MC68302AG16C - 16MHz M68000 Integrated Comm Processor | NXP
Teilenummer: MC68302AG16C ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $21.06 | $21,06 |
| 10 | $19.95 | $199,50 |
| 100 | $17.4 | $1.740,00 |
| 500 | $15.2 | $7.600,00 |
| 1.000 | $13.55 | $13.550,00 |
MC68302AG16C Übersicht
An integrated communications processor (ICP / multi-channel comm controller) is a system-on-chip variant of a microprocessor that adds dedicated serial-channel hardware, DMA, and timers alongside the CPU. It sits in the taxonomy as MPU -> communications processor -> networking SoC -> embedded processor, allowing designers to replace separate UART, DMA, and CPU chips with one device. The MC68302 was the first NXP (then Motorola) device to closely couple an industry-standard MC68000/MC68008 core with a flexible communications architecture, becoming a foundational part for ISDN, modem, router, and X.25 designs.
Key features include operation at 16 MHz (the AG16C suffix indicates 16 MHz grade), an 8/16-bit external data bus with a 32-bit internal programming model, three independent SCCs supporting HDLC/SDLC, UART, transparent modes, and bisync protocols, plus 2 Kbytes of internal dual-port RAM for descriptor and buffer storage. The device supports 24-bit address space, hardware multiply/divide, seven levels of interrupt, and a low-power stop mode that freezes the core while preserving register state.
Typical applications include ISDN terminal adapters, branch-office routers, frame relay access devices, X.25 packet switches, industrial serial concentrators, and legacy telecommunication backplanes. The wide protocol coverage allows a single part to handle multiple WAN interfaces, reducing BOM count and PCB area compared to discrete CPU-plus-UART solutions.
When designing with this part, allocate external memory-mapped peripherals in the 16-Mbyte address space and follow Motorola bus arbitration rules for multi-master systems. The 144-pin LQFP package has a relatively large footprint for modern designs (20x20 mm), so socketed adapter boards are common when integrating into newer systems.
Drop-in-Alternativen für MC68302AG16C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68302AG16C (gleiche Bauform und Footprint) – abweichend in Core Architecture, DMA Channels, Data Bus Width, RoHS Status, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68302AG20C
✅ Drop-In✓ Auf Lager
$54.1 / Stück
Datenblatt ansehen →MC68302AG25C
✅ Drop-In✓ Auf Lager
$16.4 / Stück
Datenblatt ansehen →MC68302CAG16
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC68302RC16C
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$42.5 / Stück
Datenblatt ansehen →MC68302AG16B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC68302AG16C Grenzwerte & elektrische Eigenschaften
| Core Architecture | M68000 (32-bit programming model, 8/16-bit external data bus) |
| Core Family | M683xx / ColdFire-class M68000 |
| Maximale Taktfrequenz | 16 MHz |
| Betriebsversorgungsspannung | 5 V |
| Gehäuse | 144-pin LQFP (20x20 mm) |
| Montageart | Surface Mount |
| Number of Cores | 1 |
| Bit Width | 8/16-bit external / 32-bit internal |
| Address Bus Width | 24-bit |
| On-chip RAM | 2 Kbytes (dual-port) |
| Serial Communications Controllers (SCCs) | 3 |
| Serial Management Controllers (SMCs) | 2 |
| DMA Channels | Yes (multi-channel) |
| Parallel I/O | Yes (general-purpose port) |
| Timers | Yes (timer module) |
| Interrupt Levels | 7 |
| Betriebstemperaturbereich | 0C to +70C (commercial) |
| Tray Packaging | Tray |
MC68302AG16C Pin-Konfiguration
| Pin 1 | A1 — Address bus bit 1 |
| Pin 2 | A2 — Address bus bit 2 |
| Pin 3 | A3 — Address bus bit 3 |
| Pin 4 | A4 — Address bus bit 4 |
| Pin 5 | A5 — Address bus bit 5 |
| Pin 6 | A6 — Address bus bit 6 |
| Pin 7 | A7 — Address bus bit 7 |
| Pin 8 | A8 — Address bus bit 8 |
| Pin 9 | A9 — Address bus bit 9 |
| Pin 10 | A10 — Address bus bit 10 |
| Pin 11 | A11 — Address bus bit 11 |
| Pin 12 | A12 — Address bus bit 12 |
| Pin 13 | A13 — Address bus bit 13 |
| Pin 14 | A14 — Address bus bit 14 |
| Pin 15 | A15 — Address bus bit 15 |
| Pin 16 | A16 — Address bus bit 16 |
| Pin 17 | A17 — Address bus bit 17 |
| Pin 18 | A18 — Address bus bit 18 |
| Pin 19 | A19 — Address bus bit 19 |
| Pin 20 | A20 — Address bus bit 20 |
| Pin 21 | A21 — Address bus bit 21 |
| Pin 22 | A22 — Address bus bit 22 |
| Pin 23 | A23 — Address bus bit 23 |
| Pin 24 | VCC — +5 V power |
| Pin 25 | D0 — Data bus bit 0 |
| Pin 26 | D1 — Data bus bit 1 |
| Pin 27 | D2 — Data bus bit 2 |
| Pin 28 | D3 — Data bus bit 3 |
| Pin 29 | D4 — Data bus bit 4 |
| Pin 30 | D5 — Data bus bit 5 |
| Pin 31 | D6 — Data bus bit 6 |
| Pin 32 | D7 — Data bus bit 7 |
| Pin 33 | D8 — Data bus bit 8 |
| Pin 34 | D9 — Data bus bit 9 |
| Pin 35 | D10 — Data bus bit 10 |
| Pin 36 | D11 — Data bus bit 11 |
| Pin 37 | D12 — Data bus bit 12 |
| Pin 38 | D13 — Data bus bit 13 |
| Pin 39 | D14 — Data bus bit 14 |
| Pin 40 | D15 — Data bus bit 15 |
| Pin 41 | GND — Ground |
| Pin 42 | CS0 — Chip select 0 |
| Pin 43 | CS1 — Chip select 1 |
| Pin 44 | CS2 — Chip select 2 |
| Pin 45 | CS3 — Chip select 3 |
| Pin 46 | CS4 — Chip select 4 |
| Pin 47 | CS5 — Chip select 5 |
| Pin 48 | BR — Bus request |
| Pin 49 | BG — Bus grant |
| Pin 50 | BGACK — Bus grant acknowledge |
| Pin 51 | RESET — Hardware reset (active low) |
| Pin 52 | HALT — Halt (active low) |
| Pin 53 | CLKIN — Clock input |
| Pin 54 | CLKOUT — Clock output |
| Pin 55 | IPL0 — Interrupt priority level 0 |
| Pin 56 | IPL1 — Interrupt priority level 1 |
| Pin 57 | IPL2 — Interrupt priority level 2 |
| Pin 58 | AS — Address strobe |
| Pin 59 | DS — Data strobe |
| Pin 60 | R/W — Read/Write control |
| Pin 61 | DTACK — Data transfer acknowledge |
| Pin 62 | AVEC — Autovector |
| Pin 63 | BERR — Bus error |
| Pin 64 | VCC — +5 V power |
| Pin 65 | SCC1_RXD — SCC1 receive data |
| Pin 66 | SCC1_TXD — SCC1 transmit data |
| Pin 67 | SCC1_RTS — SCC1 request to send |
| Pin 68 | SCC1_CTS — SCC1 clear to send |
| Pin 69 | SCC1_CD — SCC1 carrier detect |
| Pin 70 | SCC1_CTS_BRG — SCC1 CTS / baud-rate generator |
| Pin 71 | SCC2_RXD — SCC2 receive data |
| Pin 72 | SCC2_TXD — SCC2 transmit data |
| Pin 73 | SCC2_RTS — SCC2 request to send |
| Pin 74 | SCC2_CTS — SCC2 clear to send |
| Pin 75 | SCC2_CD — SCC2 carrier detect |
| Pin 76 | GND — Ground |
| Pin 77 | SCC3_RXD — SCC3 receive data |
| Pin 78 | SCC3_TXD — SCC3 transmit data |
| Pin 79 | SCC3_RTS — SCC3 request to send |
| Pin 80 | SCC3_CTS — SCC3 clear to send |
| Pin 81 | SCC3_CD — SCC3 carrier detect |
| Pin 82 | SMC1_RXD — SMC1 receive data |
| Pin 83 | SMC1_TXD — SMC1 transmit data |
| Pin 84 | SMC2_RXD — SMC2 receive data |
| Pin 85 | SMC2_TXD — SMC2 transmit data |
| Pin 86 | VCC — +5 V power |
| Pin 87 | P0 — Parallel I/O port bit 0 |
| Pin 88 | P1 — Parallel I/O port bit 1 |
| Pin 89 | P2 — Parallel I/O port bit 2 |
| Pin 90 | P3 — Parallel I/O port bit 3 |
| Pin 91 | P4 — Parallel I/O port bit 4 |
| Pin 92 | P5 — Parallel I/O port bit 5 |
| Pin 93 | P6 — Parallel I/O port bit 6 |
| Pin 94 | P7 — Parallel I/O port bit 7 |
| Pin 95 | TIN1 — Timer 1 input |
| Pin 96 | TOUT1 — Timer 1 output |
| Pin 97 | TIN2 — Timer 2 input |
| Pin 98 | TOUT2 — Timer 2 output |
| Pin 99 | DREQ0 — DMA request 0 |
| Pin 100 | DACK0 — DMA acknowledge 0 |
| Pin 101 | DREQ1 — DMA request 1 |
| Pin 102 | DACK1 — DMA acknowledge 1 |
| Pin 103 | DONE — DMA done |
| Pin 104 | GND — Ground |
| Pin 105 | RAS0 — DRAM row address strobe 0 |
| Pin 106 | RAS1 — DRAM row address strobe 1 |
| Pin 107 | CAS0 — DRAM column address strobe 0 |
| Pin 108 | CAS1 — DRAM column address strobe 1 |
| Pin 109 | WE — Write enable |
| Pin 110 | OE — Output enable |
| Pin 111 | VCC — +5 V power |
| Pin 112 | FC0 — Function code 0 |
| Pin 113 | FC1 — Function code 1 |
| Pin 114 | FC2 — Function code 2 |
| Pin 115 | RMC — Read-modify-write |
| Pin 116 | SIZ0 — Transfer size 0 |
| Pin 117 | SIZ1 — Transfer size 1 |
| Pin 118 | DBEN — Data bus enable |
| Pin 119 | FREEZE — Freeze output (background debug) |
| Pin 120 | IPIPE0 — Instruction pipe 0 (debug) |
| Pin 121 | IPIPE1 — Instruction pipe 1 (debug) |
| Pin 122 | GND — Ground |
| Pin 123 | TEST — Test mode (factory, tie low in application) |
| Pin 124 | TCLK — Test clock (factory) |
| Pin 125 | TMS — JTAG test mode select |
| Pin 126 | TCK — JTAG test clock |
| Pin 127 | TDI — JTAG test data in |
| Pin 128 | TDO — JTAG test data out |
| Pin 129 | TRST — JTAG test reset |
| Pin 130 | VCC — +5 V power |
| Pin 131 | A0 — Address bus bit 0 (LSB) |
| Pin 132 | LDS — Lower data strobe |
| Pin 133 | UDS — Upper data strobe |
| Pin 134 | GND — Ground |
| Pin 135 | PORTC0 — Port C bit 0 |
| Pin 136 | PORTC1 — Port C bit 1 |
| Pin 137 | PORTC2 — Port C bit 2 |
| Pin 138 | PORTC3 — Port C bit 3 |
| Pin 139 | PORTC4 — Port C bit 4 |
| Pin 140 | PORTC5 — Port C bit 5 |
| Pin 141 | PORTC6 — Port C bit 6 |
| Pin 142 | PORTC7 — Port C bit 7 |
| Pin 143 | PORTC8 — Port C bit 8 |
| Pin 144 | PORTC9 — Port C bit 9 |
Typische Anwendungen
MC68302AG16C ist geeignet für 6 Anwendungs: ISDN Terminal Adapter, Branch-Office Router, X.25 Packet Switch, Industrial Serial Concentrator, Frame Relay Access Device (FRAD), Legacy Telecom Backplane Controller.
ISDN Terminal Adapter
The MC68302AG16C is a classic fit for ISDN terminal adapters because its three on-chip Serial Communications Controllers natively support HDLC framing required by ISDN BRI and PRI channels. Each SCC can be assigned to a B or D channel, eliminating the need for an external HDLC controller and significantly reducing BOM cost. The integrated DMA engine moves packet data between the SCC FIFOs and external RAM without CPU intervention, freeing the 16 MHz M68000 core for upper-layer protocol processing. With 2 Kbytes of dual-port RAM for buffer descriptors, designers can queue multiple frames per channel while maintaining deterministic latency. Compared to a discrete M68000 + UART solution, the MC68302AG16C cuts PCB area and component count while preserving the established M68000 software toolchain.
Empfohlen
Branch-Office Router
In branch-office router designs the MC68302AG16C's multi-protocol SCCs handle WAN-side HDLC/PPP/frame-relay links while one SMC manages the Ethernet or console UART interface. The 16 MHz M68000 core runs routing table lookups and IP/ICMP processing with predictable instruction timing, an advantage over speculative CPUs for real-time packet forwarding. Hardware bus arbitration allows direct connection to a downstream Ethernet MAC without glue logic. The integrated DMA offloads bulk packet movement, leaving CPU bandwidth for management and routing protocols. Its 24-bit address bus supports up to 16 Mbytes of DRAM plus flash, sufficient for routing tables in small-office installations.
Empfohlen
X.25 Packet Switch
The MC68302AG16C's SCCs implement the LAPB data-link layer of X.25 directly in hardware, while the M68000 core executes the X.25 packet-level protocol and call setup state machine. The dual-port 2 Kbyte on-chip RAM is well suited for descriptor rings that queue frames per virtual circuit without external logic. Designers can dedicate one SCC to each X.25 link and a third to a higher-layer backbone interface. The chip's deterministic interrupt latency and bus arbitration timing allow X.25 timers and retransmission deadlines to be met reliably. Compared to soft-implemented HDLC on a generic MCU, the MC68302AG16C's hardware CRC and bit stuffing deliver higher link utilization at the same CPU clock.
Empfohlen
Industrial Serial Concentrator
Multi-drop industrial protocols like Modbus, Profibus (via HDLC-like framing), and BISYNC can be carried concurrently on the MC68302AG16C's five serial channels, making it a serial concentrator for plant networks. The SMC channels provide slower-speed async or SPI-like interfaces for sensors, while the SCCs aggregate them into a backbone uplink. The integrated DMA moves large block transfers without burdening the CPU, and the parallel I/O port adds bit-banged signaling for legacy equipment. Commercial 0 to 70 C operation suits cabinet-mounted controllers. The 144-pin LQFP provides ample ground and power pins for the noisy industrial environment, simplifying PCB decoupling.
Empfohlen
Frame Relay Access Device (FRAD)
Frame relay FRADs use the MC68302AG16C's HDLC-capable SCCs to terminate the frame-relay DLCI links and the M68000 core to run the FRAD management software. Hardware bit stuffing, CRC, and zero-insertion on each SCC eliminate the software HDLC tax seen on microcontrollers without serial engines. The DMA controller streams encapsulated frames into external DRAM while the CPU handles congestion management and SNMP. With three SCCs, a single MC68302AG16C can terminate multiple frame-relay PVCs without external bridges. The chip's 16 MHz throughput is sufficient for typical sub-E1 aggregate bandwidths of legacy FRAD installations.
Empfohlen
Legacy Telecom Backplane Controller
Central-office backplanes in legacy telecom equipment use the MC68302AG16C as a per-line controller, where it manages signaling, alarm collection, and protocol conversion for multiple subscriber lines. The parallel I/O port monitors shelf alarms while the SCCs carry HDLC signaling to the upper-level controller. Hardware interrupt prioritization with seven priority levels allows deterministic handling of line-side events. The M68000 instruction set is well supported by long-lifecycle toolchains and field-proven compilers, which is critical for telecom gear with decades-long deployment horizons. The NRND status makes this part best suited for maintaining installed base rather than new product launches.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68302AG16C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68302AG20C | MC68302AG25C | MC68302CAG16 | MC68302RC16C | MC68302AG16B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-pin LQFP (20x20 mm) | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same | 144-pin LQFP (20x20 mm) - same |
| Maximum Clock Frequency | 16 MHz | 20 MHz | 25 MHz | 16 MHz | 16 MHz | 16 MHz |
| Core | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) | M68000 (32-bit PM) |
| Number of SCCs | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of SMCs | 2 | 2 | 2 | 2 | 2 | 2 |
| On-chip RAM | 2 Kbytes | 2 Kbytes | 2 Kbytes | 2 Kbytes | 2 Kbytes | 2 Kbytes |
| Address Bus Width | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Wichtigste Unterscheidungsmerkmale
- Integrated multi-protocol SCCs on-chip (vs. MC68331CAG16)
- M68000 software compatibility (vs. Newer ColdFire MCF5282)
- 144-LQFP same-footprint upgradability (vs. MC68302AG25C)
Designhinweise
The MC68302AG16C is a 5 V part; decouple each VCC pin with a 0.1 uF ceramic plus a 10 uF bulk tantalum placed within 25 mm of the package. The 144-pin LQFP provides multiple VCC and GND pins distributed around the package; route all VCC pins to the same 5 V plane and stitch a solid ground plane beneath the device. Add a 100 uF bulk cap near the board's 5 V entry point to absorb bus-step transients.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths and 50 ohm characteristic impedance on a 4-layer stackup (signal/GND/VCC/signal). Keep bus traces short - the 16 MHz edge rates generate significant overshoot if traces exceed 50 mm. Place external DRAM chips adjacent to the dedicated RAS/CAS/DRAM pins to minimize skew on the row/column strobes.
Never leave the TEST pin floating - tie TEST directly to GND with a short trace, otherwise the part may enter factory test mode at reset. Always drive BR/BG through proper bus-arbitration logic when connecting a second bus master (e.g., a companion DMA controller), and assert BGACK only after the requesting master has been granted. Do not exceed the 16 MHz CLKIN specification - the AG16C speed grade is not warranted for 20 or 25 MHz operation.
Compliance-Informationen
RoHS, REACH, and lead-free status were not explicitly listed in the verified distributor listings we surveyed. As a 1990s commercial-temperature plastic LQFP, the part may or may not be lead-free finished - request the latest material declaration directly from NXP or your distributor before RoHS-restricted designs.
