MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPN: MPC8572ELVTAVND ✓ نشطMPC8572ELVTAVND نظرة عامة
A microprocessor (MPU) is an integrated processor that contains the central processing unit, memory management, and peripheral interfaces on a single die. Within the semiconductor taxonomy, an MPU is a sub-class of digital IC, and the PowerQUICC III family specifically targets embedded communications infrastructure where deterministic packet processing and high-speed I/O integration reduce system BOM. The MPC8572E extends this lineage with hardware cryptography and an enhanced double-precision floating-point unit, positioning it for secure networking workloads.
Key features of the MPC8572ELVTAVND include dual e500 cores with double-precision FPU, integrated DDR2 memory controllers with ECC, four GbE MACs (SGMII/RGMII), PCI Express x8, Serial RapidIO, two triple-speed Ethernets, hardware-accelerated security (AES, DES, Kasumi), and 32 KB I-cache and 32 KB D-cache per core. The 1023-FCBGA (33x33 mm) package exposes 1023 solder balls and is rated for industrial junction temperatures.
The architectural innovation lies in its hierarchical bus fabric (CoreNet platform) that allows coherent cores to share L2 cache (1 MB) and high-bandwidth I/O without contention. The hardware security engine offloads cryptographic workloads at line rate, enabling VPN, IPsec, and SSL inspection without CPU utilization penalty.
Typical applications include multi-service routers, LTE/UMTS base stations, secure gateways, network attached storage controllers, industrial control planes, and defense/aerospace packet processors. The MPC8572E is widely used where MIPS-class deterministic performance, real-time I/O, and embedded security must coexist on one die.
When designing with this device, allocate a four-layer PCB minimum with continuous reference planes for the high-speed DDR2 interface. Thermal design is critical since the 33x33 mm BGA can dissipate 10-20 W under full dual-core load. Boundary scan via IEEE 1149.1 JTAG is mandatory for production test.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ MPC8572ELVTAVND — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MPC8572ELVTAVND (نفس عامل الشكل والبصمة) — يختلف في Core Architecture, Manufacturer, Memory Controller, Operating Temperature, Mounting Type.
MPC8572ELVTAULE
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MPC8572EVTAVND
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MPC8572EPXAVND
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MPC8572ECPXAVND
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MPC8572ELVTAVND الحدود القصوى والخصائص الكهربائية
| Manufacturer | NXP USA Inc. (formerly Freescale) |
| Part Family | PowerQUICC III MPC85xx |
| Core Architecture | PowerPC e500, dual-core |
| عرض ناقل البيانات | 32-bit |
| Maximum Clock Speed | 1.5 GHz |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.09 um (90 nm) CMOS |
| العلبة / الحالة | 1023-FCBGA (33x33 mm) |
| L2 Cache | 1 MB shared |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| Memory Controller | Dual DDR2 with ECC |
| Ethernet | 4x GbE (SGMII/RGMII) + 2x TSEC |
| High-Speed I/O | PCI Express x8, Serial RapidIO |
| Security Engine | AES, DES, 3DES, Kasumi, SHA-1/256 |
| نوع التركيب | Surface Mount (BGA) |
| درجة حرارة التشغيل | 0C to +85C (commercial) |
دليل تكوين أطراف MPC8572ELVTAVND 1023-fcbga (33x33 mm)
تكوين الأطراف لـ MPC8572ELVTAVND (حزمة 1023-fcbga (33x33 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MPC8572ELVTAVND.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MPC8572ELVTAVND مناسب لـ 6 التطبيقs: Multi-Service Router Control Plane, LTE / UMTS Base Station Baseband, Secure VPN Gateway / SSL Appliance, Network Attached Storage Controller, Industrial Control Plane Processor, Defense / Aerospace Packet Processor.
Multi-Service Router Control Plane
The MPC8572ELVTAVND's dual e500 cores at 1.5 GHz and integrated DDR2 controllers deliver deterministic packet-classification performance for multi-service routers. Its hardware security engine offloads IPsec and SSL inspection at line rate, while the four GbE MACs aggregate multiple WAN interfaces without external PHY switches. The CoreNet platform fabric ensures non-blocking traffic between cores, security accelerator, and high-speed I/O. Power dissipation under dual-core routing workloads remains within the 33x33 mm FCBGA thermal envelope when paired with forced-air cooling. Designers can consolidate routing, QoS, and encryption onto a single die.
موصى به
LTE / UMTS Base Station Baseband
The MPC8572ELVTAVND serves as a baseband processor in LTE and UMTS Node B equipment, where its dual cores handle MAC-layer scheduling, RLC segmentation, and HARQ processing. PCI Express x8 links to dedicated DSP or FPGA accelerators for PHY-layer FFT and channel coding, while Serial RapidIO provides deterministic latency to RF front-end cards. Hardware Kasumi and Snow cipher engines accelerate cellular network authentication. The 1023-FCBGA footprint supports the high-density backplane designs typical of telecom equipment racks.
موصى به
Secure VPN Gateway / SSL Appliance
For IPsec VPN concentrators and SSL inspection appliances, the MPC8572ELVTAVND's integrated security engine delivers AES-256 and 3DES at multi-gigabit rates without CPU involvement. Dual GbE ports handle WAN aggregation, while the DDR2 controllers sustain packet buffers for encrypted traffic bursts. The e500 cores manage routing tables, IKE negotiation, and policy enforcement. Power envelope scales with security workload, peaking near 18 W under sustained IPsec throughput. Embedded Linux with strongSwan or OpenSSL maps cleanly onto the hardware crypto offload.
موصى به
Network Attached Storage Controller
NAS controllers benefit from the MPC8572ELVTAVND's dual-core throughput for RAID parity calculation, NFS/SMB file serving, and iSCSI offload. PCI Express connects to SAS/SATA controller ICs for disk arrays, while GbE MACs aggregate multi-gigabit network uplinks. The 1 MB L2 cache and DDR2-800 bandwidth handle metadata operations for large storage pools. The hardware crypto engine accelerates encrypted filesystems such as LUKS or ZFS with AES-NI-equivalent offload. Watch for thermal budget under RAID rebuild workloads.
موصى به
Industrial Control Plane Processor
In industrial automation and SCADA systems, the MPC8572ELVTAVND provides deterministic control-plane processing with deterministic GbE and RapidIO connectivity to remote I/O racks. Its extended temperature capability with proper heatsinking suits factory-floor enclosures. Hardware-assisted security protects OT networks from intrusion. The 32-bit e500 cores run real-time operating systems such as VxWorks or RT-Linux for sub-millisecond control loops. ECC on DDR2 ensures memory reliability in electrically noisy industrial environments.
موصى به
Defense / Aerospace Packet Processor
For tactical communications, signal intelligence, and avionics databuses, the MPC8572ELVTAVND's hardware security engine provides FIPS-validated AES and SHA acceleration. Its PCI Express and Serial RapidIO interfaces interoperate with FPGA-based signal-processing pipelines, while dual GbE handles encrypted backbone traffic. ECC-protected DDR2 mitigates single-event upsets in avionics environments. Software portability across the PowerQUICC III family simplifies DO-178B and MIL-STD-810 qualification reuse across platforms.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MPC8572ELVTAVND — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MPC8572ELVTAULE | MPC8572EVTAVND | MPC8572EPXAVND | MPC8572ECPXAVND |
|---|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) |
| Hardware Security Engine | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA | AES/DES/3DES/Kasumi/SHA |
| DDR2 Memory Controller | Dual channel with ECC | Dual channel with ECC | Dual channel with ECC | Dual channel with ECC | Dual channel with ECC |
أبرز الفروقات
- Dual e500 cores at 1.5 GHz vs family variants (مقابلMPC8572ELVTAULE)
- Extended temperature grade for industrial deployments (مقابلMPC8572EVTAVND)
- Integrated hardware security engine with Kasumi/Snow ciphers (مقابلMPC8548E single-core part)
ملاحظات التصميم
The MPC8572ELVTAVND dissipates 10-20 W under dual-core load at 1.5 GHz. The 33x33 mm FCBGA requires a multilayer PCB with thermal vias under the die pad and, in most chassis designs, forced-air cooling. Estimated: with theta_JA of approximately 1.0 C/W using a 12-layer board with thermal vias, junction temperature rises about 15C per 10W above ambient. Maintain junction below 125C with 15C margin under worst-case ambient.
Allocate a minimum 4-layer PCB with continuous ground and power planes for the DDR2 interface. Route DDR2 traces with matched lengths within 25 mil tolerance and 50 ohm controlled impedance. Place decoupling capacitors as close as possible to each power pin: 0.1 uF ceramic for high-frequency, 10 uF bulk per supply rail. The FCBGA land pattern requires NSMD pads with 0.5 mm pitch and solder mask defined or non-solder mask defined per IPC-7351.
The PCI Express x8 and Serial RapidIO interfaces require 100 ohm differential impedance with intra-pair skew under 5 mil. Use AC-coupling capacitors on transmit pairs near the MPC8572ELVTAVND balls. Reference clock routing must be guarded by ground vias and maintain 50 ohm single-ended impedance. For SGMII GbE links, follow the NXP reference design layout exactly - any deviation can cause link training failures at 1.25 Gbaud.
Do not skip the power-sequencing requirements of the 1.8 V, 2.5 V, and 3.3 V rails - the datasheet mandates a specific sequence to prevent latch-up. Always populate the JTAG test access port even in production designs for boundary scan per IEEE 1149.1. The CFG pins (reset configuration) must be pulled correctly at POR or the device will not start. Reset clears using reset commonly the board will not boot - verify the cfg_rcw_src selection.
معلومات الامتثال
RoHS status for the MPC8572ELVTAVND was not present in the Verified Web Data snippets and is marked unknown. Lead-free (Pb-free) construction is consistent with modern NXP PowerQUICC III production per distributor listings. REACH and halogen-free status to be confirmed via the NXP product compliance letter.