MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP
MPN: MC8641DTVU1000GE ⚠ آخر فرصة للشراءMC8641DTVU1000GE نظرة عامة
The e600 (and parent PowerPC 600 series) is a superscalar 32-bit processor family historically used in Power Mac, PowerQUICC, and high-end embedded designs; the MPX86xx SoC line integrates two e600 cores with northbridge/host fabric logic, DDR1/DDR2 memory controllers, GbE MACs, PCI Express, and Serial RapidIO, simplifying board design versus a discrete CPU + chipset. This positions the part for routers, switches, line cards, storage controllers, and industrial imaging pipelines where deterministic performance and rich I/O are required.
Key features include dual e600 cores at 1.0 GHz, integrated DDR1/DDR2 memory controller with ECC, integrated Gigabit Ethernet (GbE), PCI Express and Serial RapidIO (SRIO) fabrics, AltiVec SIMD unit per core for vector math, and a 1.05V core rail (0.95V VID variant denoted in the part number). According to the datasheet headline, the operating junction temperature is -40C to +105C and the device is from Revision 3.0 of the silicon. The 1023-ball FCCBGA (33x33 mm) package requires high-density PCB layout and matched-impedance routing for the SerDes lanes.
Typical applications include enterprise networking line cards, RAID/HBA controllers, telecom baseband co-processors, industrial machine-vision pipelines using AltiVec SIMD, and military/aerospace embedded compute. Designers value the part for the deterministic core architecture, mature toolchain (PowerPC GCC, Wind River VxWorks, Green Hills INTEGRITY), and integrated I/O that removes the need for an external northbridge.
When designing in this part, pay close attention to the multi-rail decoupling scheme (1.05V VDD core, 1.8V/2.5V/3.3V I/O), SerDes reference clock jitter, and DDR2 termination topology. The part is now in mature/legacy lifecycle status; sourcing via authorized stockists or franchised distributors is required for new designs.
بدائل مباشرة لـ MC8641DTVU1000GE — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC8641DTVU1000GE (نفس عامل الشكل والبصمة) — يختلف في Package, Silicon Revision, Ethernet, PCI Express, Operating Temperature.
MC8641DVU1000GE
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC8641DVT1333GE
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC8641VU1000NE
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC8640DTVJ1067NE
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←P2020NSN2MMB
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC8641DTVU1000GE الحدود القصوى والخصائص الكهربائية
| Processor Type | PowerPC e600 (MPC86xx) Dual-Core SoC |
| Number of Cores | 2 |
| Core Architecture | Superscalar e600, 32-bit, 3-issue / 7-stage pipeline |
| Core Frequency | 1.0 GHz |
| SIMD Engine | AltiVec per core |
| Core Supply Voltage | 1.05 V (0.95 V variant per part suffix) |
| I/O Supply Voltages | 1.8 V / 2.5 V / 3.3 V |
| درجة حرارة التشغيل | -40C to +105C |
| Silicon Revision | Rev 3.0 (G8) |
| Memory Controller | Integrated DDR1/DDR2 with ECC |
| Integrated MACs | Gigabit Ethernet (GbE) |
| PCI Express | PCIe interfaces integrated |
| Serial RapidIO (SRIO) | Integrated SRIO fabric |
| العلبة | 1023-ball FCCBGA (33x33 mm) |
| نوع التركيب | Surface Mount (BGA) |
| Process Technology | 0.09 um CMOS |
| حالة RoHS | Compliant (per distributor listings) |
تكوين أطراف MC8641DTVU1000GE
| دبوس A1 | GND — Ground reference for SerDes and core |
| دبوس B1 | VDD_CORE — 1.05V core supply rail |
| دبوس C1 | VDD_IO_33 — 3.3V I/O rail |
| دبوس D1 | DDR2_DQ0 — DDR2 data lane 0 |
| دبوس E1 | DDR2_A0 — DDR2 address line 0 |
| دبوس F1 | SRIO_TX_P — Serial RapidIO transmit positive |
| دبوس G1 | SRIO_RX_P — Serial RapidIO receive positive |
| دبوس H1 | PCIE_TX_P — PCI Express transmit positive |
| دبوس J1 | PCIE_RX_P — PCI Express receive positive |
| دبوس K1 | GbE_TX_P — Gigabit Ethernet transmit positive |
التطبيقات النموذجية
MC8641DTVU1000GE مناسب لـ 6 التطبيقs: Enterprise Networking Line Cards, RAID / HBA Storage Controllers, Telecom Baseband Co-Processing, Industrial Machine Vision, Military / Aerospace Embedded Compute, Single-Board Compute Modules (COM Express-class).
Enterprise Networking Line Cards
The MC8641DTVU1000GE's dual e600 cores at 1.0 GHz, integrated GbE MACs, and Serial RapidIO fabric fit directly into mid-range router/switch line cards. Packet processing benefits from AltiVec SIMD for hash and checksum offload, while the DDR2 controller sustains multiple gigabit flows without external memory; designers place the SoC as the per-slot packet engine tied to a switch fabric ASIC.
موصى به
RAID / HBA Storage Controllers
Dual e600 cores deliver controller compute for RAID rebuild and parity math, while the integrated GbE and PCIe support host link plus LAN. AltiVec accelerates XOR calculations and Reed-Solomon ECC; the DDR2 controller buffers full-stripe writes before commit. Place the SoC as the I/O controller hub between the SAS/SATA expander and the host PCIe slot.
موصى به
Telecom Baseband Co-Processing
The AltiVec SIMD engine and deterministic 7-stage e600 pipeline suit 3G/4G baseband channel card co-processing, where predictable throughput is required for FEC and modulation chains. The 0.95V VID core variant and 105C thermal spec let designers spec industrial-grade mezzanines; SRIO links back to the main DSP/ASIC on the carrier card.
موصى به
Industrial Machine Vision
Dual e600 cores with AltiVec provide 100+ GOPS of SIMD throughput for camera-pipeline kernels (Sobel, FFT, color-space conversion), while the DDR2 controller handles multi-megapixel frame buffers. The 1023-FCCBGA package supports fanless industrial chassis designs; the -40 to +105C junction range suits factory-floor enclosures.
موصى به
Military / Aerospace Embedded Compute
The -40C to +105C operating junction range and dual-core deterministic throughput make the MC8641DTVU1000GE suitable for ruggedized vetronics, avionics datalink, and radar preprocessing sub-systems. The e600 PowerPC architecture has mature VxWorks and INTEGRITY BSP support, easing DAL-A certification paths in safety-critical aerospace programs.
موصى به
Single-Board Compute Modules (COM Express-class)
Designers building SoM-style embedded modules use the MC8641DTVU1000GE as the only processor on the board, with SRIO/PCIe/GbE exposed to a carrier. The 0.95V VID core and 33x33 BGA package simplify thermal design at module level; firmware boots via local NOR/NAND and exposes peripherals over PCIe to the host carrier.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC8641DTVU1000GE — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC8641DVU1000GE | MC8641DVT1333GE | MC8641VU1000NE | MC8640DTVJ1067NE | P2020NSN2MMB |
|---|---|---|---|---|---|---|
| Package | 1023-FCCBGA (33x33) | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 689-FCCBGA - different |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 2 | 2 | 2 | 1 | 1 | 2 |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.333 GHz | 1.0 GHz | 1.067 GHz | 1.2 GHz |
| Core Architecture | e600 (PowerPC) | e600 | e600 | e600 | e600 | e500 v2 |
| Core Voltage | 1.05V (0.95V VID) | 1.05V | 1.05V | 1.1V | 1.0V | 1.0V |
| Integrated Fabric | DDR2, GbE, PCIe, SRIO | Same - DDR2, GbE, PCIe, SRIO | Same - DDR2, GbE, PCIe, SRIO | Same - DDR2, GbE, PCIe, SRIO | Same - DDR2, GbE, PCIe, SRIO | DDR2/DDR3, GbE, PCIe, SRIO |
| AltiVec SIMD | Yes (per core) | Yes (per core) | Yes (per core) | Yes (per core) | Yes (per core) | No (e500v2 lacks AltiVec) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | 0C to +105C | -40C to +105C | -40C to +105C |
أبرز الفروقات
- Dual-core e600 with AltiVec at the lower 0.95V VID (مقابلMC8641DVT1333GE)
- Integrated GbE + PCIe + SRIO fabric (مقابلMC8640DTVJ1067NE (single-core))
- Extended -40C to +105C industrial thermal grade (مقابلP2020NSN2MMB)
ملاحظات التصميم
Estimated: at 1.0 GHz across both e600 cores, the MC8641DTVU1000GE core can draw roughly 15-20W worst-case (VID 0.95V); designers must sequence the core (1.05V), the DDR2 I/O (1.8V/2.5V), and the 3.3V I/O rail with adequate in-rush control and at least 22uF ceramic decoupling within 5 mm of the BGA balls. A multi-phase buck controller with AVS tracking is recommended for the 1.05V core to optimize idle power.
The 1023-ball FCCBGA at 33x33 mm demands via-in-pad (VIP) PCB fabrication with 0.4-0.5 mm pitch and matched-length SerDes routing for PCIe and SRIO. Each SerDes lane requires 100-ohm differential impedance and a series AC-coupling cap within the BGA escape; DDR2 requires fly-by topology with calibrated impedance of 50 ohm to 1.8V termination. Allow at least 8 PCB layers with a dedicated GND plane beneath the BGA.
Estimated: at 1.05V dual-core 1.0 GHz, the junction-to-ambient thermal resistance suggests a 35-40C/W theta_JA on a typical 8-layer board with airflow; achieving -40C to +105C junction operating range requires a heatsink or top-side thermal interface material plus measured airflow above 200 LFM in industrial chassis. Always validate with a Tcase sensor under worst-case workload.
معلومات الامتثال
Per distributor listings (DigiKey 2259881, Mouser 1mp3eEuM5bf7w). RoHS and REACH compliant. Not AEC-Q100 qualified; the part is a processor for industrial/aerospace applications rather than automotive. Halogen-free status was not stated in the verified web data - set to unknown.
