MPC8247CZQMIBA - PowerQUICC II 266MHz MPU | NXP | 516-PBGA
MPN: MPC8247CZQMIBA ⚠ آخر فرصة للشراءMPC8247CZQMIBA نظرة عامة
A microprocessor (MPU) in this category is a system-on-chip that combines a CPU core, memory controllers, peripheral interfaces, and dedicated acceleration blocks into one device; the PowerQUICC II family is part of the broader embedded microprocessor taxonomy that sits above microcontrollers in integration density. PowerQUICC II specifically targets wireline and wireless communications and is recognized as a legacy architecture that integrated an Ethernet MAC, ATM support, PCI, I2C, USB, and a multi-channel HDLC controller in a single chip, allowing designers to build routers, bridges, and access devices with very few external components.
Key features of this MPN include operation at 266 MHz core frequency, integrated SDRAM controller supporting up to 1 GB of addressable memory, two 10/100 Mbps Ethernet controllers, USB 1.1 interface, PCI 2.2 host/agent bridge, and I2C plus UART ports. Operating voltages are 1.5 V for the core and 3.3 V for I/O, and the device is supplied in a 516-PBGA package with industrial -40C to +105C temperature support.
Architecture combines a 603e core, the CPM co-processor running at a separate 200 MHz frequency, on-chip SRAM, dual-channel DDR or SDRAM memory controller, and peripheral bridges. The CPM contains RISC engines dedicated to fast protocol processing (Fast Ethernet, HDLC, ATM, USB) so the main CPU spends cycles on application code, not on bit-banging serial protocols.
Typical applications include small/medium enterprise routers, VPN/firewall gateways, wireless access points, residential gateways, and industrial networking controllers; the device also fits DSLAM line cards, print server controllers, and Power-over-Ethernet switches. The wide industrial temperature range plus absence of TALITOS makes this specific variant attractive for non-cryptographic network appliances.
Design consideration: board layout must include a 33 MHz PCI clock source, proper SDRAM trace length matching (within the data sheet tolerance), and adequate decoupling. Because the 603e core runs hot at 266 MHz, the 516-PBGA thermal pad must be soldered to a continuous ground plane with thermal vias for production environments.
This page synthesizes distributor pricing, lifecycle status, and pin-compatible same-family alternatives that are not always shown together on the manufacturer product page.
بدائل مباشرة لـ MPC8247CZQMIBA — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MPC8247CZQMIBA (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Process Technology, Package, Core Architecture, Memory Controller.
MPC8247CVRMIBA
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MPC8247VRMIBA
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MPC8247CZQMIBA الحدود القصوى والخصائص الكهربائية
| Manufacturer | NXP Semiconductors (originally Freescale Semiconductor) |
| Part Number | MPC8247CZQMIBA |
| Core | PowerPC 603e (G2_LE) |
| Core Process Technology | 0.13 um (HiP7) |
| Number of Cores | 1 |
| عرض ناقل البيانات | 32-bit |
| Maximum Core Frequency | 266 MHz |
| Address Bus Width | 32-bit |
| Cache | 32 KB instruction + 32 KB data |
| Co-Processor | Communications Processor Module (CPM), RISC engine |
| Security Acceleration (TALITOS) | Not present (variant "without TALITOS") |
| Ethernet Controllers | 2 x 10/100 Mbps Fast Ethernet |
| PCI Interface | PCI 2.2 host/agent |
| USB Interface | USB 1.1 |
| Other Peripherals | UART, I2C, HDLC, ATM, multi-channel serial |
| درجة حرارة التشغيل | -40C to +105C (industrial) |
| العلبة | 516-ball PBGA (27x27 mm) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Non-compliant (legacy product) |
| Series | MPC82xx PowerQUICC II |
دليل تكوين أطراف MPC8247CZQMIBA 516-ball pbga (27x27 mm)
تكوين الأطراف لـ MPC8247CZQMIBA (حزمة 516-ball pbga (27x27 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MPC8247CZQMIBA.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MPC8247CZQMIBA مناسب لـ 6 التطبيقs: Small/Medium Enterprise (SME) Routers, Residential Gateways and DSL/Cable Modems, Wireless Access Points (WAP) and Bridges, VPN/Firewall Appliances (Entry-Level), Industrial Networking and Serial Gateways, Print Server and Networked Storage Controllers.
Small/Medium Enterprise (SME) Routers
The MPC8247CZQMIBA targets cost-sensitive SME router designs because its single 266 MHz PowerPC 603e core plus RISC CPM co-processor offload network protocol processing (Fast Ethernet MAC, HDLC, ATM) from the main CPU. Integrated dual 10/100 Ethernet ports and PCI 2.2 host bridge allow direct connection to WAN PHY chips and downstream switches without an external controller. Industrial -40C to +105C operation enables deployment in unconditioned telecom closets. Compared with discrete CPU+ASIC implementations, the PowerQUICC II integrates MAC, PCI, USB 1.1, I2C, and UART into a single 516-PBGA device.
موصى به
Residential Gateways and DSL/Cable Modems
Residential gateways, DSL modems, and cable modems benefit from the MPC8247CZQMIBA's integrated peripheral set: dual Fast Ethernet MACs for LAN routing, USB 1.1 for host connectivity, UART/I2C for SLIC/DSL chipset glue logic, and the RISC CPM for ATM segmentation and reassembly. The 266 MHz PowerPC 603e core runs the home routing protocol stack (NAT, DHCP, firewall) while the CPM manages DSL framing or DOCIS MAC. Industrial-grade temperature support allows deployment in wall-mounted enclosures near heat-generating line drivers. The 516-PBGA package (27x27 mm) provides ample thermal mass and the exposed pad enables heat dissipation in passively cooled enclosures.
موصى به
Wireless Access Points (WAP) and Bridges
Wireless access points leverage the MPC8247CZQMIBA's PCI 2.2 interface to connect to 802.11a/b/g MAC/BBP chipsets, its RISC CPM to manage access-point management frames, and its dual Ethernet ports to bridge wireless frames to wired backhaul. The PowerPC 603e handles WPA/WPA2 encryption in software for low-throughput APs; for higher throughput, the dedicated variant without TALITOS leaves the CPU cycles fully available for application processing. Industrial -40C to +105C operation supports outdoor industrial WAPs and ruggedized enterprise bridge enclosures.
موصى به
VPN/Firewall Appliances (Entry-Level)
Entry-level VPN and firewall appliances benefit from the MPC8247CZQMIBA's combination of PowerPC 603e CPU and RISC CPM co-processor: the CPM offloads HDLC and Ethernet packet processing while the 266 MHz core runs a Linux-based firewall stack with IPsec/SSL. The PCI 2.2 host bridge allows connection to encryption accelerators and additional 10/100 Ethernet ports via external PHY chips. Two integrated 10/100 MACs support WAN/LAN segmentation. The lack of TALITOS hardware acceleration means software-only encryption is feasible at low to mid throughput (<50 Mbps).
موصى به
Industrial Networking and Serial Gateways
Industrial gateways with multi-protocol serial connectivity benefit from the MPC8247CZQMIBA's CPM multi-channel HDLC, UART, and I2C controllers. The PowerPC 603e runs a protocol-conversion stack (Modbus/DNP3/Ethernet), while the CPM manages up to several HDLC channels simultaneously. The -40C to +105C industrial temperature grade supports factory floor, substation, and outdoor cabinet installations without additional heating or cooling. PCI 2.2 enables peripheral expansion modules and dual Ethernet provides link redundancy.
موصى به
Print Server and Networked Storage Controllers
Networked printers, NAS devices, and print server controllers use the MPC8247CZQMIBA's dual Ethernet ports and PCI interface to bridge to dedicated image processors, SATA controllers, and USB device peripherals. The 266 MHz PowerPC 603e handles spooling and file-system tasks, while the CPM offloads network packet processing for gigabit-bound traffic. Industrial temperature support enables commercial MFP/scanner embedded controller boards. The 516-PBGA (27x27 mm) package with thermal pad provides adequate heat dissipation in compact printer controller enclosures.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MPC8247CZQMIBA — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MPC8247CVRMIBA | MPC8247VRMIBA |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Core | PowerPC 603e (G2_LE) | PowerPC 603e (G2_LE) | PowerPC 603e (G2_LE) |
| Co-Processor | CPM (RISC, w/o TALITOS) | CPM (RISC, w/o TALITOS) | CPM (RISC, w/o TALITOS) |
| Ethernet Controllers | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps |
| PCI Interface | PCI 2.2 host/agent | PCI 2.2 host/agent | PCI 2.2 host/agent |
| RoHS Status | Non-compliant | Non-compliant | Non-compliant |
| Lifecycle Status | EOL / Last Time Buy | EOL | EOL |
أبرز الفروقات
- Industrial-grade -40C to +105C operating range (مقابلMPC8247CVRMIBA)
- TALITOS-free variant for lower cost and higher production volume (مقابلMPC8270CVRMIBA)
- Direct NXP-authorized EOL inventory from Rochester Electronics (مقابلThird-party brokers)
ملاحظات التصميم
The 266 MHz PowerPC 603e core dissipates significant power under load; per the NXP PowerQUICC II datasheet, designers must solder the 516-PBGA thermal pad to a continuous ground plane with a thermal-via array (typically 4x4 to 6x6 vias on 1.0-1.2 mm pitch) to keep junction temperature within the -40C to +105C operating range. Estimated: at ambient +55C and full load, the theta-JA without thermal enhancement is approximately 12-15 C/W depending on PCB copper weight, which can push Tj above +105C if no copper flooding or heatsink is applied in compact enclosures.
Because the 516-PBGA uses a 1.0 mm ball pitch (vs the larger 1.27 mm of earlier PowerQUICC packages), PCB fabrication must use HDI microvia technology with 4-6 mil laser-drilled vias on the fanout layers. Place decoupling capacitors (0.1 uF + 10 uF) within 50 mil of every power pin group. SDRAM trace length matching must comply with the data sheet's clock-to-data skew tolerance, typically +/- 50 ps. Estimated: routing out a 516-BGA at 1.0 mm pitch requires 4+ PCB layers minimum.
Do not assume the ZQMIBA and CVRMIBA variants are interchangeable in all designs: the ZQMIBA extends the temperature range to -40C, while CVRMIBA is commercial 0C minimum. Volume production designers often assume parts are drop-in, but the lead finish and RoHS classification must also be verified against the assembly process. EOL stock from distributors should be checked against counterfeit indicators (date codes, lot codes) because End of Life phase parts are a common counterfeit target.
معلومات الامتثال
Non-RoHS legacy component per NXP product page. AEC-Q100 not applicable (communications processor, not automotive-qualified). REACH compliance maintained per NXP legacy product statement.
