PIC16F887-I/ML - 8-bit MCU 14KB Flash 36 I/O QFN-44 | Microchip
MPN: PIC16F887-I/ML ✓ نشطPIC16F887-I/ML نظرة عامة
An 8-bit MCU is a microprocessor core optimized for embedded control, executing one byte-wide instruction per cycle. Within the broader taxonomy, 8-bit MCUs sit below 32-bit microcontrollers (e.g., ARM Cortex-M) in performance but excel in deterministic real-time behavior, lower cost, lower power, and simpler toolchains - making them dominant in consumer appliances, automotive body electronics, sensor nodes, and industrial control. The PIC16F887 belongs to Microchip's mid-range PIC16 enhanced family, sharing the PIC16 instruction set architecture with later PIC18 and dsPIC siblings.
Key features include an integrated 10-bit Analog-to-Digital Converter (ADC) with up to 14 channels, multiple communication peripherals (USART, MSSP for SPI/I2C), two 8-bit and one 16-bit timers, a 14-bit PWM module, and a nanoWatt power-managed sleep mode drawing less than 1 µA. The 256-byte self-programmable EEPROM supports in-application data logging without external storage. Brown-out Reset (BOR), Power-on Reset (POR), and Watchdog Timer (WDT) provide robust field reliability.
Architecturally, the PIC16F887 uses a Harvard RISC core with separate program and data buses, enabling most instructions to complete in one instruction cycle. The 14-bit instruction word and 8-bit data path deliver predictable throughput, while the 20 MHz oscillator (5 MIPS performance) is adequate for control loops up to a few hundred kHz.
Typical applications include industrial sensor interfaces, home appliance control panels, battery-powered IoT sensor nodes, automotive body controllers, and consumer electronics. The wide operating voltage (2.0-5.5V) supports both 3.3V and 5V designs.
When designing with this device, allocate sufficient decoupling (100 nF + 10 µF) near VDD and AVdd pins, and use Microchip's MPLAB X IDE with XC8 compiler for code development. The ICSP programming interface requires dedicated PGx and PGD pins reserved on the PCB layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ PIC16F887-I/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC16F887-I/ML (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Operating Temperature, Core Architecture, Timers.
PIC16F887-I/PT
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F887-E/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F886-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F884-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16F882-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16F877A-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC16F887-I/ML الحدود القصوى والخصائص الكهربائية
| Core Architecture | PIC16 8-bit RISC (Harvard) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| SRAM | 368 bytes |
| EEPROM Data Memory | 256 bytes |
| Maximum CPU Speed | 20 MHz (5 MIPS) |
| Operating Voltage Range | 2.0 V to 5.5 V |
| I/O Pins | 36 |
| ADC | 10-bit, up to 14 channels |
| Timers | 2 x 8-bit, 1 x 16-bit |
| PWM Channels | 3 (CCP/ECCP modules) |
| Communication | EUSART, MSSP (SPI/I2C) |
| العلبة | QFN-44 (ML) 8x8 mm |
| درجة حرارة التشغيل | -40C to +85C (Industrial) |
| Instruction Set | 35 single-word instructions |
| Instruction Cycle | 200 ns @ 20 MHz |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
| حالة RoHS | Compliant |
| نوع التركيب | Surface Mount |
تكوين أطراف PIC16F887-I/ML
| دبوس 1 | MCLR/VPP/RE3 — Master Clear (reset) input / programming voltage / digital input RE3 |
| دبوس 2 | RA0/AN0/ULPWU — PORTA bit 0 / analog input 0 / ultra-low-power wake-up |
| دبوس 3 | RA1/AN1 — PORTA bit 1 / analog input 1 |
| دبوس 4 | RA2/AN2/VREF- — PORTA bit 2 / analog input 2 / ADC negative reference |
| دبوس 5 | RA3/AN3/VREF+ — PORTA bit 3 / analog input 3 / ADC positive reference |
| دبوس 6 | RA4/AN4/T0CKI — PORTA bit 4 / analog input 4 / Timer0 clock input |
| دبوس 7 | RA5/AN5/SS — PORTA bit 5 / analog input 5 / SPI slave select |
| دبوس 8 | RE0/AN6 — PORTE bit 0 / analog input 6 |
| دبوس 9 | RE1/AN7 — PORTE bit 1 / analog input 7 |
| دبوس 10 | RE2/AN8 — PORTE bit 2 / analog input 8 |
| دبوس 11 | VDD — Positive supply voltage |
| دبوس 12 | VSS — Ground reference |
| دبوس 13 | OSC1/CLKI/RA7 — Oscillator crystal input / external clock input / PORTA bit 7 |
| دبوس 14 | OSC2/CLKO/RA6 — Oscillator crystal output / clock output / PORTA bit 6 |
| دبوس 15 | RC0/T1OSO/T1CKI — PORTC bit 0 / Timer1 oscillator output / Timer1 clock input |
| دبوس 16 | RC1/T1OSI — PORTC bit 1 / Timer1 oscillator input |
| دبوس 17 | RC2/P1A/CCP1 — PORTC bit 2 / PWM output 1A / CCP1 I/O |
| دبوس 18 | RC3/SCK/SCL — PORTC bit 3 / SPI clock / I2C clock |
| دبوس 19 | RD0 — PORTD bit 0 |
| دبوس 20 | RD1 — PORTD bit 1 |
| دبوس 21 | RD2 — PORTD bit 2 |
| دبوس 22 | RD3 — PORTD bit 3 |
| دبوس 23 | RC4/SDI/SDA — PORTC bit 4 / SPI data in / I2C data |
| دبوس 24 | RC5/SDO — PORTC bit 5 / SPI data out |
| دبوس 25 | RC6/TX/CK — PORTC bit 6 / USART async transmit / USART sync clock |
| دبوس 26 | RC7/RX/DT — PORTC bit 7 / USART async receive / USART sync data |
| دبوس 27 | RD4 — PORTD bit 4 |
| دبوس 28 | RD5/P1B — PORTD bit 5 / PWM output 1B |
| دبوس 29 | RD6/P1C — PORTD bit 6 / PWM output 1C |
| دبوس 30 | RD7/P1D — PORTD bit 7 / PWM output 1D |
| دبوس 31 | VSS — Ground reference |
| دبوس 32 | VDD — Positive supply voltage |
| دبوس 33 | RB0/AN12/INT — PORTB bit 0 / analog input 12 / external interrupt |
| دبوس 34 | RB1/AN10 — PORTB bit 1 / analog input 10 |
| دبوس 35 | RB2/AN8 — PORTB bit 2 / analog input 8 |
| دبوس 36 | RB3/AN9/PGM — PORTB bit 3 / analog input 9 / LVP programming |
| دبوس 37 | RB4/AN11 — PORTB bit 4 / analog input 11 |
| دبوس 38 | RB5/AN13 — PORTB bit 5 / analog input 13 |
| دبوس 39 | RB6/PGC — PORTB bit 6 / ICSP clock |
| دبوس 40 | RB7/PGD — PORTB bit 7 / ICSP data |
| دبوس 41 | NC — Not connected (per datasheet) |
| دبوس 42 | NC — Not connected (per datasheet) |
| دبوس 43 | NC — Not connected (per datasheet) |
| دبوس 44 | EP — Exposed thermal pad - connect to VSS |
التطبيقات النموذجية
PIC16F887-I/ML مناسب لـ 6 التطبيقs: Industrial Sensor Interface Module, Home Appliance Control Panel, Battery-Powered IoT Sensor Node, Automotive Body Electronics (Non-Safety), Consumer Electronics Remote Control, Educational & Hobby Embedded Platform.
Industrial Sensor Interface Module
The PIC16F887-I/ML fits industrial sensor interface modules due to its 14-channel 10-bit ADC, 36 I/O pins, and 2.0-5.5 V supply range. The integrated ADC resolves 1024 discrete levels for accurate temperature, pressure, and flow sensor reading, while the MSSP peripheral supports SPI/I2C communication with digital sensors and DACs. At 5 MIPS throughput, the MCU handles 4-20 mA loop conditioning and Modbus RTU framing. nanoWatt sleep modes drawing under 1 µA enable battery-backed operation during line-power outages, critical for field-deployed industrial telemetry. The -40C to +85C industrial temperature rating supports factory floor and outdoor cabinet installation. Recommended companion products include the MCP9700 analog temperature sensor, MCP4725 DAC, and MAX485 RS-485 transceiver for industrial bus connectivity.
موصى به
Home Appliance Control Panel
The PIC16F887-I/ML is well-suited for washing machine, dishwasher, and microwave oven control panels. Its 36 I/O pins drive 7-segment LED displays, keypads, and triac-controlled loads simultaneously. The 14 KB Flash accommodates state-machine firmware plus user-interface logic, while 256 bytes of EEPROM stores user settings across power cycles. Three PWM channels control motor speed and heater regulation without external driver logic. The 5 MIPS core runs real-time control loops at 50-100 µs cycle time, more than adequate for thermal regulation. The QFN-44 package's small 8x8 mm footprint suits the compact PCBs behind appliance control panels. nanoWatt sleep mode reduces standby power below 0.1 W to meet energy-star regulations. Recommended companions include ULN2003A driver array and triac-based AC load switches.
موصى به
Battery-Powered IoT Sensor Node
The PIC16F887-I/ML is an excellent fit for battery-powered IoT sensor nodes thanks to its nanoWatt Technology sleep currents under 1 µA and wide 2.0-5.5 V supply that runs directly from 3 V lithium coin cells. The 10-bit ADC with 14 channels reads multiple analog sensors without external multiplexing, and the integrated EUSART interfaces with low-power RF modules such as the MRF89XA sub-GHz transceiver. The 256-byte EEPROM stores sensor calibration coefficients and network IDs. The 20 MHz operation allows periodic wake-up, sensor read, RF transmit, and return-to-sleep cycles under 10 ms, achieving average current consumption below 50 µA from a CR2032 cell for multi-year battery life. The QFN-44 package's 0.65 mm pitch requires careful PCB design but enables compact sensor node form factors.
موصى به
Automotive Body Electronics (Non-Safety)
The PIC16F887-I/ML supports non-safety automotive body electronics such as HVAC control heads, infotainment keypads, ambient lighting controllers, and seat-adjustment switches. While the part is industrial-grade (-40C to +85C) and not AEC-Q100 qualified, it performs reliably in cabin environments. Its 36 I/O drives multiple LED indicators, rotary encoders, and CAN-bus LIN bridges via the integrated EUSART. The 14 KB Flash stores vehicle-specific calibration, and 256-byte EEPROM retains user preferences across battery disconnects. The 5 MIPS core handles LIN protocol framing and button debouncing in real time. For AEC-Q100 safety-critical applications, Microchip recommends the PIC16F1939-I/ML upgrade path.
موصى به
Consumer Electronics Remote Control
The PIC16F887-I/ML powers advanced universal remote controls and smart-home keypads that combine IR transmission, RF pairing, capacitive touch sensing, and OLED displays. Its 36 I/O pins support IR LED drivers, multiple capacitive touch buttons via the integrated ADC, and SPI/OLED displays simultaneously. The 14 KB Flash stores device codes for hundreds of consumer brands, while 256-byte EEPROM saves user configurations. nanoWatt sleep mode drops quiescent current below 1 µA for multi-year battery life on two AAA cells. The 20 MHz core handles NEC, RC5, and SIRC IR protocols with timing accuracy within 5 µs, ensuring reliable consumer-device compatibility. The QFN-44 8x8 mm package fits inside slim remote enclosures.
موصى به
Educational & Hobby Embedded Platform
The PIC16F887-I/ML is a popular choice for educational embedded systems courses, Arduino-comparable prototyping platforms, and hobbyist projects. Its 35 single-word instruction set is easier to learn than complex 32-bit ARM cores, while the 14 KB Flash and 36 I/O provide substantial headroom for course projects involving sensor reading, motor control, and communication protocols. The ICSP interface enables in-circuit debugging and programming with low-cost tools like the PICkit 3. Extensive Microchip application notes, sample code libraries, and community tutorials accelerate the learning curve. The QFN-44 package is preferred for finished student projects requiring compact PCB layouts, though the PDIP-40 variant is recommended for breadboard prototyping. The MPLAB X IDE with XC8 compiler is available free of charge.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC16F887-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC16F887-I/PT | PIC16F887-E/ML | PIC16F886-I/ML | PIC16F884-I/ML | PIC16F882-I/ML | PIC16F877A-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-44 (ML) | TQFP-44 (PT) | QFN-44 (ML) - same | QFN-44 (ML) - same | QFN-44 (ML) - same | QFN-44 (ML) - same | QFN-44 (ML) - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB | 7 KB | 3.5 KB | 14 KB |
| SRAM | 368 bytes | 368 bytes | 368 bytes | 368 bytes | 256 bytes | 128 bytes | 368 bytes |
| I/O Pins | 36 | 36 | 36 | 28 | 24 | 24 | 33 |
| Maximum CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| ADC | 10-bit, 14 ch | 10-bit, 14 ch | 10-bit, 14 ch | 10-bit, 11 ch | 10-bit, 14 ch | 10-bit, 11 ch | 10-bit, 8 ch |
أبرز الفروقات
- Highest I/O count and Flash in PIC16F88x family (مقابلPIC16F886-I/ML)
- Enhanced mid-range core with nanoWatt Technology (مقابلPIC16F877A-I/ML)
- Compact QFN-44 with integrated ADC and EEPROM (مقابلPIC16F884-I/ML)
ملاحظات التصميم
Decouple VDD and AVdd separately. Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin (pins 11 and 32) and a 10 µF bulk capacitor within 5 mm. For AVdd, add a separate 10 µF + 100 nF pair to keep analog supply noise below 5 mVpp, critical for ADC accuracy. When using the ADC, connect AVdd to VDD through a ferrite bead to isolate analog and digital switching noise. The MCU draws approximately 1.1 mA at 20 MHz active and under 1 µA in sleep mode.
Do not leave the MCLR/VPP pin floating - this causes erratic resets and unreliable operation. Connect MCLR to VDD through a 10 kΩ pull-up resistor and place a 100 nF decoupling capacitor close to the pin. For ICSP programming, ensure the PGC (RB6) and PGD (RB7) lines have no series resistance exceeding 100 Ω, or programming will fail. The 256-byte EEPROM supports 1 million erase/write cycles minimum - avoid unnecessary EEPROM writes in time-critical interrupt routines.
The QFN-44 (ML) package exposes a thermal pad (pin 44) that must be soldered to a PCB copper pour for proper heat dissipation. Without the thermal pad connected, junction temperature rises approximately 15-20°C above ambient at 20 MHz operation. Design the PCB with at least 1 square inch of 2 oz copper connected to the thermal pad, plus 4-6 thermal vias to the internal ground plane. At 20 MHz the device dissipates approximately 100 mW under typical I/O loading, well within thermal limits when the thermal pad is properly soldered.
The QFN-44 (ML) package has 0.65 mm pitch and exposed thermal pad requiring careful PCB layout. Use 0.4 mm pad width with 0.25 mm spacing per IPC-7351 nominal land pattern. Place at least 4 thermal vias (0.3 mm drill, 0.65 mm pad) under the exposed pad connecting to a ground plane for thermal dissipation. Keep high-speed traces (crystal, OSC1/OSC2) under 5 mm length and surrounded by ground copper to minimize EMI. The ICSP signals PGC (pin 39) and PGD (pin 40) should be routed to a 6-pin header with 0.1-inch pitch for in-circuit programming.
معلومات الامتثال
RoHS compliant per Microchip product page. Industrial temperature grade only (-40C to +85C); not AEC-Q100 qualified - choose PIC16F1939-I/ML for automotive. Lead-free and halogen-free per Microchip material declaration.
