MCIMX6G2CVK05AA-FR - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP
MPN: MCIMX6G2CVK05AA-FR ✓ نشطMCIMX6G2CVK05AA-FR نظرة عامة
An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU core, memory controller, graphics/video pipeline, and industrial peripherals on a single die. The i.MX6UL sits at the entry tier of the i.MX 6 family - below the i.MX 6SoloLite and i.MX 6Solo - targeting HMI, low-cost gateways, and battery-powered IoT nodes. Its role in the broader system hierarchy is: i.MX6UL -> Cortex-A7 class AP -> 32-bit applications microprocessor -> embedded SoC -> semiconductor IC.
Key specifications include 528 MHz maximum CPU frequency, 16 KB L1 instruction cache + 16 KB L1 data cache, 128 KB L2 cache, support for LPDDR2/DDR3/DDR3L memory, dual USB 2.0 OTG controllers with integrated PHYs, two 12-bit ADCs (up to 10 channels), dual CAN-FD, and 1.2V/1.35V/1.5V/1.8V/2.5V/2.8V/3.3V I/O voltage support. The integrated security features include secure boot, high-assurance boot, and tamper detection suitable for industrial- and consumer-grade protection.
The MCIMX6G2CVK05AA-FR is fabricated in a low-power 40 nm CMOS process enabling typical active power in the sub-500 mW range and deep-sleep currents suitable for always-on battery applications. The 272-MAPBGA package provides a thermal resistance suitable for industrial fanless enclosures.
Typical applications include HMI panels, industrial IoT gateways, low-cost POS terminals, e-readers, smart appliances, building automation controllers, and portable medical devices. The Cortex-A7 core's ARMv7-A architecture with NEON makes it well suited for Linux/RTOS-based GUI stacks.
When designing with this part, ensure proper PCB layer stack-up for the 0.5 mm BGA escape routing and provide adequate decoupling on the multi-rail power domains. The wide I/O voltage support allows direct connection to 1.8V or 3.3V peripherals without level shifters.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ MCIMX6G2CVK05AA-FR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MCIMX6G2CVK05AA-FR (نفس عامل الشكل والبصمة) — يختلف في CAN, Mounting Type, USB.
MCIMX6G2CVM05AA
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCIMX6G1CVM05AA
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCIMX6G2CVK05AB
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCIMX6G2DVK10AA
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCIMX6G2CVK08AA
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MCIMX6G2CVK05AA-FR الحدود القصوى والخصائص الكهربائية
| CPU Core | ARM Cortex-A7 (single core, 32-bit) |
| Maximum CPU Frequency | 528 MHz |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| L2 Cache | 128 KB |
| Memory Interface | LPDDR2, DDR3, DDR3L (16-bit) |
| USB | 2 x USB 2.0 OTG with integrated PHY |
| CAN | 2 x CAN-FD |
| ADC | 2 x 12-bit SAR ADC (up to 10 input channels) |
| I/O Voltage Support | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
| Security Features | Secure boot, high-assurance boot, tamper detection, OTF DRAM encryption |
| العلبة | 272-MAPBGA (9x9 mm, 0.5 mm pitch) |
| درجة حرارة التشغيل | -40C to +105C (TJ) |
| Process Technology | 40 nm CMOS |
| نوع التركيب | Surface Mount (BGA) |
| مستوى MSL | 3 |
| Lead-Free / RoHS | Yes - Compliant |
دليل تكوين أطراف MCIMX6G2CVK05AA-FR 272-mapbga (9x9 mm, 0.5 mm pitch)
تكوين الأطراف لـ MCIMX6G2CVK05AA-FR (حزمة 272-mapbga (9x9 mm, 0.5 mm pitch)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MCIMX6G2CVK05AA-FR.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MCIMX6G2CVK05AA-FR مناسب لـ 6 التطبيقs: Industrial HMI Panels, IoT Gateways and Edge Nodes, Smart Appliance Controllers, Building Automation Controllers, Portable Medical Devices, POS Terminals and Payment Devices.
Industrial HMI Panels
The MCIMX6G2CVK05AA-FR's 528 MHz Cortex-A7 with NEON engine and 128 KB L2 cache is well matched to industrial HMI panels running Qt or LVGL GUI stacks. The integrated 2D graphics pipeline, dual USB 2.0 OTG for touch controllers, and 12-bit ADC for backlight/ambient-light sensing reduce BOM cost versus discrete MCU+ASIC designs. The -40C to +105C junction temperature rating suits factory-floor enclosures and outdoor kiosks where ambient temperatures exceed 70C. Hardware secure boot (G2 variant) protects firmware integrity in unattended equipment.
موصى به
IoT Gateways and Edge Nodes
The MCIMX6G2CVK05AA-FR integrates Cortex-A7 plus dual CAN-FD, dual USB 2.0 with PHY, and 1.2V-3.3V I/O support that lets IoT gateway designs connect directly to 3.3V sensors without level shifters. The 528 MHz core runs lightweight Linux (Yocto/Buildroot) for MQTT, CoAP, or proprietary edge protocols. OTF DRAM encryption (G2 variant) protects sensor data in transit. The 272-MAPBGA's 9x9 mm footprint fits compact gateway enclosures with 4-layer PCB escape routing.
موصى به
Smart Appliance Controllers
The MCIMX6G2CVK05AA-FR delivers 528 MHz Cortex-A7 with 16-bit LPDDR2/DDR3 support, providing adequate headroom for appliance control firmware plus Wi-Fi/BLE HMI logic. The integrated dual USB 2.0 with PHY and 12-bit ADC support motor control feedback and temperature sensing without external peripherals. Tamper detection (G2 variant) protects against warranty fraud in connected appliances. Industrial -40C to +105C operation suits appliance compartments with elevated temperatures.
موصى به
Building Automation Controllers
The MCIMX6G2CVK05AA-FR's dual CAN-FD controllers enable native BACnet, KNX, or proprietary building-automation bus connectivity, eliminating external CAN transceivers. The Cortex-A7 core runs real-time building automation protocols with deterministic interrupt latency. Hardware secure boot and OTF DRAM encryption (G2) protect tenant data and access credentials. The wide 1.2V-3.3V I/O support lets the part interface directly with HVAC actuator drivers, lighting ballasts, and security sensors.
موصى به
Portable Medical Devices
The MCIMX6G2CVK05AA-FR suits portable medical devices requiring low power, hardware security, and reliable industrial-temperature operation. The 528 MHz Cortex-A7 core can run patient-monitoring algorithms while the integrated 12-bit ADC captures vital-sign analog signals. Hardware secure boot (G2) and OTF DRAM encryption support HIPAA-compliant data protection. The 40 nm CMOS process enables sub-500 mW active power for battery operation across 8-12 hour shifts.
موصى به
POS Terminals and Payment Devices
The MCIMX6G2CVK05AA-FR meets POS terminal requirements with its 528 MHz Cortex-A7 core, dual USB 2.0 OTG for payment peripherals, and hardware secure boot (G2 variant) for PCI PTS compliance. Tamper detection monitors enclosure intrusion, while OTF DRAM encryption protects PIN and transaction data. The 272-MAPBGA's compact 9x9 mm footprint fits slim countertop terminals. Linux support via NXP's BSP enables rapid integration of payment application stacks.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MCIMX6G2CVK05AA-FR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MCIMX6G2CVM05AA | MCIMX6G1CVM05AA | MCIMX6G2CVK05AB | MCIMX6G2DVK10AA | MCIMX6G2CVK08AA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) | 272-MAPBGA (9x9 mm, 0.5 mm pitch) |
| CPU Core | ARM Cortex-A7 single core | ARM Cortex-A7 single core | ARM Cortex-A7 single core | ARM Cortex-A7 single core | ARM Cortex-A7 dual core | ARM Cortex-A7 single core |
| Security Hardware (Secure Boot) | Yes (G2 variant) | Yes (G2 variant) | No (G1 variant) | Yes (G2 with extended) | Yes (G2 variant) | Yes (G2 variant) |
| Tamper Detection | Yes | Yes | No | Yes | Yes | Yes |
| OTF DRAM Encryption | Yes | Yes | No | Yes | Yes | Yes |
| USB 2.0 OTG Ports | 2 | 2 | 2 | 2 | 2 | 2 |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) | -40C to +105C (TJ) |
أبرز الفروقات
- Hardware secure boot and tamper detection (مقابلMCIMX6G1CVM05AA)
- 528 MHz speed grade (مقابلMCIMX6G2CVK08AA)
- Industrial temperature grade (مقابلMCIMX6G2DVK10AA)
ملاحظات التصميم
The 272-MAPBGA at 0.5 mm pitch requires 4-layer PCB minimum with microvia escape routing. Per NXP's i.MX6UL Hardware Design Guide, place 0.1uF decoupling capacitors on every VDD pin within 1 mm of the ball. Use via-in-pad for inner-row balls to escape on inner layers. Allocate at least 4 ground vias under the package thermal pad for thermal dissipation; the 9x9 mm footprint supports up to 2 W typical dissipation with proper copper pour.
The MCIMX6G2CVK05AA-FR requires multiple power rails (VDD_SOC, VDD_ARM, VDD_HIGH, VDD_USB, VDD_PLL) with specific sequencing per NXP datasheet section 4. NXP recommends the PF3000 or PF3001 PMIC companion for proper rail sequencing and reduced external component count. Do not power VDD_ARM before VDD_SOC - this can cause permanent latch-up. Use bulk 22uF ceramic + 100nF HF decoupling on each rail.
Estimated: At 528 MHz with all peripherals active, typical power consumption is approximately 450-700 mW depending on workload. The 272-MAPBGA junction-to-ambient thermal resistance (theta_JA) on a 4-layer JEDEC test board is approximately 25-30 C/W. Derate for industrial designs with TJ max = 105C: maximum ambient temperature = TJ max - (P x theta_JA). For continuous 700 mW operation, limit ambient to 105C - (0.7 x 30) = 84C to maintain margin.
Common pitfalls with i.MX6UL designs include: (1) incorrect boot configuration resistor values on BOOT_MODE pins causing boot failure, (2) failing to assert POR_B for at least 1 ms after all rails stabilize, (3) using DDR3L without proper impedance-matched routing (target 50 ohm single-ended, 100 ohm differential), and (4) omitting the 32.768 kHz RTC crystal which prevents low-power RTC operation. Always validate boot mode with NXP's manufacturing tool before firmware integration.
معلومات الامتثال
RoHS and REACH compliant per NXP product page. Industrial temperature grade (-40C to +105C TJ) but not formally AEC-Q100 qualified - for AEC-Q100 automotive applications, consult NXP's automotive-grade i.MX portfolio. Halogen-free status not specified in verified data.
