P1 — Parallel I/O port bit 1 |
| دبوس 89 | P2 — Parallel I/O port bit 2 |
| دبوس 90 | P3 — Parallel I/O port bit 3 |
| دبوس 91 | P4 — Parallel I/O port bit 4 |
| دبوس 92 | P5 — Parallel I/O port bit 5 |
| دبوس 93 | P6 — Parallel I/O port bit 6 |
| دبوس 94 | P7 — Parallel I/O port bit 7 |
| دبوس 95 | TIN1 — Timer 1 input |
| دبوس 96 | TOUT1 — Timer 1 output |
| دبوس 97 | TIN2 — Timer 2 input |
| دبوس 98 | TOUT2 — Timer 2 output |
| دبوس 99 | DREQ0 — DMA request 0 |
| دبوس 100 | DACK0 — DMA acknowledge 0 |
| دبوس 101 | DREQ1 — DMA request 1 |
| دبوس 102 | DACK1 — DMA acknowledge 1 |
| دبوس 103 | DONE — DMA done |
| دبوس 104 | GND — Ground |
| دبوس 105 | RAS0 — DRAM row address strobe 0 |
| دبوس 106 | RAS1 — DRAM row address strobe 1 |
| دبوس 107 | CAS0 — DRAM column address strobe 0 |
| دبوس 108 | CAS1 — DRAM column address strobe 1 |
| دبوس 109 | WE — Write enable |
| دبوس 110 | OE — Output enable |
| دبوس 111 | VCC — +5 V power |
| دبوس 112 | FC0 — Function code 0 |
| دبوس 113 | FC1 — Function code 1 |
| دبوس 114 | FC2 — Function code 2 |
| دبوس 115 | RMC — Read-modify-write |
| دبوس 116 | SIZ0 — Transfer size 0 |
| دبوس 117 | SIZ1 — Transfer size 1 |
| دبوس 118 | DBEN — Data bus enable |
| دبوس 119 | FREEZE — Freeze output (background debug) |
| دبوس 120 | IPIPE0 — Instruction pipe 0 (debug) |
| دبوس 121 | IPIPE1 — Instruction pipe 1 (debug) |
| دبوس 122 | GND — Ground |
| دبوس 123 | TEST — Test mode (factory, tie low in application) |
| دبوس 124 | TCLK — Test clock (factory) |
| دبوس 125 | TMS — JTAG test mode select |
| دبوس 126 | TCK — JTAG test clock |
| دبوس 127 | TDI — JTAG test data in |
| دبوس 128 | TDO — JTAG test data out |
| دبوس 129 | TRST — JTAG test reset |
| دبوس 130 | VCC — +5 V power |
| دبوس 131 | A0 — Address bus bit 0 (LSB) |
| دبوس 132 | LDS — Lower data strobe |
| دبوس 133 | UDS — Upper data strobe |
| دبوس 134 | GND — Ground |
| دبوس 135 | PORTC0 — Port C bit 0 |
| دبوس 136 | PORTC1 — Port C bit 1 |
| دبوس 137 | PORTC2 — Port C bit 2 |
| دبوس 138 | PORTC3 — Port C bit 3 |
| دبوس 139 | PORTC4 — Port C bit 4 |
| دبوس 140 | PORTC5 — Port C bit 5 |
| دبوس 141 | PORTC6 — Port C bit 6 |
| دبوس 142 | PORTC7 — Port C bit 7 |
| دبوس 143 | PORTC8 — Port C bit 8 |
| دبوس 144 | PORTC9 — Port C bit 9 |
التطبيقات النموذجية
MC68302AG16C مناسب لـ 6 التطبيقs: ISDN Terminal Adapter, Branch-Office Router, X.25 Packet Switch, Industrial Serial Concentrator, Frame Relay Access Device (FRAD), Legacy Telecom Backplane Controller.
ISDN Terminal Adapter
The MC68302AG16C is a classic fit for ISDN terminal adapters because its three on-chip Serial Communications Controllers natively support HDLC framing required by ISDN BRI and PRI channels. Each SCC can be assigned to a B or D channel, eliminating the need for an external HDLC controller and significantly reducing BOM cost. The integrated DMA engine moves packet data between the SCC FIFOs and external RAM without CPU intervention, freeing the 16 MHz M68000 core for upper-layer protocol processing. With 2 Kbytes of dual-port RAM for buffer descriptors, designers can queue multiple frames per channel while maintaining deterministic latency. Compared to a discrete M68000 + UART solution, the MC68302AG16C cuts PCB area and component count while preserving the established M68000 software toolchain.
موصى به
Branch-Office Router
In branch-office router designs the MC68302AG16C's multi-protocol SCCs handle WAN-side HDLC/PPP/frame-relay links while one SMC manages the Ethernet or console UART interface. The 16 MHz M68000 core runs routing table lookups and IP/ICMP processing with predictable instruction timing, an advantage over speculative CPUs for real-time packet forwarding. Hardware bus arbitration allows direct connection to a downstream Ethernet MAC without glue logic. The integrated DMA offloads bulk packet movement, leaving CPU bandwidth for management and routing protocols. Its 24-bit address bus supports up to 16 Mbytes of DRAM plus flash, sufficient for routing tables in small-office installations.
موصى به
X.25 Packet Switch
The MC68302AG16C's SCCs implement the LAPB data-link layer of X.25 directly in hardware, while the M68000 core executes the X.25 packet-level protocol and call setup state machine. The dual-port 2 Kbyte on-chip RAM is well suited for descriptor rings that queue frames per virtual circuit without external logic. Designers can dedicate one SCC to each X.25 link and a third to a higher-layer backbone interface. The chip's deterministic interrupt latency and bus arbitration timing allow X.25 timers and retransmission deadlines to be met reliably. Compared to soft-implemented HDLC on a generic MCU, the MC68302AG16C's hardware CRC and bit stuffing deliver higher link utilization at the same CPU clock.
موصى به
Industrial Serial Concentrator
Multi-drop industrial protocols like Modbus, Profibus (via HDLC-like framing), and BISYNC can be carried concurrently on the MC68302AG16C's five serial channels, making it a serial concentrator for plant networks. The SMC channels provide slower-speed async or SPI-like interfaces for sensors, while the SCCs aggregate them into a backbone uplink. The integrated DMA moves large block transfers without burdening the CPU, and the parallel I/O port adds bit-banged signaling for legacy equipment. Commercial 0 to 70 C operation suits cabinet-mounted controllers. The 144-pin LQFP provides ample ground and power pins for the noisy industrial environment, simplifying PCB decoupling.
موصى به
Frame Relay Access Device (FRAD)
Frame relay FRADs use the MC68302AG16C's HDLC-capable SCCs to terminate the frame-relay DLCI links and the M68000 core to run the FRAD management software. Hardware bit stuffing, CRC, and zero-insertion on each SCC eliminate the software HDLC tax seen on microcontrollers without serial engines. The DMA controller streams encapsulated frames into external DRAM while the CPU handles congestion management and SNMP. With three SCCs, a single MC68302AG16C can terminate multiple frame-relay PVCs without external bridges. The chip's 16 MHz throughput is sufficient for typical sub-E1 aggregate bandwidths of legacy FRAD installations.
موصى به
Legacy Telecom Backplane Controller
Central-office backplanes in legacy telecom equipment use the MC68302AG16C as a per-line controller, where it manages signaling, alarm collection, and protocol conversion for multiple subscriber lines. The parallel I/O port monitors shelf alarms while the SCCs carry HDLC signaling to the upper-level controller. Hardware interrupt prioritization with seven priority levels allows deterministic handling of line-side events. The M68000 instruction set is well supported by long-lifecycle toolchains and field-proven compilers, which is critical for telecom gear with decades-long deployment horizons. The NRND status makes this part best suited for maintaining installed base rather than new product launches.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC68302AG16C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC68302AG20C | MC68302AG25C | MC68302CAG16 | MC68302RC16C | MC68302AG16B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-pin LQFP (20x20 mm) | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same |
| Maximum Clock Frequency | 16 MHz | 20 MHz | 25 MHz | 16 MHz | 16 MHz | 16 MHz |
| Core | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) |
| Number of SCCs | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of SMCs | 2 | 2 | 2 | 2 | 2 | 2 |
| On-chip RAM | 2 Kbytes | 2 Kbytes | 2 Kbytes | 2 Kbytes | 2 Kbytes | 2 Kbytes |
| Address Bus Width | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
أبرز الفروقات
- Integrated multi-protocol SCCs on-chip (مقابلMC68331CAG16)
- M68000 software compatibility (مقابلNewer ColdFire MCF5282)
- 144-LQFP same-footprint upgradability (مقابلMC68302AG25C)
ملاحظات التصميم
The MC68302AG16C is a 5 V part; decouple each VCC pin with a 0.1 uF ceramic plus a 10 uF bulk tantalum placed within 25 mm of the package. The 144-pin LQFP provides multiple VCC and GND pins distributed around the package; route all VCC pins to the same 5 V plane and stitch a solid ground plane beneath the device. Add a 100 uF bulk cap near the board's 5 V entry point to absorb bus-step transients.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths and 50 ohm characteristic impedance on a 4-layer stackup (signal/GND/VCC/signal). Keep bus traces short - the 16 MHz edge rates generate significant overshoot if traces exceed 50 mm. Place external DRAM chips adjacent to the dedicated RAS/CAS/DRAM pins to minimize skew on the row/column strobes.
Never leave the TEST pin floating - tie TEST directly to GND with a short trace, otherwise the part may enter factory test mode at reset. Always drive BR/BG through proper bus-arbitration logic when connecting a second bus master (e.g., a companion DMA controller), and assert BGACK only after the requesting master has been granted. Do not exceed the 16 MHz CLKIN specification - the AG16C speed grade is not warranted for 20 or 25 MHz operation.
معلومات الامتثال
RoHS, REACH, and lead-free status were not explicitly listed in the verified distributor listings we surveyed. As a 1990s commercial-temperature plastic LQFP, the part may or may not be lead-free finished - request the latest material declaration directly from NXP or your distributor before RoHS-restricted designs.
