MC9S12E64VFUE16R - 16-bit HCS12 MCU, 64KB Flash, 80-QFP | NXP
MPN: MC9S12E64VFUE16R ✓ نشطMC9S12E64VFUE16R نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and programmable peripherals such as timers, communication interfaces, and analog-to-digital converters. The HCS12 family from NXP is built on the Freescale (now NXP) legacy 16-bit CISC architecture optimized for automotive and industrial real-time control, where deterministic interrupt response, on-chip EEPROM, and CAN connectivity simplify physical layer integration into vehicle networks.
Key features include a Phase-Locked Loop (PLL) clock synthesizer that allows power consumption and performance to be tuned to operational requirements, an on-chip bandgap-based voltage regulator (Vreg) that derives the internal logic supply from the external 5 V rail, and Background Debug Mode (BDM) for non-intrusive in-circuit debugging. The 80-QFP package provides ample general-purpose I/O for body controllers, instrument clusters, and sensor interface modules.
Technically, the MC9S12E core executes the HCS12 instruction set with full 16-bit data paths, supporting up to 50 MHz bus speed derived from an external crystal or oscillator through the PLL. The on-chip Flash supports in-application programming and security features such as a flash lock bit. The integrated CAN 2.0A/B module, multiple SCI/UART channels, and SPI/SSI peripherals position the device for distributed automotive networks.
Typical applications include automotive body control modules, instrument cluster controllers, HVAC lighting, sensor interface nodes, CAN node endpoints, and industrial automation controllers. The wide operating voltage and AEC-Q100 qualification also make it suitable for non-automotive industrial embedded designs that require a 16-bit core.
Designers should pay attention to the decoupling network, PLL loop-filter component values, and BDM connector pinout when migrating designs across MC9S12E family variants. The 'E128' and 'E64' differ only in Flash density; the 'CFUE' (112-pin) and 'VFUE16' (80-pin) variants differ in package and pinout.
This page synthesizes NXP datasheet excerpts, distributor pricing from Mouser/DigiKey/Octopart, and engineering guidance to help engineers select, source, and design with the MC9S12E64VFUE16R efficiently.
بدائل مباشرة لـ MC9S12E64VFUE16R — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC9S12E64VFUE16R (نفس عامل الشكل والبصمة) — يختلف في Package.
MC9S12E64VFUE16
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC9S12E64CFUE
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC9S12E128VFUE
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC9S12E64CPVE
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←S9S12GN48F1CLFR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC9S12GN48CLFR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC9S12E64VFUE16R الحدود القصوى والخصائص الكهربائية
| Core Architecture | HCS12 (16-bit CISC) |
| Program Memory (Flash) | 64 KB |
| RAM | 2 KB |
| EEPROM | 1 KB |
| Maximum Bus Frequency | 50 MHz |
| جهد التغذية | 2.5 V / 3.3 V / 5 V |
| العلبة | 80-QFP (QFP-80, 14x14 mm) |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +105C (automotive AEC-Q100) |
| ADC | 8-channel, 10-bit |
| CAN Module | 1x CAN 2.0A/B |
| SCI/UART | 2 channels |
| SPI | 1 channel |
| On-chip Voltage Regulator | Yes (bandgap-based Vreg) |
| PLL | Yes (crystal multiplier) |
| Debug Interface | Background Debug Mode (BDM) |
| AEC-Q100 Qualified | Yes |
| حالة RoHS | Compliant |
تكوين أطراف MC9S12E64VFUE16R
| دبوس 1 | VSS — Digital ground |
| دبوس 2 | VDDR — External voltage regulator supply |
| دبوس 3 | VSS — Digital ground |
| دبوس 4 | VDDX — External I/O supply |
| دبوس 5 | RESET — External reset input, active low |
| دبوس 6 | BKGD — Background Debug Mode data |
| دبوس 7 | MODC — Mode control for BDM |
| دبوس 8 | XTAL — Crystal oscillator output |
| دبوس 9 | EXTAL — Crystal oscillator input or external clock |
| دبوس 10 | VSSPLL — PLL ground |
| دبوس 11 | VDDPLL — PLL supply |
| دبوس 12 | TEST — Test mode pin, tie to VSS |
| دبوس 13 | PAD0 — Port A bit 0 (also AN0) |
| دبوس 14 | PAD1 — Port A bit 1 (also AN1) |
| دبوس 15 | PAD2 — Port A bit 2 (also AN2) |
| دبوس 16 | PAD3 — Port A bit 3 (also AN3) |
| دبوس 17 | PAD4 — Port A bit 4 (also AN4) |
| دبوس 18 | PAD5 — Port A bit 5 (also AN5) |
| دبوس 19 | PAD6 — Port A bit 6 (also AN6) |
| دبوس 20 | PAD7 — Port A bit 7 (also AN7) |
| دبوس 21 | VSS — Digital ground |
| دبوس 22 | VDDX — External I/O supply |
| دبوس 23 | PWM0 — PWM channel 0 output |
| دبوس 24 | PWM1 — PWM channel 1 output |
| دبوس 25 | PWM2 — PWM channel 2 output |
| دبوس 26 | PWM3 — PWM channel 3 output |
| دبوس 27 | PWM4 — PWM channel 4 output |
| دبوس 28 | PWM5 — PWM channel 5 output |
| دبوس 29 | PWM6 — PWM channel 6 output |
| دبوس 30 | PWM7 — PWM channel 7 output |
| دبوس 31 | VSS — Digital ground |
| دبوس 32 | VDDX — External I/O supply |
| دبوس 33 | PM0 — Port M bit 0 (CAN TX) |
| دبوس 34 | PM1 — Port M bit 1 (CAN RX) |
| دبوس 35 | PM2 — Port M bit 2 |
| دبوس 36 | PM3 — Port M bit 3 |
| دبوس 37 | PM4 — Port M bit 4 |
| دبوس 38 | PM5 — Port M bit 5 |
| دبوس 39 | PM6 — Port M bit 6 |
| دبوس 40 | PM7 — Port M bit 7 |
| دبوس 41 | VSS — Digital ground |
| دبوس 42 | VDDX — External I/O supply |
| دبوس 43 | PN0 — Port N bit 0 |
| دبوس 44 | PN1 — Port N bit 1 |
| دبوس 45 | PN2 — Port N bit 2 |
| دبوس 46 | PN3 — Port N bit 3 |
| دبوس 47 | PN4 — Port N bit 4 |
| دبوس 48 | PN5 — Port N bit 5 |
| دبوس 49 | PN6 — Port N bit 6 |
| دبوس 50 | PN7 — Port N bit 7 |
| دبوس 51 | VSS — Digital ground |
| دبوس 52 | VDDX — External I/O supply |
| دبوس 53 | PP0 — Port P bit 0 (PWM or GPIO) |
| دبوس 54 | PP1 — Port P bit 1 (PWM or GPIO) |
| دبوس 55 | PP2 — Port P bit 2 (PWM or GPIO) |
| دبوس 56 | PP3 — Port P bit 3 (PWM or GPIO) |
| دبوس 57 | PP4 — Port P bit 4 (PWM or GPIO) |
| دبوس 58 | PP5 — Port P bit 5 (PWM or GPIO) |
| دبوس 59 | PP6 — Port P bit 6 (PWM or GPIO) |
| دبوس 60 | PP7 — Port P bit 7 (PWM or GPIO) |
| دبوس 61 | VSS — Digital ground |
| دبوس 62 | VDDX — External I/O supply |
| دبوس 63 | PS0 — Port S bit 0 (SCI TX) |
| دبوس 64 | PS1 — Port S bit 1 (SCI RX) |
| دبوس 65 | PS2 — Port S bit 2 (SPI SCK) |
| دبوس 66 | PS3 — Port S bit 3 (SPI MOSI) |
| دبوس 67 | PS4 — Port S bit 4 (SPI MISO or SS) |
| دبوس 68 | PS5 — Port S bit 5 |
| دبوس 69 | PS6 — Port S bit 6 |
| دبوس 70 | PS7 — Port S bit 7 |
| دبوس 71 | VSS — Digital ground |
| دبوس 72 | VDDX — External I/O supply |
| دبوس 73 | PT0 — Port T bit 0 (TIM channel 0) |
| دبوس 74 | PT1 — Port T bit 1 (TIM channel 1) |
| دبوس 75 | PT2 — Port T bit 2 (TIM channel 2) |
| دبوس 76 | PT3 — Port T bit 3 (TIM channel 3) |
| دبوس 77 | PT4 — Port T bit 4 (TIM channel 4) |
| دبوس 78 | PT5 — Port T bit 5 (TIM channel 5) |
| دبوس 79 | PT6 — Port T bit 6 (TIM channel 6) |
| دبوس 80 | PT7 — Port T bit 7 (TIM channel 7) |
التطبيقات النموذجية
MC9S12E64VFUE16R مناسب لـ 6 التطبيقs: Automotive Body Control Module (BCM), Automotive Instrument Cluster Controller, CAN Node Endpoint / Sensor Interface, HVAC Lighting and Climate Control, Industrial CAN-Based Automation Controller, Automotive Gateway / Network Bridge.
Automotive Body Control Module (BCM)
The MC9S12E64VFUE16R fits automotive BCM designs because its integrated CAN 2.0A/B module and HCS12 core deliver deterministic real-time control for body electronics. With 64 KB Flash, it accommodates typical BCM firmware stacks including lighting control, door lock state machines, and CAN message handling while leaving headroom for bootloaders and OBD-II diagnostic libraries. The on-chip bandgap Vreg derives the internal logic supply directly from the 12 V automotive rail via an external regulator, simplifying the power tree. AEC-Q100 qualification and -40C to +105C operating range ensure compliance with automotive reliability standards. The 80-QFP footprint provides sufficient GPIO for typical BCM pin counts without forcing the larger 112-QFP CFUE variant.
موصى به
Automotive Instrument Cluster Controller
For instrument cluster applications, the MC9S12E64VFUE16R provides the right balance of Flash density, CAN connectivity, and peripheral count. The 50 MHz HCS12 core drives gauge stepper motors or LCD segment drivers via SPI, while the integrated 8-channel 10-bit ADC reads fuel level, coolant temperature, and battery voltage sensors. The 64 KB Flash holds gauge calibration tables, warning logic, and CAN-based diagnostics messaging. AEC-Q100 qualification and the wide 2.5V-5V supply range support the harsh automotive electrical environment including load-dump transients. The 80-QFP package is the standard footprint for mid-complexity cluster designs.
موصى به
CAN Node Endpoint / Sensor Interface
The MC9S12E64VFUE16R is ideal for distributed CAN sensor nodes because its integrated CAN 2.0A/B controller, 8-channel ADC, and HCS12 core handle sensor signal conditioning and CAN message framing in a single chip. 64 KB Flash accommodates sensor calibration curves, CANopen or J1939 stack fragments, and diagnostic handlers. The on-chip Vreg simplifies the power tree by eliminating external logic-supply LDOs. With 2 KB RAM and 1 KB EEPROM, the device supports non-volatile parameter storage for sensor offsets and production calibration data. AEC-Q100 compliance makes it directly usable in safety-relevant sensor nodes such as wheel-speed, steering-angle, or battery-monitoring modules.
موصى به
HVAC Lighting and Climate Control
The MC9S12E64VFUE16R's 16-bit HCS12 core and 50 MHz bus speed suit HVAC lighting and climate control modules that combine PWM-driven fans, temperature sensors, and CAN-based climate network connectivity. The 8-channel 10-bit ADC reads cabin temperature, evaporator temperature, and potentiometer inputs, while SCI channels drive LIN sub-nets for actuator nodes. 64 KB Flash is sufficient for PID climate control loops, fault detection, and CAN diagnostics. The 80-QFP package matches the typical pin count of mid-tier HVAC modules, and the AEC-Q100 grade ensures operation across the automotive temperature range.
موصى به
Industrial CAN-Based Automation Controller
Outside automotive, the MC9S12E64VFUE16R's CAN module and 16-bit HCS12 architecture make it a strong fit for industrial CANopen and DeviceNet controller nodes. With 64 KB Flash and 2 KB RAM, it implements CANopen CiA 401/402/402 profiles for I/O modules, drives, or gateways. The 50 MHz bus speed and deterministic interrupt response support real-time industrial control loops. The wide 2.5V-5V supply and robust QFP package handle industrial EMI environments. Engineers can leverage the BDM debug port with CodeWarrior or third-party HCS12 toolchains for development, and the on-chip EEPROM enables non-volatile parameter storage for industrial node configuration.
موصى به
Automotive Gateway / Network Bridge
For low-complexity automotive gateways bridging powertrain CAN to body CAN sub-networks, the MC9S12E64VFUE16R delivers adequate Flash (64 KB) for routing tables, message filter configuration, and gateway diagnostic handlers. The single CAN module limits true multi-bus gateway designs, but for point-to-point bridges with SCI/SPI side channels it fits well. The HCS12 core's deterministic interrupt latency preserves CAN message timing across the bridge. AEC-Q100 grade and the automotive operating temperature range meet OEM qualification requirements. The 80-QFP footprint is well-supported across standard automotive PCB stackups.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC9S12E64VFUE16R — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC9S12E64VFUE16 | MC9S12E64CFUE | MC9S12E128VFUE | S9S12GN48F1CLFR | MC9S12GN48CLFR |
|---|---|---|---|---|---|---|
| Package | 80-QFP (QFP-80, 14x14 mm) | 80-QFP (QFP-80, 14x14 mm) - same | 80-QFP (QFP-80, 14x14 mm) - same | 80-QFP (QFP-80, 14x14 mm) - same | 80-QFP (QFP-80) - same footprint | 80-QFP (QFP-80) - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) - same | HCS12 (16-bit CISC) - same | HCS12 (16-bit CISC) - same | S12G (16-bit CISC) - same family | S12G (16-bit CISC) - same family |
| Flash Memory | 64 KB | 64 KB - same | 64 KB - same | 128 KB (+100%) | 48 KB (-25%) | 48 KB (-25%) |
| RAM | 2 KB | 2 KB - same | 2 KB - same | 4 KB (+100%) | 2 KB - same | 2 KB - same |
| Maximum Bus Frequency | 50 MHz | 50 MHz - same | 50 MHz - same | 50 MHz - same | 25 MHz (-50%) | 25 MHz (-50%) |
| CAN Module | 1x CAN 2.0A/B | 1x CAN 2.0A/B - same | 1x CAN 2.0A/B - same | 1x CAN 2.0A/B - same | 1x CAN 2.0A/B - same | 1x CAN 2.0A/B - same |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| Packaging Format | Tape & Reel | Tray (no reel) | Tray | Tray | Tape & Reel | Tape & Reel |
أبرز الفروقات
- Same NXP S12E family core with 100% Flash density match (مقابلMC9S12E64VFUE16 (tray variant))
- Cost-optimized HCS12 footprint for medium-density firmware (مقابلMC9S12E128VFUE (128 KB Flash))
- Legacy HCS12 core with full peripheral set for automotive (مقابلS9S12GN48F1CLFR (S12G 48 KB))
ملاحظات التصميم
The MC9S12E64VFUE16R requires an external 5 V (or 3.3 V) supply on VDDX/VDDR plus a clean analog/digital ground. The on-chip Vreg derives the internal 2.5 V logic supply; per NXP guidance, place 100 nF and 4.7 uF decoupling caps close to each VDDX pin and a ferrite bead between VDDX and VDDR if high-current analog blocks (ADC) share the rail. Avoid switching the VDDR supply without first removing VDDX to prevent internal latchup. Reference: NXP MC9S12E128RMV1 reference manual, power-supply chapter.
Estimated: at the 80-QFP package's typical theta_JA of ~50 C/W on a 4-layer PCB with moderate copper, the MC9S12E64VFUE16R dissipates under 200 mW during normal operation, keeping the junction well below the 125 C automotive maximum. At -40 C cold start, ensure crystal warm-up time is within the PLL lock window. Designers targeting 105 C ambient should verify the application note 'Thermal Considerations for QFP Packages' for layout-driven derating curves. No external heatsink is required for typical automotive body-controller loads.
Route the BDM signals (BKGD, MODC) to a 2x5 or 1x6 header for in-circuit debug; keep the trace under 50 mm and add 4.7 kohm pull-ups on BKGD. The XTAL/EXTAL traces must be short, symmetric, and surrounded by a ground guard ring to avoid PLL jitter. The CAN bus signals (PM0/PM1) should route to a CAN transceiver with controlled-impedance differential routing (typically 120 ohm). Reference: NXP application note AN3490 'BDM Timing and Layout'.
Do not leave the TEST pin floating; tie TEST to VSS with a 10 kohm pulldown as required by NXP. Failure to do so can place the device in factory-test mode and prevent normal Flash access. Also, when migrating from 'CFUE' (112-pin) to 'VFUE16' (80-pin), verify that no Port P or Port R peripheral signals are required, as these are only bonded out on the larger package.
The MC9S12E64VFUE16R's SCI and SPI signals (PS0-PS7) are 5 V tolerant with TTL thresholds. When interfacing to 3.3 V peripherals, insert a 4.7 kohm series resistor or level translator on each line to limit current during hot-plug events. The CAN bus requires a 120 ohm termination at each bus end and a common-mode choke for EMI compliance per automotive OEM standards.
معلومات الامتثال
AEC-Q100 qualified per NXP datasheet. RoHS and lead-free compliance confirmed per distributor listings; halogen-free status not explicitly stated in verified data.
