MPC8245LVV350D - PowerPC 603e MPU 350MHz 352-TBGA | NXP
Teilenummer: MPC8245LVV350D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $158.1 | $158,10 |
| 10 | $145.5 | $1.455,00 |
| 100 | $132.4 | $13.240,00 |
| 500 | $121 | $60.500,00 |
| 1.000 | $110.75 | $110.750,00 |
MPC8245LVV350D Übersicht
An Integrated Host Processor (IHP) is a system-on-chip variant of a microprocessor that pairs a CPU core with platform glue logic (SDRAM controller, local bus, and I/O bridges) on a single die. It belongs to the taxonomy MPU -> microprocessor -> processor -> semiconductor, and the MPC8245 specifically belongs to the PowerPC architecture line acquired by NXP (formerly Freescale) from the AIM alliance.
Key features include a 350 MHz PowerPC 603e core, on-chip SDRAM controller, PCI bridge, 32-bit data path, and 3.3 V I/O with a 0 to 105 C extended-temperature grade. The 603e core supports both integer and floating-point workloads and includes hardware multiply/divide, branch prediction, and a memory management unit.
The device is fabricated in a 0.25 um CMOS process with copper interconnect, dissipating typical power of around 2-3 W at full clock. The integrated DDR/SDRAM and PCI controllers remove the need for a companion north-bridge chipset, reducing the overall BOM and PCB area versus discrete CPU + bridge designs.
Typical applications include industrial HMI panels, edge-computing gateways, communication routers, printers, and embedded Linux control platforms. Designers favor the MPC8245 for stable PowerPC software stacks and long-lifecycle industrial deployments.
Design consideration: route the high-speed DDR/SDRAM bus with matched impedance and length-matching, and place decoupling caps close to each BGA quadrant; the 352-BGA footprint requires careful stack-up planning to maintain signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the MPC8245LVV350D that go beyond the manufacturer datasheet, helping engineers validate replacements and lifecycle options.
Drop-in-Alternativen für MPC8245LVV350D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8245LVV350D (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Manufacturer, Mounting Type, Memory Controller, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8245LVV333D
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →MPC8245LVV266D
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$48.9 / Stück
Datenblatt ansehen →MPC8245LVVV300D
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8245LVV400D
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PC8245MTPU333D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245LVV350D Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP USA Inc. |
| Series | MPC82xx |
| Core Processor | PowerPC 603e |
| Number of Cores | 1 |
| Bus Width | 32-Bit |
| Clock Speed | 350 MHz |
| Betriebstemperatur | 0 to 105 C |
| Versorgungsspannung | 3.3 V |
| Process Technology | 0.25 um CMOS |
| RAM Controller | SDRAM |
| Graphics Acceleration | No |
| Display & Interface | PCI bridge |
| Gehäuse | 352-TBGA (35 x 35 mm) |
| Montageart | Surface Mount |
| RoHS-Status | See manufacturer datasheet |
MPC8245LVV350D 352-tbga (35 x 35 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8245LVV350D (352-tbga (35 x 35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8245LVV350D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8245LVV350D ist geeignet für 6 Anwendungs: Industrial HMI Panels, Edge Computing Gateways, Communication Routers, Embedded Printers and Imaging, Point-of-Sale Terminals, Industrial Control Platforms.
Industrial HMI Panels
The MPC8245LVV350D's 350 MHz PowerPC 603e core, integrated SDRAM controller, and PCI bridge make it well-suited for industrial HMI panels requiring responsive touch UI and reliable long-lifecycle operation. Its 0 to 105 C temperature grade tolerates factory cabinet thermal rise, while the absence of an integrated graphics accelerator pairs naturally with a PCI-discrete LCD controller.
Empfohlen
Edge Computing Gateways
For edge gateways aggregating sensor data, the MPC8245LVV350D offers a stable PowerPC Linux platform with hardware MMU, ECC SDRAM support, and PCI expansion for Wi-Fi or cellular modules. The 350 MHz core is sufficient for MQTT brokers and local analytics, and the long PowerPC software support window makes it ideal for industrial IoT gateways deployed for 10+ years.
Empfohlen
Communication Routers
The integrated PCI bridge and SDRAM controller of the MPC8245LVV350D allow direct attachment of WAN PHY and Ethernet MAC cards without a northbridge, reducing BOM cost in small-business routers. The 603e core handles routing table lookups and IPSec offload hooks, while the 352-BGA package supports dense multilayer router PCBs.
Empfohlen
Embedded Printers and Imaging
Printers and imaging subsystems benefit from the MPC8245LVV350D's combination of a 350 MHz CPU, PCI expansion for image-processing ASICs, and SDRAM bandwidth for high-resolution pipelines. The PowerPC architecture supports legacy VxWorks printer stacks, easing migration from older PowerQUICC designs to this newer integrated host processor.
Empfohlen
Point-of-Sale Terminals
POS terminals leverage the MPC8245LVV350D's PCI bus for magnetic-stripe readers, thermal printers, and Ethernet PHYs. The hardware MMU supports modern Linux/POS middleware, while the industrial temperature grade suits semi-outdoor retail environments. The 352-BGA footprint allows miniaturized mainboards fitting standard POS chassis.
Empfohlen
Industrial Control Platforms
Programmable logic controllers (PLCs) and motion controllers use the MPC8245LVV350D's 350 MHz 603e core to run deterministic control loops on VxWorks or Linux-RT. The SDRAM controller with ECC ensures reliable long-term operation, and the PCI bus supports fieldbus cards (PROFIBUS, CANopen). The extended temperature grade covers cabinet-mounted control panels.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8245LVV350D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8245LVV333D | MPC8245LVV266D | MPC8245LVVV300D | MPC8245LVV400D | PC8245MTPU333D |
|---|---|---|---|---|---|---|
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 350 MHz | 333 MHz (-5%) | 266 MHz (-24%) | 300 MHz (-14%) | 400 MHz (+14%) | 333 MHz (-5%) |
| Core Processor | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RAM Controller | SDRAM | SDRAM | SDRAM | SDRAM | SDRAM | SDRAM |
Wichtigste Unterscheidungsmerkmale
- Highest clock speed in the MPC8245 LV family (vs. MPC8245LVV333D)
- Standard 3.3 V LV industrial-temperature grade (vs. MPC8245TZU266D)
- Pin-compatible with the entire MPC8245 LV speed family (vs. QorIQ P1010)
Designhinweise
Estimated: at 350 MHz and 3.3 V supply the MPC8245LVV350D typically dissipates around 2-3 W. The 352-TBGA package requires thermal vias under the die pad and at least 4-layer PCB copper pour to keep junction temperature below 105 C. Mount a small aluminum heatsink if the enclosure has poor airflow.
Route the 32-bit SDRAM bus with matched lengths and 50 ohm controlled impedance. Place decoupling capacitors (0.1 uF + 10 uF bulk) within 5 mm of each power pin of the 352-BGA. The large BGA requires a 1.27 mm pitch PCB footprint with non-solder-mask-defined pads.
Do not assume the MPC8245LVV350D is still in production - it is obsolete and stock is limited. Lock in lifetime-buy quantities during design freeze, or migrate to a newer NXP QorIQ or Layerscape part with a redesigned PCB. Always cross-check the NXP PCN database before committing to a long-term design.
Keep PCI bus traces short and well-separated from the SDRAM bus to avoid crosstalk. Use a ground guard via fence around high-speed signals. The 352-BGA has 4 rows of perimeter balls; assign JTAG, reset, and clock signals to the outer rows for easier probing during bring-up.
Compliance-Informationen
RoHS/REACH status not explicitly stated in the verified data; consult NXP product compliance portal for the latest declaration. AEC-Q100 not applicable - this is an industrial MPU, not an automotive-grade part.
