MSP430F2132CY - 16MHz 16-Bit MCU with 8KB Flash | Texas Instruments
MPN: MSP430F2132CY ✓ نشطMSP430F2132CY نظرة عامة
An ultra-low-power microcontroller is an embedded processing IC designed to balance compute capability, analog measurement, serial communications, and energy efficiency. The MSP430F2132 belongs to the MSP430 family, whose hierarchy is MSP430 mixed-signal microcontroller, RISC microcontroller, embedded microcontroller, and semiconductor. Its architecture is intended for portable measurement and control products that require more than simple digital I/O but benefit from compact code, built-in analog conversion, and multiple low-power operating modes.
The principal device parameters include a 16-bit CPU operating at up to 16 MHz, 8KB of Flash memory, 512B of SRAM, a 10-bit ADC, and an analog comparator. The integrated communication capability covers I2C, SPI, and UART, allowing the MCU to connect sensors, displays, transceivers, and external data-acquisition hardware without requiring separate interface controllers. The MSP430 architecture also provides dedicated handling for timed capture, timing, and mixed-signal measurement tasks common in portable instruments.
The MSP430F2132 family is suitable for battery-powered measurement, industrial sensing, building-control equipment, compact instrumentation, and connected low-power nodes. An ADC and comparator can share the same silicon with the digital core, reducing board area in designs that measure an analog quantity and then communicate the result. The 8KB Flash capacity provides a defined code-storage budget, while 512B of SRAM supports working state, stack, buffers, and peripheral data handling.
Because MSP430F2132CY is supplied as a die-sale product, engineers should confirm die orientation, bonding requirements, assembly process, exposed features, quality requirements, and production handling directly with Texas Instruments before committing the device to a PCB or automated assembly flow. The CY ordering suffix should not be interpreted as a finished package designation.
This page consolidates verified manufacturer and distributor information, current price breaks, technical specifications, and purchasing guidance for MSP430F2132CY. It also identifies where package, pinout, compliance, and exact substitute data remain unavailable so engineers can avoid treating unverified package or cross-reference assumptions as production facts.
بدائل مباشرة لـ MSP430F2132CY — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
لا تتوفر بدائل متوافقة تمامًا لهذا المنتج.
اطلب بدائلMSP430F2132CY الحدود القصوى والخصائص الكهربائية
| Product Type | 16-bit ultra-low-power mixed-signal microcontroller |
| CPU Architecture | MSP430 16-bit RISC |
| أقصى تردد للساعة | 16 MHz |
| Register Width | 16 bit |
| Flash Memory | 8 KB |
| Flash Organization | 8K x 8 + 256 B |
| SRAM | 512 B |
| ADC Resolution | 10 bit |
| Analog Comparator | Integrated |
| Serial Interfaces | I2C, SPI, UART |
| Number of USCI Peripherals | 1 |
| Supply Type | Die sale |
| العلبة | Unspecified die package |
دليل تكوين أطراف MSP430F2132CY unspecified die package
تكوين الأطراف لـ MSP430F2132CY (حزمة unspecified die package). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MSP430F2132CY.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MSP430F2132CY مناسب لـ 6 التطبيقs: Battery-Powered Portable Measurement, Industrial Sensor Node, Connected Low-Power Instrument, Compact Data-Acquisition Controller, Building-Control Endpoint, Smart Low-Power Sensor Module.
Battery-Powered Portable Measurement
MSP430F2132CY fits portable measurement equipment that must acquire an analog input, retain a compact firmware image, and report results through a serial link. Its 16 MHz 16-bit MSP430 CPU provides processing capacity, while the integrated 10-bit ADC and comparator reduce the need for separate signal-conditioning and conversion hardware. The 8KB Flash footprint provides a defined firmware budget, and the 512B SRAM supports operating state, stack space, and measurement buffers. Because the CY suffix is supplied as a die sale, the device is best suited to organizations that can validate bare-die bonding, orientation, and assembly rather than conventional automated PCB placement.
موصى به
Industrial Sensor Node
MSP430F2132CY can serve as the controller in a compact industrial sensor node that measures an analog process signal and communicates with a higher-level controller. The 10-bit ADC supports embedded signal conversion, while I2C and SPI provide options for connecting sensors, flash memory, or digital peripherals. Its 16-bit CPU and 16 MHz clock are appropriate for coordinated sampling, filtering, threshold evaluation, and control logic. However, the verified material does not provide the device's operating-temperature or supply-voltage limits, so industrial environmental qualification must be confirmed from the manufacturer rather than inferred from the family description.
موصى به
Connected Low-Power Instrument
MSP430F2132CY is appropriate for compact instruments that need local measurement and a simple host connection. The integrated UART supports serial telemetry, while I2C and SPI expand the available peripheral options for configuration chips, memory, or sensor interfaces. Its 512B SRAM and 8KB Flash make firmware planning explicit, which is useful in cost-sensitive embedded products. Design teams should budget code carefully and verify whether the application needs the larger memory resources of another MCU. For a die-based implementation, the electrical assembly and inspection process is as important as the electrical feature selection.
موصى به
Compact Data-Acquisition Controller
MSP430F2132CY can act as a compact data-acquisition controller for analog monitoring where a 10-bit converter, configurable digital logic, and serial data transfer are required. The MSP430F2132 family's 16-bit architecture supports fixed-point signal handling, while the comparator can support threshold or event detection alongside ADC measurements. I2C, SPI, and UART allow the controller to connect to external storage, transducers, or a communications interface. These capabilities are meaningful in space-constrained products, but the verified data does not state ADC sample rate, reference voltage, or input-channel count, so those timing parameters must be obtained from the datasheet before acquisition-rate planning.
موصى به
Building-Control Endpoint
MSP430F2132CY is suitable for a low-cost building-control endpoint that reads an analog sensor, evaluates local thresholds, and communicates status to a controller. The 10-bit ADC and comparator support sensing without requiring separate conversion circuitry, and the integrated UART or I2C interface can connect to a wired control backbone. Its 8KB Flash and 512B SRAM provide sufficient resources for focused firmware when the application avoids large protocol stacks or complex graphics. The published data does not specify operating-temperature limits, so deployment conditions, surge exposure, and EMC requirements should be checked directly against the manufacturer documentation before field installation.
موصى به
Smart Low-Power Sensor Module
MSP430F2132CY can support a smart sensor module that combines analog measurement with low-power digital processing and short-range serial connectivity. The 16 MHz MSP430 CPU can execute acquisition routines and local decisions, while the 8KB Flash and 512B SRAM impose clear boundaries on firmware complexity. I2C and SPI enable attachment of digital sensors or configuration devices, and UART can carry processed data to a host. Since this ordering code is a die sale, module developers must incorporate die orientation, bonding, traceability, and assembly validation into the product plan instead of treating the component as a standard surface-mount package.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MSP430F2132CY — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
أبرز الفروقات
- Die-sale sourcing option within the MSP430F2132 family (مقابلMSP430F2132-EP)
- Integrated mixed-signal measurement resources (مقابلMSP430F2132-EP)
- Multiple serial-interface choices in one MCU (مقابلMSP430F2132-EP)
ملاحظات التصميم
Do not treat MSP430F2132CY as a standard packaged MCU. The verified ordering information identifies the target as a die sale, so a finished-package MSP430F2132 pinout cannot be copied onto the PCB. Before layout, obtain the current die drawing, bonding information, orientation marks, exposed-feature requirements, and assembly process from Texas Instruments. This step is critical because a logically equivalent base device can still be physically incompatible with the intended assembly flow.
Plan the power tree and operating modes from the verified family capabilities rather than assuming a fixed current figure. MSP430F2132CY provides a 16 MHz 16-bit CPU, 10-bit ADC, comparator, and I2C, SPI, and UART interfaces, all of which affect activity and quiescent demand. Exact supply-voltage limits and current specifications are marked as needed because they were not supplied. Obtain those values from the manufacturer datasheet and verify brownout, startup, and peripheral-state behavior before finalizing the power supply.
Reserve PCB space and assembly tooling around the confirmed die geometry rather than an inferred package. Account for die orientation, bonding pad access, assembly tolerances, inspection requirements, and any substrate or heat-spreading arrangement specified by Texas Instruments. Because the verified source does not publish a conventional pinout for the CY ordering code, an engineer-created footprint based only on another package suffix could create assembly defects or damage the device.
Separate analog measurement paths from fast digital switching and serial interfaces. The integrated 10-bit ADC and comparator should use short, controlled routes to their source networks, while I2C, SPI, UART, and clock signals require suitable impedance and return-path treatment. Refer to the manufacturer's datasheet and layout guidance for grounding, decoupling, and analog-reference requirements because the verified excerpt does not specify pin assignments, reference configuration, or recommended component values.
معلومات الامتثال
The verified excerpts identify a die-sale ordering option and an enhanced-product family variant but do not provide component-specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. These fields remain unknown rather than being inferred.
