MPC8245LVV350D - PowerPC 603e MPU 350MHz 352-TBGA | NXP
MPN: MPC8245LVV350D ✗ انتهى عمره الإنتاجيMPC8245LVV350D نظرة عامة
An Integrated Host Processor (IHP) is a system-on-chip variant of a microprocessor that pairs a CPU core with platform glue logic (SDRAM controller, local bus, and I/O bridges) on a single die. It belongs to the taxonomy MPU -> microprocessor -> processor -> semiconductor, and the MPC8245 specifically belongs to the PowerPC architecture line acquired by NXP (formerly Freescale) from the AIM alliance.
Key features include a 350 MHz PowerPC 603e core, on-chip SDRAM controller, PCI bridge, 32-bit data path, and 3.3 V I/O with a 0 to 105 C extended-temperature grade. The 603e core supports both integer and floating-point workloads and includes hardware multiply/divide, branch prediction, and a memory management unit.
The device is fabricated in a 0.25 um CMOS process with copper interconnect, dissipating typical power of around 2-3 W at full clock. The integrated DDR/SDRAM and PCI controllers remove the need for a companion north-bridge chipset, reducing the overall BOM and PCB area versus discrete CPU + bridge designs.
Typical applications include industrial HMI panels, edge-computing gateways, communication routers, printers, and embedded Linux control platforms. Designers favor the MPC8245 for stable PowerPC software stacks and long-lifecycle industrial deployments.
Design consideration: route the high-speed DDR/SDRAM bus with matched impedance and length-matching, and place decoupling caps close to each BGA quadrant; the 352-BGA footprint requires careful stack-up planning to maintain signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the MPC8245LVV350D that go beyond the manufacturer datasheet, helping engineers validate replacements and lifecycle options.
بدائل مباشرة لـ MPC8245LVV350D — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MPC8245LVV350D (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Manufacturer, Mounting Type, Memory Controller, Package.
MPC8245LVV333D
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MPC8245LVV266D
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MPC8245LVVV300D
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MPC8245LVV400D
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
PC8245MTPU333D
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MPC8245LVV350D الحدود القصوى والخصائص الكهربائية
| Manufacturer | NXP USA Inc. |
| Series | MPC82xx |
| Core Processor | PowerPC 603e |
| Number of Cores | 1 |
| Bus Width | 32-Bit |
| Clock Speed | 350 MHz |
| درجة حرارة التشغيل | 0 to 105 C |
| جهد التغذية | 3.3 V |
| Process Technology | 0.25 um CMOS |
| RAM Controller | SDRAM |
| Graphics Acceleration | No |
| Display & Interface | PCI bridge |
| العلبة | 352-TBGA (35 x 35 mm) |
| نوع التركيب | Surface Mount |
| حالة RoHS | See manufacturer datasheet |
دليل تكوين أطراف MPC8245LVV350D 352-tbga (35 x 35 mm)
تكوين الأطراف لـ MPC8245LVV350D (حزمة 352-tbga (35 x 35 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MPC8245LVV350D.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MPC8245LVV350D مناسب لـ 6 التطبيقs: Industrial HMI Panels, Edge Computing Gateways, Communication Routers, Embedded Printers and Imaging, Point-of-Sale Terminals, Industrial Control Platforms.
Industrial HMI Panels
The MPC8245LVV350D's 350 MHz PowerPC 603e core, integrated SDRAM controller, and PCI bridge make it well-suited for industrial HMI panels requiring responsive touch UI and reliable long-lifecycle operation. Its 0 to 105 C temperature grade tolerates factory cabinet thermal rise, while the absence of an integrated graphics accelerator pairs naturally with a PCI-discrete LCD controller.
موصى به
Edge Computing Gateways
For edge gateways aggregating sensor data, the MPC8245LVV350D offers a stable PowerPC Linux platform with hardware MMU, ECC SDRAM support, and PCI expansion for Wi-Fi or cellular modules. The 350 MHz core is sufficient for MQTT brokers and local analytics, and the long PowerPC software support window makes it ideal for industrial IoT gateways deployed for 10+ years.
موصى به
Communication Routers
The integrated PCI bridge and SDRAM controller of the MPC8245LVV350D allow direct attachment of WAN PHY and Ethernet MAC cards without a northbridge, reducing BOM cost in small-business routers. The 603e core handles routing table lookups and IPSec offload hooks, while the 352-BGA package supports dense multilayer router PCBs.
موصى به
Embedded Printers and Imaging
Printers and imaging subsystems benefit from the MPC8245LVV350D's combination of a 350 MHz CPU, PCI expansion for image-processing ASICs, and SDRAM bandwidth for high-resolution pipelines. The PowerPC architecture supports legacy VxWorks printer stacks, easing migration from older PowerQUICC designs to this newer integrated host processor.
موصى به
Point-of-Sale Terminals
POS terminals leverage the MPC8245LVV350D's PCI bus for magnetic-stripe readers, thermal printers, and Ethernet PHYs. The hardware MMU supports modern Linux/POS middleware, while the industrial temperature grade suits semi-outdoor retail environments. The 352-BGA footprint allows miniaturized mainboards fitting standard POS chassis.
موصى به
Industrial Control Platforms
Programmable logic controllers (PLCs) and motion controllers use the MPC8245LVV350D's 350 MHz 603e core to run deterministic control loops on VxWorks or Linux-RT. The SDRAM controller with ECC ensures reliable long-term operation, and the PCI bus supports fieldbus cards (PROFIBUS, CANopen). The extended temperature grade covers cabinet-mounted control panels.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MPC8245LVV350D — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MPC8245LVV333D | MPC8245LVV266D | MPC8245LVVV300D | MPC8245LVV400D | PC8245MTPU333D |
|---|---|---|---|---|---|---|
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 350 MHz | 333 MHz (-5%) | 266 MHz (-24%) | 300 MHz (-14%) | 400 MHz (+14%) | 333 MHz (-5%) |
| Core Processor | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RAM Controller | SDRAM | SDRAM | SDRAM | SDRAM | SDRAM | SDRAM |
أبرز الفروقات
- Highest clock speed in the MPC8245 LV family (مقابلMPC8245LVV333D)
- Standard 3.3 V LV industrial-temperature grade (مقابلMPC8245TZU266D)
- Pin-compatible with the entire MPC8245 LV speed family (مقابلQorIQ P1010)
ملاحظات التصميم
Estimated: at 350 MHz and 3.3 V supply the MPC8245LVV350D typically dissipates around 2-3 W. The 352-TBGA package requires thermal vias under the die pad and at least 4-layer PCB copper pour to keep junction temperature below 105 C. Mount a small aluminum heatsink if the enclosure has poor airflow.
Route the 32-bit SDRAM bus with matched lengths and 50 ohm controlled impedance. Place decoupling capacitors (0.1 uF + 10 uF bulk) within 5 mm of each power pin of the 352-BGA. The large BGA requires a 1.27 mm pitch PCB footprint with non-solder-mask-defined pads.
Do not assume the MPC8245LVV350D is still in production - it is obsolete and stock is limited. Lock in lifetime-buy quantities during design freeze, or migrate to a newer NXP QorIQ or Layerscape part with a redesigned PCB. Always cross-check the NXP PCN database before committing to a long-term design.
Keep PCI bus traces short and well-separated from the SDRAM bus to avoid crosstalk. Use a ground guard via fence around high-speed signals. The 352-BGA has 4 rows of perimeter balls; assign JTAG, reset, and clock signals to the outer rows for easier probing during bring-up.
معلومات الامتثال
RoHS/REACH status not explicitly stated in the verified data; consult NXP product compliance portal for the latest declaration. AEC-Q100 not applicable - this is an industrial MPU, not an automotive-grade part.
