PIC18LF25J10T-I/ML - 8-bit 40MHz 32KB Flash MCU 28-QFN | Microchip
MPN: PIC18LF25J10T-I/ML ✓ نشطPIC18LF25J10T-I/ML نظرة عامة
A PIC microcontroller (MCU) is a self-contained 8-bit computing core with integrated Flash program memory, RAM, peripherals, and general-purpose I/O on a single silicon die. The PIC18 family sits at the high-performance end of Microchip's 8-bit line, using an enhanced Harvard RISC architecture with a 16-bit instruction word that delivers roughly 10 MIPS at 40 MHz. 'LF' denotes the low-voltage FJCJ-series process node optimized for 2.0-3.6 V (PIC18LFxxJ10 family) or 4.2-5.5 V extended-range operation, while plain 'F' parts use 4.2-5.5 V only. Within the power-management IC hierarchy, the PIC18LF25J10T belongs to the microcontroller -> 8-bit MCU -> embedded controller -> semiconductor family tree.
Key features of the PIC18LF25J10T-I/ML include the nanoWatt Technology power-management suite for sleep/Idle modes, a 10-bit ADC with 10 input channels, hardware multipliers, dual analog comparators, an enhanced USART with support for LIN, and four timer modules. The 16-bit wide Flash is single-voltage programmable via ICSP (In-Circuit Serial Programming), enabling firmware updates in the assembled product. Self-programmability under software control and an extended watchdog timer further expand its use in safety-conscious designs.
The PIC18J core pairs an 8-bit datapath with a 16-bit instruction word to keep code density high while preserving deterministic interrupt latency. Internal RC and PLL clocking paths allow the 40 MHz core to be derived from a low-frequency crystal or internal 8 MHz source, reducing external BOM count. The dedicated ICD/ICSP debug pair retains full-speed in-circuit debugging without consuming user I/O.
Typical applications include low-power industrial sensor interfaces, USB/HID peripherals (with an external transceiver), home appliance control panels, automotive body modules, and battery-powered metering where the 'LF' low-voltage operation is acceptable. Designers favor this device when 32 KB of Flash is ample and a QFN footprint is preferred for compact layouts.
When designing with the PIC18LF25J10T-I/ML, supply decoupling must include a 100 nF ceramic capacitor as close as practical to each VDD pin pair plus a bulk 10 uF tantalum or ceramic on the main rail. The exposed thermal pad of the 28-QFN must be soldered to a continuous ground copper pour to meet thermal and EMI performance. Pull-ups on I2C SDA/SCL lines and correct MCLR reset-network design (10 kΩ pull-up plus decoupling) are mandatory for reliable start-up.
بدائل مباشرة لـ PIC18LF25J10T-I/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC18LF25J10T-I/ML (نفس عامل الشكل والبصمة) — يختلف في Package, Core Architecture, ADC, Timers, Operating Temperature.
PIC18LF25J10-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF24J10-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF24J10T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F25J10T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F24J10T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF25J10-I/SP
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF25J10T-I/ML الحدود القصوى والخصائص الكهربائية
| Core Architecture | 8-bit PIC18 enhanced RISC |
| Series | PIC18J (PIC18LF25J10 family) |
| Maximum CPU Clock | 40 MHz |
| Program Memory Type | Flash (16-bit wide words) |
| Program Memory Size | 32 KB (16K x 16) |
| RAM Size | 1 KB |
| Supply Voltage Range | 4.2 V to 5.5 V |
| I/O Pins | 34 |
| ADC | 10-bit, 10-channel |
| Communication Peripherals | I2C, SPI, UART/USART (enhanced, LIN-capable) |
| Timers | 4 (Timer0-Timer3) |
| Analog Comparators | 2 |
| العلبة | 28-QFN (6x6 mm) with exposed pad |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40 °C to +85 °C (Industrial) |
| Temperature Grade | I (Industrial) |
| Programming/Debug | ICSP and ICD via dedicated pins |
| حالة RoHS | Lead-free / RoHS Compliant |
تكوين أطراف PIC18LF25J10T-I/ML
| دبوس 1 | RA2/AN2 — Digital I/O / analog input channel 2 |
| دبوس 2 | RA3/AN3/VREF+ — Digital I/O / analog input / positive voltage reference |
| دبوس 3 | RA4/AN4 — Digital I/O / analog input channel 4 |
| دبوس 4 | RA5/AN5 — Digital I/O / analog input channel 5 |
| دبوس 5 | VDD — Positive supply voltage (2.0-3.6 V for LF variant) |
| دبوس 6 | VSS — Ground reference |
| دبوس 7 | OSC1/CLKI/RA7 — Crystal input / external clock / digital I/O |
| دبوس 8 | OSC2/CLKO/RA6 — Crystal output / clock output / digital I/O |
| دبوس 9 | RC0/T1OSO/T1CKI — Digital I/O / Timer1 oscillator output / clock input |
| دبوس 10 | RC1/T1OSI/CCP2 — Digital I/O / Timer1 oscillator input / CCP2 |
| دبوس 11 | RC2/CCP1 — Digital I/O / CCP1 PWM output |
| دبوس 12 | RC3/SCK/SCL — Digital I/O / SPI clock / I2C clock (when MSSP configured) |
| دبوس 13 | RC4/SDI/SDA — Digital I/O / SPI data in / I2C data |
| دبوس 15 | RC5/SDO — Digital I/O / SPI data out |
| دبوس 16 | RC6/TX/CK — Digital I/O / UART TX / USART clock |
| دبوس 17 | RC7/RX/DT — Digital I/O / UART RX / USART data |
| دبوس 18 | RB0/INT0/FLT0 — Digital I/O / external interrupt 0 / PWM fault input |
| دبوس 19 | RB1/INT1 — Digital I/O / external interrupt 1 |
| دبوس 20 | RB2/INT2 — Digital I/O / external interrupt 2 |
| دبوس 21 | RB3/INT3 — Digital I/O / external interrupt 3 |
| دبوس 22 | RB4/KBI0 — Digital I/O / interrupt-on-change |
| دبوس 23 | RB5/KBI1 — Digital I/O / interrupt-on-change |
| دبوس 24 | RB6/KBI2/PGC — Digital I/O / KBI / ICSP clock |
| دبوس 25 | RB7/KBI3/PGD — Digital I/O / KBI / ICSP data |
| دبوس 26 | AVDD — Analog supply voltage (tie to VDD) |
| دبوس 27 | AVSS — Analog ground |
| دبوس 28 | MCLR/RE3 — Reset input (active low) / digital I/O |
| دبوس EP | EP — Exposed thermal pad - must be soldered to ground copper pour |
التطبيقات النموذجية
PIC18LF25J10T-I/ML مناسب لـ 7 التطبيقs: Industrial Sensor Interface Hub, USB HID / Human Interface Device, Home Appliance Control Board, Automotive Body Electronics Module, Battery-Powered Metering / Data Logger, LED Lighting Controller, IoT Edge Sensor Node.
Industrial Sensor Interface Hub
The PIC18LF25J10T-I/ML is well suited for industrial sensor-interface hubs that aggregate multiple analog and digital sensors into a single communications node. Its 10-bit 10-channel ADC plus 34 I/O pins let engineers connect several 4-20 mA current loops, RTDs, and digital switches while the 40 MHz PIC18 core runs the MODBUS RTU protocol stack over the enhanced USART. The 2.0-3.6 V operation of the 'LF' variant simplifies 3.3 V battery-backed designs, and the 1 KB RAM is adequate for protocol buffers. nanoWatt Technology reduces quiescent current in sleep mode for energy-harvesting installations.
موصى به
USB HID / Human Interface Device
When paired with an external USB transceiver such as the MCP2200 or MCP2221, the PIC18LF25J10T-I/ML implements USB HID class devices like keyboards, mice, custom input panels, and game controllers. The 32 KB Flash comfortably stores HID report descriptors and custom firmware, while the 1 KB RAM handles HID buffering and debounce state. The 40 MHz core executes the HID class driver with deterministic interrupt response thanks to the PIC18 enhanced interrupt controller. The 28-QFN 6x6 footprint suits compact consumer peripherals.
موصى به
Home Appliance Control Board
The PIC18LF25J10T-I/ML powers control boards in white goods such as washing machines, dishwashers, and refrigerators where it drives motor-control PWM signals, reads temperature sensors, and manages the user-interface keypad and display. Its 4 timers generate PWM for TRIAC phase-angle control or variable-frequency drives, while the 10-bit ADC scans NTC thermistors. The 32 KB Flash holds state-machine firmware plus diagnostics, and the nanoWatt sleep modes minimize standby energy to meet Energy Star. Industrial -40 to +85 °C temperature range tolerates appliance environments.
موصى به
Automotive Body Electronics Module
Body-electronics modules such as mirror controllers, seat-position memories, and interior lighting drivers benefit from the PIC18LF25J10T-I/ML's enhanced USART with LIN-bus capability and its robust PIC18 core. The 32 KB Flash stores LIN slave protocol stacks plus application logic, and 34 I/O pins drive LED drivers and read switch inputs. Designers add external CAN transceivers for higher-layer body networks. While the I-grade part covers -40 to +85 °C ambient, automotive AEC-Q100 designs should consider the PIC18F25J10T-I/ML E-grade automotive-qualified variant instead.
موصى به
Battery-Powered Metering / Data Logger
The PIC18LF25J10T-I/ML is ideal for battery-powered utility meters and remote data loggers where its 2.0-3.6 V operation matches single-cell Li-Ion or two AA cells. nanoWatt Technology with multiple sleep modes draws microamp-level quiescent current between sensor reads, and the 32 KB Flash buffers logged measurements between wireless transmissions. The 10-bit ADC scans battery voltage, current shunt, and external sensor inputs. The QFN-28 package keeps the PCB footprint small enough for retrofitting into compact meter enclosures.
موصى به
LED Lighting Controller
Architectural and stage-lighting systems benefit from the PIC18LF25J10T-I/ML driving DMX-512 or DALI lighting protocols over the enhanced USART. The 32 KB Flash stores DMX personality libraries and fade algorithms, while the timers generate PWM for dimming. SPI peripherals drive LED driver ICs such as the TLC5940 for high-channel-count installations. Industrial temperature tolerance suits outdoor lighting enclosures with appropriate sealing.
موصى به
IoT Edge Sensor Node
IoT edge sensor nodes use the PIC18LF25J10T-I/ML as the supervisory MCU for environmental sensing, local decision-making, and wireless-module management. I2C and SPI connect to radios (LoRa, BLE, sub-GHz transceivers) and environmental sensors (temperature, humidity, accelerometer). The 32 KB Flash runs MQTT-SN or CoAP protocol stacks for low-bandwidth edge messaging. With the QFN-28 footprint, the node PCB can fit in less than 20 x 20 mm, making it ideal for space-constrained IoT deployments.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC18LF25J10T-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC18LF25J10-I/ML | PIC18LF24J10-I/ML | PIC18LF24J10T-I/ML | PIC18F25J10T-I/ML | PIC18F24J10T-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) with EP | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB | 16 KB | 16 KB | 32 KB | 16 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Supply Voltage | 2.0 - 3.6 V (LF) | 2.0 - 3.6 V (LF) | 2.0 - 3.6 V (LF) | 2.0 - 3.6 V (LF) | 4.2 - 5.5 V (F) | 4.2 - 5.5 V (F) |
| Core Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| I/O Pins | 34 | 34 | 34 | 34 | 34 | 34 |
| ADC | 10-bit / 10-ch | 10-bit / 10-ch | 10-bit / 10-ch | 10-bit / 10-ch | 10-bit / 10-ch | 10-bit / 10-ch |
| Industrial Temp Grade | -40 to +85 °C | -40 to +85 °C | -40 to +85 °C | -40 to +85 °C | -40 to +85 °C | -40 to +85 °C |
أبرز الفروقات
- Same family and package as siblings, with selectable Flash density (مقابلPIC18LF24J10T-I/ML)
- Low-voltage LF variant for 3.3 V battery systems (مقابلPIC18F25J10T-I/ML)
- 10-bit 10-channel ADC with nanoWatt Technology (مقابلPIC18LF25J10-I/ML)
ملاحظات التصميم
Place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD/AVDD pin pair, and a single 10 uF bulk ceramic on the main 3.3 V rail. For 'LF' operation below 2.7 V, ensure ripple stays below 50 mV peak to avoid core brown-outs. The exposed pad (EP) of the 28-QFN must be tied to the ground pour to provide thermal sinking and a low-impedance ground return.
Route the ICSP/ICD signals PGC (RB6) and PGD (RB7) with traces shorter than 50 mm and avoid running them parallel to switching nodes or analog sensor lines to prevent programming/debug interference. The MCLR pin requires a 10 kΩ pull-up to VDD plus a 100 nF decoupling capacitor placed close to the pin; without it, the part may randomly enter reset under EMI.
Configuration bits must be programmed correctly: disable the watchdog timer unless your firmware actively services it, and enable the Fail-Safe Clock Monitor (FSCM) for reliable start-up with a crystal. Do not exceed 4.5 mA source/sink on individual I/O pins (refer to the datasheet DC characteristics), and configure unused I/Os as outputs driving low to minimize switching noise. Pull-ups are required on SDA/SCL for I2C operation.
Keep analog traces (ANx inputs, VREF+, AVSS) physically separated from digital switching traces (PWM, oscillator, communication buses) to prevent digital noise coupling into ADC readings. Use a continuous ground pour under the analog section and stitch vias around the perimeter of the QFN package for a low-impedance ground return. The QFN exposed pad needs an array of ground vias (4-9 vias typical) to dissipate thermal energy.
معلومات الامتثال
Lead-free / RoHS compliant per Microchip product page. The '-I/' industrial temperature grade (-40 to +85 °C) is not AEC-Q100 qualified; for automotive designs choose the AEC-Q100 qualified PIC18F25J10T-I/ML E-grade automotive variant.
