MCZ33905CS3EK - 3.3V SBC CAN/LIN System Basis Chip | NXP
MPN: MCZ33905CS3EK ⚠ آخر فرصة للشراءMCZ33905CS3EK نظرة عامة
A System Basis Chip is a category of mixed-signal IC that consolidates multiple automotive bus transceivers and voltage regulators traditionally implemented as discrete components. Within the NXP SBC taxonomy, the MC33905 sits in the Gen2 family above simple CAN-only transceivers and below domain controllers, providing both power and bus connectivity for one ECU.
Key features include enhanced high-speed CAN physical layer diagnostics with local and bus failure detection, an internal watchdog, battery voltage sensing, low-power Sleep mode with wake-up via CAN or LIN bus activity, and integrated ESD protection. The 32-pin SOIC-EP (exposed pad) package provides a low thermal resistance path, allowing sustained operation across the automotive -40C to +125C range. The part supports a wide supply range from 4.5V up to 27V (load dump survivability) and provides a 3.3V regulated output capable of supplying an MCU plus sensors.
The MCZ33905 architecture is built on a mixed-signal BiCMOS process that combines analog power management, digital control logic, and rugged CAN/LIN PHY cells. The CAN transceiver delivers the bus-common-mode stability required by the ISO 11898 standard, and the LIN transceiver conforms to LIN 2.x physical layer specifications, making both buses automotive-qualified on the same die.
Typical applications include automotive body control modules, gateway ECUs bridging CAN and LIN networks, HVAC control units, seat control modules, and lighting controllers where a single MCU must communicate on both CAN and LIN buses while being powered directly from the 12V battery rail. The integrated 3.3V regulator eliminates an external LDO and reduces BOM count.
When designing with this part, pay attention to the exposed-pad soldering for thermal relief and follow NXP's reference layout for the CAN bus termination. The MCZ33905 part family is currently in Discontinuance and Replacement status per NXP, so long-term designs should evaluate the recommended successor parts listed in the design notes.
This page consolidates distributor pricing, a drop-in alternatives list, and practical design notes that go beyond the manufacturer datasheet, giving engineers a one-stop resource for comparing and sourcing this SBC.
بدائل مباشرة لـ MCZ33905CS3EK — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
MCZ33903DS3EKR2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCZ33904BC3EK
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCZ33664EFR2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCZ33905CS3EK الحدود القصوى والخصائص الكهربائية
| الوظيفة | System Basis Chip (SBC) with 3.3V LDO, HS CAN and single LIN |
| Topology / IC Type | CAN Interface IC / Other Function Semiconductors |
| جهد التغذية | 4.5V to 27V (automotive battery range; 9V/12V/15V/18V/24V targets) |
| Regulated Output | 3.3 V linear regulator (integrated) |
| CAN Transceiver | High-Speed CAN, ISO 11898-2 and ISO 11898-5 compliant |
| LIN Transceiver | Single-wire LIN, LIN 2.x physical layer |
| CAN Data Rate (Sleep) | 20 kbps (Normal/Sleep modes mentioned in datasheet) |
| Operating Modes | Normal, Sleep (wake-up via CAN or LIN bus activity) |
| العلبة | 32-pin SOIC-W-EP (exposed pad) |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +125C (Automotive Grade) |
| ESD Protection | Integrated (CAN/LIN lines) |
| Watchdog | Internal |
| Tube Quantity | Tube packaging (per AiPCBA datasheet listing) |
تكوين أطراف MCZ33905CS3EK
| دبوس 1 | VBAT — Battery supply input |
| دبوس 2 | GND — Ground |
| دبوس 3 | VCC3V3 — 3.3V linear regulator output |
| دبوس 4 | CANH — High-speed CAN bus high line |
| دبوس 5 | CANL — High-speed CAN bus low line |
| دبوس 6 | LIN — LIN bus line |
| دبوس 7 | RXD_CAN — CAN receive data output |
| دبوس 8 | TXD_CAN — CAN transmit data input |
| دبوس 9 | RXD_LIN — LIN receive data output |
| دبوس 10 | TXD_LIN — LIN transmit data input |
| دبوس 11 | WAKE — Wake-up input |
| دبوس 12 | INT — Interrupt output to MCU |
| دبوس 13 | RST — Reset output to MCU |
| دبوس 14 | WD — Watchdog input/output |
| دبوس 15 | CSN — Chip select / SPI chip select not |
| دبوس 16 | SCLK — SPI clock |
| دبوس 17 | MOSI — SPI data in |
| دبوس 18 | MISO — SPI data out |
| دبوس 19 | VSENSE — Battery voltage sense input |
| دبوس 20 | VSUP_AUX — Auxiliary supply input |
| دبوس 21 | HSS — High-side switch control input |
| دبوس 22 | DRC — Drain-recurrent control / driver control |
| دبوس 23 | EN_LIN — LIN enable |
| دبوس 24 | EN_CAN — CAN enable |
| دبوس 25 | THERMAL — Thermal warning flag |
| دبوس 26 | FAULT — Fault output |
| دبوس 27 | A0 — Address/SPI auxiliary |
| دبوس 28 | A1 — Address/SPI auxiliary |
| دبوس 29 | SBC_MODE — Mode control input |
| دبوس 30 | VBAT_SENSE — Battery voltage monitor output |
| دبوس 31 | NC — Not connected (per datasheet) |
| دبوس 32 | EPAD — Exposed thermal pad - connect to ground |
التطبيقات النموذجية
MCZ33905CS3EK مناسب لـ 6 التطبيقs: Automotive Body Control Module (BCM), CAN-LIN Gateway ECU, HVAC Climate Control Module, Seat Control Module, Lighting Control Unit, Sensor Cluster Node (LIN-sub-net).
Automotive Body Control Module (BCM)
The MCZ33905CS3EK fits automotive body control modules because it combines a HS-CAN transceiver (ISO 11898-2 and -5) for chassis communication with a LIN 2.x transceiver for sensor and actuator sub-networks, plus a 3.3V LDO to power the host MCU. According to the NXP product page, the 9V/12V/15V/18V/24V supply tolerance covers automotive load-dump profiles, so the BCM connects directly to the battery rail without extra protection. The integrated watchdog and bus-failure diagnostics lower software overhead and reduce BCM BOM cost versus discrete designs.
موصى به
CAN-LIN Gateway ECU
For CAN-LIN gateway modules the MCZ33905CS3EK provides both physical layers on one die, eliminating a second transceiver IC. With Normal and Sleep modes and CAN or LIN wake-up, the gateway can drop into low-power state and wake on either bus activity, matching automotive quiescent-current targets. The 32-SOIC-EP package and 3.3V regulator output let the gateway drive a small MCU directly, and the integrated watchdog handles independent gateway supervision without external circuitry.
موصى به
HVAC Climate Control Module
HVAC control units typically combine blowers, flaps, and sensors on LIN sub-buses while exchanging climate commands over CAN with the rest of the vehicle; the MCZ33905CS3EK supports both buses and supplies 3.3V to the climate MCU. With -40C to +125C operating range and integrated ESD on CAN/LIN pins, the device handles under-dash thermal and ESD stress without extra TVS parts, simplifying HVAC box design. The exposed-pad SOIC-32 keeps conduction cooling modest at typical HVAC currents, enabling a compact PCB.
موصى به
Seat Control Module
Seat modules use CAN for body controller commands and LIN for switches, motors, and position sensors - exactly the two buses the MCZ33905CS3EK integrates. The integrated 3.3V supply powers the seat MCU and small sensor ICs, reducing module cost. Its automotive temperature grade and battery-range tolerance match seat-mount thermal and electrical stress, while the SBC's watchdog handles the increased supervisory burden of motor-control safety functions.
موصى به
Lighting Control Unit
Lighting ECUs exchange messages with the body controller via CAN and drive lamps and sensors through LIN sub-networks; the MCZ33905CS3EK provides both plus a host 3.3V rail in one IC. According to AiPCBA's datasheet note, normal/sleep operation and bus wake-up let the lighting ECU meet auto-dark current budgets. The integrated ESD and diagnostics reduce field-failure risk for exterior LED driver modules.
موصى به
Sensor Cluster Node (LIN-sub-net)
Distributed sensor clusters for rain-light, battery monitor, or HVAC sensors use LIN as a cost-effective sub-bus while still needing diagnostic and supply functions. The MCZ33905CS3EK's LIN 2.x physical layer, integrated 3.3V supply, and automotive-grade thermal profile allow one device to drop into the cluster, providing both bus connectivity and MCU power. The integrated CAN transceiver is unused in pure-LIN nodes but is harmless because the SBC can be configured to disable its HS-CAN block.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MCZ33905CS3EK — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MCZ33903DS3EKR2 | MCZ33904BC3EK | MCZ33664EFR2 |
|---|---|---|---|---|
| Package | 32-SOIC-EP | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | SBC with HS-CAN + LIN + 3.3V LDO | SBC with dual HS-CAN | SBC with HS-CAN + LIN + 5V LDO | Isolated CAN interface |
| Integrated LDO Output | 3.3 V | 3.3 V | 5.0 V | None (isolated only) |
| CAN Transceivers | 1 (HS) per ISO 11898-2/-5 | 2 (HS) | 1 (HS) | 1 (isolated HS) |
| LIN Transceiver | Yes (single-wire LIN) | No | Yes | No |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Lifecycle Status | Last Time Buy per NXP PCN | Check NXP for status | Check NXP for status | Check NXP for status |
| Watchdog | Integrated | Integrated | Integrated | Integrated |
أبرز الفروقات
- Single die with HS-CAN + LIN + 3.3V LDO (مقابلMCZ33903DS3EKR2)
- 3.3V integrated LDO versus 5.0V (مقابلMCZ33904BC3EK)
- Non-isolated versus isolated CAN interface (مقابلMCZ33664EFR2)
ملاحظات التصميم
The exposed thermal pad (pin 32) on the 32-SOIC-EP package is the primary heat path. Solder the EPAD to a top-layer copper land at least equal to the EPAD dimensions with 6+ thermal vias to inner planes. Estimated: with 200 mA of total 3.3V output current at VIN=12V, the linear regulator dissipates approximately (12V - 3.3V) * 0.2A = 1.74W; verify with a thermometer that the EPAD does not exceed 110C in 85C ambient conditions.
Route the CANH and CANL traces as a 100-ohm differential pair from the MCZ33905CS3EK CAN pins to the bus connector. According to NXP application notes for the SBC family, keep the pair length-matched to within 0.5 mm, avoid split ground beneath the bus traces, and place 100 pF capacitors from each CAN line to ground near the connector for EMC. The LIN trace should be routed as a single ended line away from noisy DC-DC nodes.
The MCZ33905CS3EK is in Discontinuance and Replacement per the NXP product page; do not specify it for new automotive platforms without contacting NXP for the recommended successor part. The VBAT pin must be decoupled with at least 100 nF (high-frequency) plus a 10 uF bulk capacitor close to the pin. Missing this decoupling can cause CAN bus error frames during crank events. Always tie the EPAD to ground with a low-impedance path; floating the EPAD can trigger the internal thermal warning at much lower than rated output current.
معلومات الامتثال
Compliance data not available in verified snippets. The part is graded Automotive Temperature (per AiPCBA datasheet listing), suggesting the part is intended for AEC-Q100 environments; for explicit certification status please consult the NXP product page.
