PIC16F887-E/ML - 8-Bit MCU, 14KB Flash, 20MHz, 44-QFN | Microchip
MPN: PIC16F887-E/ML ✓ نشطPIC16F887-E/ML نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (flash/ROM), working memory (SRAM), and configurable peripherals onto one die. Within the broader taxonomy, the PIC16F887 sits in the hierarchy: microcontroller -> 8-bit MCU -> PIC mid-range family -> flash-based MCU -> embedded controller. Its enhanced mid-range core adds C-optimized instructions and a hardware 8x8 multiplier while retaining the famously compact 35-instruction set favored for cost-sensitive and timing-deterministic designs.
Key features of the PIC16F887 family include 36 digital I/O pins, a 14-channel 10-bit ADC, two comparators, three timers (Timer0/1/2), one Enhanced USART, MSSP for SPI/I2C, a capture/compare/PWM module, nanoWatt power management and ICD/ICSP in-circuit debugging via two pins. The integrated ADC supporting up to 14 analog channels simplifies sensor interface designs.
The PIC16F887 architecture delivers deterministic instruction execution with Harvard bus separation between program flash and data SRAM. Internal RC oscillator options (8MHz/32kHz) and PLL support reduce external component count, while the wide 2.0V-5.5V supply range and nanoWatt sleep modes make it suitable for battery-powered and industrial nodes.
Typical applications include industrial sensor front-ends, HVAC controllers, appliance control boards, automotive body modules (non-safety), signal conditioning, embedded data acquisition, and home-automation nodes. The 36 I/O count and abundant peripherals address systems that previously required a more expensive 80-pin MCU.
A key design consideration is supply decoupling: place a 100nF ceramic between VDD and VSS as close to the pins as possible, plus a bulk 10uF on the input rail. Use Microchip's ICD header pinout for in-circuit debugging without removing the MCU from the board.
This page synthesizes distributor pricing, drop-in replacement alternatives and practical design notes - information synthesized by cross-referencing the manufacturer datasheet with real-time distributor inventory that is not aggregated in any single manufacturer document.
بدائل مباشرة لـ PIC16F887-E/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC16F887-E/ML (نفس عامل الشكل والبصمة) — يختلف في ADC, Core Architecture, Package, Timers, Maximum CPU Speed.
PIC16F887-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F887T-E/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16F887T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F887F-E/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16F887F-I/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16F887-E/P
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F887-E/ML الحدود القصوى والخصائص الكهربائية
| Core Architecture | PIC 8-bit enhanced mid-range |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| SRAM | 368 bytes |
| EEPROM Data Memory | 256 bytes |
| Maximum CPU Speed | 20 MHz (200 ns instruction cycle) |
| Supply Voltage Range | 2.0 V to 5.5 V |
| نطاق درجة حرارة التشغيل | -40C to +125C (Extended, -E grade) |
| I/O Pins | 36 |
| ADC | 14-channel, 10-bit |
| Comparators | 2 |
| Timers | 3 (Timer0, Timer1, Timer2) |
| PWM Modules | 1 ECCP + 2 CCP |
| Communication Peripherals | EUSART, MSSP (SPI/I2C) |
| Instruction Set | 35 single-word instructions |
| العلبة | 44-pin QFN (8x8 mm) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف PIC16F887-E/ML
| دبوس 1 | RE3/MCLR/VPP — Digital input only / Master Clear (Reset) input / Programming voltage input |
| دبوس 2 | OSC1/CLKI/RA7 — External oscillator input / General purpose I/O |
| دبوس 3 | OSC2/CLKO/RA6 — External oscillator output / General purpose I/O |
| دبوس 4 | RA5/AN4/C2OUT — Digital I/O / Analog input 4 / Comparator 2 output |
| دبوس 5 | RA4/AN3 — Digital I/O / Analog input 3 |
| دبوس 6 | RA3/AN2/Vref+ — Digital I/O / Analog input 2 / ADC positive reference |
| دبوس 7 | RA2/AN2/Vref- — Digital I/O / Analog input 2 / ADC negative reference |
| دبوس 8 | RA1/AN1 — Digital I/O / Analog input 1 |
| دبوس 9 | RA0/AN0/ULPWU — Digital I/O / Analog input 0 / Ultra Low-Power Wake-up |
| دبوس 10 | RE2/AN7 — Digital I/O / Analog input 7 |
| دبوس 11 | RE1/AN6 — Digital I/O / Analog input 6 |
| دبوس 12 | RE0/AN5 — Digital I/O / Analog input 5 |
| دبوس 13 | VDD — Positive supply voltage (2.0V to 5.5V) |
| دبوس 14 | VSS — Ground reference (logic & I/O) |
| دبوس 15 | RD7/PSP7 — Digital I/O / Parallel Slave Port data bit 7 |
| دبوس 16 | RD6/PSP6 — Digital I/O / Parallel Slave Port data bit 6 |
| دبوس 17 | RD5/PSP5 — Digital I/O / Parallel Slave Port data bit 5 |
| دبوس 18 | RD4/PSP4 — Digital I/O / Parallel Slave Port data bit 4 |
| دبوس 19 | RC7/RX/DT — Digital I/O / EUSART asynchronous receive / EUSART synchronous data |
| دبوس 20 | RC6/TX/CK — Digital I/O / EUSART asynchronous transmit / EUSART synchronous clock |
| دبوس 21 | RC5/SDO — Digital I/O / MSSP SPI data out |
| دبوس 22 | RC4/SDI/SDA — Digital I/O / MSSP SPI data in / MSSP I2C data |
| دبوس 23 | RC3/SCL/SCK — Digital I/O / MSSP I2C clock / MSSP SPI clock |
| دبوس 24 | RC2/CCP1 — Digital I/O / Capture/Compare/PWM 1 output |
| دبوس 25 | RC1/CCP2 — Digital I/O / Capture/Compare/PWM 2 output |
| دبوس 26 | RC0 — Digital I/O |
| دبوس 27 | RB7/ICSPDAT — Digital I/O / ICSP data |
| دبوس 28 | RB6/ICSPCLK — Digital I/O / ICSP clock |
| دبوس 29 | RB5/PGM — Digital I/O / Programming mode |
| دبوس 30 | RB4 — Digital I/O |
| دبوس 31 | RB3/CCP2 — Digital I/O / Capture/Compare/PWM 2 output (alternate) |
| دبوس 32 | RB2 — Digital I/O |
| دبوس 33 | RB1 — Digital I/O |
| دبوس 34 | RB0/INT — Digital I/O / External interrupt |
| دبوس 35 | AVDD — Analog positive supply |
| دبوس 36 | AVSS — Analog ground |
| دبوس 37 | RD3/PSP3 — Digital I/O / Parallel Slave Port data bit 3 |
| دبوس 38 | RD2/PSP2 — Digital I/O / Parallel Slave Port data bit 2 |
| دبوس 39 | RD1/PSP1 — Digital I/O / Parallel Slave Port data bit 1 |
| دبوس 40 | RD0/PSP0 — Digital I/O / Parallel Slave Port data bit 0 |
| دبوس 41 | RD3-PT0 — Not connected (reserved) |
| دبوس 42 | NC — Not connected (per datasheet) |
| دبوس 43 | NC — Not connected (per datasheet) |
| دبوس 44 | EP — Exposed thermal pad - must be soldered to PCB ground for thermal dissipation |
التطبيقات النموذجية
PIC16F887-E/ML مناسب لـ 6 التطبيقs: Industrial Sensor Front-End, Home Appliance Control Board, HVAC Climate Controller, Battery-Operated IoT Sensor Node, Automotive Body Module (Non-Safety), Embedded Data Acquisition.
Industrial Sensor Front-End
The PIC16F887-E/ML fits industrial sensor front-ends because its 14-channel 10-bit ADC, 36 digital I/O pins and extended -40C to +125C temperature grade handle multi-signal conditioning directly without external ADC chips. With 14 KB of flash, developers can run Modbus RTU or proprietary serial protocols, implement 100 Hz sensor reads, and store calibration in 256 bytes of EEPROM. The MSSP supports SPI for digital sensors (accelerometers, thermocouple amplifiers) while the EUSART drives RS-485 transceivers on industrial buses; the same hardware resources previously required a larger PIC18 for a similar workload.
موصى به
Home Appliance Control Board
The PIC16F887-E/ML is widely deployed in washing machines, dishwashers and HVAC thermostat control boards where the 35-instruction PIC16 enhanced mid-range set delivers deterministic 200 ns interrupt latency for safety-critical control loops. Its three timers and capture/compare/PWM modules drive triac/relay control and tri-color LED indication, while 36 I/O accept keypad inputs and seven-segment displays without external logic. The nanoWatt sleep modes (<1 uA typical) let these appliances pass standby-energy regulations; ICSP via two pins keeps manufacturing test and field updates simple.
موصى به
HVAC Climate Controller
HVAC thermostat and air-handler designs use the PIC16F887-E/ML to drive triac-controlled compressor switches, read NTC thermistor networks through its 10-bit ADC and run proportional-control loops with the 16-bit Timer1. The 256-byte EEPROM stores user-setpoint schedules, the EUSART uplinks to a BACnet or Modbus backbone, and the wide 2.0-5.5V supply range lets the same part operate on 24 VAC derived rails with simple rectification. The -40C to +125C grade covers attic-mounted and equipment-room installations.
موصى به
Battery-Operated IoT Sensor Node
Battery-operated wireless sensor nodes pair the PIC16F887-E/ML with a sub-GHz or BLE module (e.g., SPI-controlled transceivers) to deliver multi-year coin-cell runtime. The MCU's nanoWatt sleep mode drops current below 1 uA typical between measurements, the integrated 10-bit ADC reads environmental sensors directly, and 14 KB flash accommodates over-the-air firmware staging plus an application image plus a bootloader. The 2.0-5.5V supply range accepts unregulated Li-coin or 2x AA chemistries without a boost converter, extending battery life.
موصى به
Automotive Body Module (Non-Safety)
Interior lighting controllers, mirror adjust modules and accessory retrofits use the PIC16F887-E/ML because its 5.5V supply ceiling handles 12V transients through series regulation, and its 36 I/O matrix-scan up to 64-button keypads without external logic. The MSSP drives LIN slave transceivers (with a small external transceiver IC) or SPI peripherals like LED drivers; AEC-Q100 is NOT specified for this part, so it must be limited to non-safety interior/body domains by automotive OEMs. Wide -40C to +125C covers engine-bay-adjacent underhood locations.
موصى به
Embedded Data Acquisition
In factory-floor data loggers, the PIC16F887-E/ML aggregates 14 analog channels at up to 100 ksps aggregate rate, timestamps samples via Timer1 against an external 32.768 kHz crystal or internal 8 MHz RC, and streams buffered records over EUSART or MSSP to an external FRAM. The 256-byte EEPROM holds metadata and configuration parameters across power cycles, while the 14 KB flash stores firmware for the data pipeline and optional Modbus framing. Its 20 MHz throughput keeps up with multiplexed sensor arrays at typical process-control sampling rates.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC16F887-E/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC16F887-I/ML | PIC16F887T-E/ML | PIC16F887T-I/ML | PIC16F887F-E/ML | PIC16F887F-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN (8x8 mm) - ML | 44-pin QFN (8x8 mm) - ML | 44-pin QFN (8x8 mm) - ML | 44-pin QFN (8x8 mm) - ML | 44-pin QFN (8x8 mm) - ML | 44-pin QFN (8x8 mm) - ML |
| Operating Temperature Range | -40C to +125C (Extended, -E) | -40C to +85C (Industrial, -I) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended, F RoHS variant) | -40C to +85C (Industrial, F RoHS variant) |
| Flash Memory | 14 KB (8K x 14) | 14 KB | 14 KB | 14 KB | 14 KB | 14 KB |
| SRAM / EEPROM | 368 B / 256 B | 368 B / 256 B | 368 B / 256 B | 368 B / 256 B | 368 B / 256 B | 368 B / 256 B |
| Maximum CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V |
| Approx. Qty-1 Unit Price | USD 4.20 | USD ~3.85 | USD ~4.20 (T&R) | USD ~3.85 (T&R) | USD ~4.20 (F RoHS) | USD ~3.85 (F RoHS) |
أبرز الفروقات
- Extended -40C to +125C temperature grade (-E suffix) (مقابلPIC16F887-I/ML)
- Tape-and-reel / lead-free / Pb-free variant flexibility (مقابلPIC16F887T-E/ML and PIC16F887F-I/ML)
- Same die and pinout across all -/ML suffix variants (مقابلAll listed drop-in alternatives)
ملاحظات التصميم
Place a 100 nF X7R ceramic bypass capacitor between AVDD/AVSS (pin 35/36) and a separate AVDD-derived trace, plus a second 100 nF between VDD/VSS (pin 13/14), as close to the package pins as possible. Add a bulk 10 uF aluminum-polymer cap at the regulator output. The PIC16F887 has separate digital and analog VDD/VSS pins for ADC noise isolation - never tie them directly without isolated traces.
The /ML package's exposed thermal pad (pin 44 / EP) MUST be soldered to a PCB ground paddle, ideally with thermal vias to an internal copper plane, to achieve the rated thermal performance and provide a low-impedance ground reference. Without the paddle soldered, junction-to-ambient thermal resistance rises dramatically and ADC accuracy may degrade at elevated temperatures.
Route analog signals (RA0/AN0-RA5, RE0/AN5-RE3/AN7) on the opposite side of the board from high-speed digital lines, and surround analog traces with a guard ground. Keep crystal traces (OSC1/OSC2 on pin 2/3) within 5 mm of the package with GND flooded adjacent to suppress emission. Add 4-7 component small-value ceramic caps around AVDD if bypass from switching converters is present.
Do not drive MCLR/VPP (pin 1) directly from a low-impedance rail; use the ICSP isolation circuit recommended in Microchip's debugger header documentation or add a 10 kohm isolation resistor. Applying >13V to MCLR during ICSP is required and the path must be free of clamping diodes - putting low-leakage diodes on MCLR prevents ICSP programming.
Enable the software PWRT, BOD and OST startup configuration bits to avoid spurious code execution at voltages below the BVD threshold. Use Fosc 8 MHz internal HFINTOSC with PLL for +20 MHz operation only if your application tolerates the +2% nominal accuracy, or add an external 20 MHz crystal (HS mode) for clock-sensitive UART communications.
معلومات الامتثال
Not AEC-Q100 qualified - limiting automotive use to non-safety applications. The F-suffix (PIC16F887F-E/ML) explicitly designates lead-free RoHS/REACH compliant variants per Microchip ordering code scheme.
