PIC18LF27J13T-I/ML - 128KB Flash 8-bit MCU, 28-VQFN | Microchip
MPN: PIC18LF27J13T-I/ML ✓ نشطPIC18LF27J13T-I/ML نظرة عامة
An 8-bit microcontroller (MCU) is a programmable integrated circuit that combines a CPU, non-volatile program memory (Flash), volatile working memory (RAM), and configurable peripherals on a single die. Within the broader semiconductor taxonomy, an MCU sits inside the microcontrollers category, which itself is a sub-family of embedded processors and SoCs, ultimately classified under Integrated Circuits. Microchip's PIC18 family extends the original PIC architecture with enhanced 16-bit instructions, linear memory mapping, and C-friendly peripherals.
Key differentiating features include the XLP (eXtreme Low Power) nanoWatt technology with deep-sleep currents below 100 nA, 12 MIPS sustained throughput, 10-bit ADC (with 12-bit option on selected channels), multiple communication peripherals (UART, SPI, I2C), and CTMU for capacitive touch sensing. The 28-VQFN package with exposed pad gives a compact 6x6 mm footprint suitable for space-constrained wearable and IoT designs.
Technically, the PIC18LF27J13 uses a Harvard RISC architecture with a 16-bit instruction word and 8-bit data path, 31-level hardware stack, and an internal PLL that derives the 48 MHz system clock from a low-frequency external crystal or internal oscillator. The peripheral set includes multiple timers, capture/compare/PWM modules, comparators, and a charge time measurement unit for touch.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, low-power wireless peripherals, capacitive touch user interfaces, home automation controllers, and consumer electronics where board area is constrained. The exposed pad on the VQFN package also improves thermal dissipation for environments up to 85 C industrial operation.
When designing with this MCU, ensure the exposed thermal pad on pin 29 is soldered to a sufficient copper pour to meet the thermal resistance specification. Programming is supported by Microchip's MPLAB X IDE, XC8 compiler, and PICkit programmer ecosystem, and the deep-sleep wake sources should be planned before laying out the PCB.
This page synthesizes distributor pricing, drop-in package alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering context for sourcing and replacement decisions across the PIC18LF family.
بدائل مباشرة لـ PIC18LF27J13T-I/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC18LF27J13T-I/ML (نفس عامل الشكل والبصمة) — يختلف في ADC, Package, Timers, I/O Pins, Operating Temperature.
PIC18LF27J13-I/SS
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F27J13T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF26J13-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF26J11T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF25J10T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF27J13T-I/ML الحدود القصوى والخصائص الكهربائية
| Series | PIC® XLP™ 18J |
| Core | PIC18 8-bit RISC |
| Core Size | 8-bit |
| Program Memory | 128 KB Flash (64K x 16) |
| RAM | 4 KB |
| CPU Speed | 48 MHz (12 MIPS) |
| جهد التغذية | 2.0 V to 3.6 V |
| درجة حرارة التشغيل | -40C to +85C (industrial) |
| العلبة | 28-VQFN (ML) 6x6 mm with exposed pad |
| عدد الأطراف | 28 |
| نوع التركيب | Surface Mount |
| ADC | 10/12-bit, up to 10 channels |
| Communication | UART, SPI, I2C |
| Low-Power Feature | XLP nanoWatt with deep-sleep |
| مستوى MSL | 1 (unlimited) |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
| Peripherals | Timers, CCP, CTMU, comparators |
تكوين أطراف PIC18LF27J13T-I/ML
| دبوس 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| دبوس 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| دبوس 3 | RA2/AN2 — Digital I/O / Analog input channel 2 |
| دبوس 4 | RA3/AN3/VREF+ — Digital I/O / Analog input 3 / ADC reference positive |
| دبوس 5 | RA4/AN4 — Digital I/O / Analog input channel 4 |
| دبوس 6 | RA5/AN5 — Digital I/O / Analog input channel 5 |
| دبوس 7 | RA6/OSC2 — Digital I/O / Oscillator output |
| دبوس 8 | RA7/OSC1 — Digital I/O / Oscillator input |
| دبوس 9 | VDD — Positive supply voltage |
| دبوس 10 | VSS — Ground reference |
| دبوس 11 | RB0/INT0 — Digital I/O / External interrupt 0 |
| دبوس 12 | RB1/INT1 — Digital I/O / External interrupt 1 |
| دبوس 13 | RB2/INT2 — Digital I/O / External interrupt 2 |
| دبوس 14 | RB3/INT3 — Digital I/O / External interrupt 3 |
| دبوس 15 | RB4 — Digital I/O |
| دبوس 16 | RB5 — Digital I/O |
| دبوس 17 | RB6/PGC — Digital I/O / ICSP clock |
| دبوس 18 | RB7/PGD — Digital I/O / ICSP data |
| دبوس 19 | RC0 — Digital I/O |
| دبوس 20 | RC1 — Digital I/O |
| دبوس 21 | RC2 — Digital I/O |
| دبوس 22 | RC3 — Digital I/O |
| دبوس 24 | RC4 — Digital I/O |
| دبوس 25 | RC5 — Digital I/O |
| دبوس 26 | RC6 — Digital I/O / UART TX |
| دبوس 27 | RC7 — Digital I/O / UART RX |
| دبوس 28 | VDD — Positive supply voltage (second pin) |
| دبوس 29 | EP — Exposed thermal pad - connect to ground |
التطبيقات النموذجية
PIC18LF27J13T-I/ML مناسب لـ 6 التطبيقs: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Capacitive Touch User Interfaces, Home Automation Controllers, Consumer Electronics with Compact Footprint, Industrial Sensor Hubs.
Battery-Powered IoT Sensor Nodes
The PIC18LF27J13T-I/ML suits battery-powered IoT sensor nodes thanks to its XLP nanoWatt technology with deep-sleep currents below 100 nA and 2.0-3.6V operation. Its 128 KB Flash stores wireless-stack and sensor-processing firmware, while 4 KB RAM buffers sample data between RF transmissions. The 28-VQFN 6x6 mm footprint extends battery life targets by allowing dense PCB layouts with the exposed pad improving thermal dissipation under enclosed sensor housings.
موصى به
Wearable Health Monitors
The PIC18LF27J13T-I/ML fits wearable health monitors where its deep-sleep current extends coin-cell battery life, while the 12-bit ADC captures pulse, SpO2, and temperature sensor signals with sufficient resolution. The 28-VQFN 6x6 mm exposed-pad package allows compact wrist-band designs and provides thermal grounding for continuous skin contact. UART/SPI/I2C peripherals connect to BLE modules and biometric sensors without requiring external glue logic.
موصى به
Capacitive Touch User Interfaces
The PIC18LF27J13T-I/ML drives capacitive touch interfaces via its CTMU peripheral which measures capacitance with sub-pF resolution, replacing mechanical buttons in appliance and consumer control panels. Its 48 MHz CPU sustains real-time touch scanning across 10+ channels with 12 MIPS headroom. The 28-VQFN package supports slimmer industrial front-panel designs while the XLP deep-sleep mode keeps standby power under 100 nA when the panel is idle.
موصى به
Home Automation Controllers
The PIC18LF27J13T-I/ML controls home automation hubs coordinating ZigBee/BLE peripherals, dimmer outputs, and sensor inputs at 12 MIPS. Its 128 KB Flash accommodates OTA bootloader plus application firmware, while 4 KB RAM handles MAC-layer buffering. The 2.0-3.6V supply simplifies direct battery or USB-bus powering, and the 28-VQFN footprint fits behind wall-switch faceplates where PCB area is severely constrained.
موصى به
Consumer Electronics with Compact Footprint
The PIC18LF27J13T-I/ML powers compact consumer products such as remote controls, gaming peripherals, and e-reader accessories where its 28-VQFN 6x6 mm footprint enables thin designs without sacrificing Flash headroom. The 48 MHz CPU delivers responsive user-interface updates and the XLP deep-sleep mode extends AAA-battery life across standby years. CTMU, ADC, and PWM peripherals cover RGB LED, motor, and audio-signal-chain tasks in a single chip.
موصى به
Industrial Sensor Hubs
The PIC18LF27J13T-I/ML aggregates multiple industrial sensors via I2C/SPI buses and forwards data over UART or CAN bridges to factory networks. Its 12-bit ADC reads 4-20 mA analog loops with calibration storage in 128 KB Flash. The 28-VQFN exposed pad and -40 to +85C industrial rating survive harsh control-panel environments, and deep-sleep mode reduces idle power between scan cycles in duty-cycled monitoring systems.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC18LF27J13T-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC18LF27J13-I/SS | PIC18F27J13T-I/ML | PIC18LF26J13-I/ML | PIC18LF26J11T-I/ML | PIC18LF25J10T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN (ML) 6x6 mm | 28-SSOP (functional same-die) | 28-VQFN (ML) - same | 28-VQFN (ML) - same | 28-VQFN (ML) - same | 28-VQFN (ML) - same |
| Flash Memory | 128 KB | 128 KB | 128 KB | 64 KB (-50%) | 64 KB (-50%) | 32 KB (-75%) |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 3.8 KB | 2 KB |
| CPU Speed | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 48 MHz / 12 MIPS | 40 MHz / 10 MIPS |
| Supply Voltage | 2.0V - 3.6V | 2.0V - 3.6V | 2.0V - 3.6V (F variant) | 2.0V - 3.6V | 2.0V - 3.6V | 2.0V - 3.6V |
| ADC | 10/12-bit | 10/12-bit | 10/12-bit | 10/12-bit | 10-bit | 10-bit |
| XLP Deep-Sleep | Yes (sub-100 nA) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- Largest 128 KB Flash in PIC18 J-series 28-pin family (مقابلPIC18LF26J13-I/ML)
- Deep-sleep sub-100 nA nanoWatt XLP technology (مقابلPIC18LF25K80T-I/MM)
- 48 MHz / 12 MIPS headroom with on-chip CTMU touch sensing (مقابلPIC18LF2523-I/ML)
ملاحظات التصميم
The 28-VQFN (ML) 6x6 mm package exposes a thermal pad on pin 29 that must be soldered to a continuous ground copper pour with at least 8 thermal vias to inner ground planes. According to Microchip VQFN-28 land-pattern guidance, vias should be 0.3 mm diameter on 1.0-1.2 mm pitch to provide both electrical grounding and thermal dissipation. Estimated: with a 1 square inch copper pour, theta-JA drops from approximately 40 C/W to 25 C/W, extending the industrial temperature margin.
Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of each VDD pin (pins 9 and 28), plus a bulk 4.7 uF tantalum or ceramic at the MCU entry point. The PIC18LF27J13 requires VDD rise time under 0.1V/ms per datasheet to ensure proper Power-on Reset. For deep-sleep wake, configure the RTCC, INT, or WDT source before entering sleep to avoid lock-ups.
Do not confuse the LF (low-voltage 2.0-3.6V) and F (3.6V max but tolerant of 3.3V typical) variants: both run from 2.0-3.6V supply, but the LF variant supports a deeper nanoWatt sleep mode. Programming via ICSP uses PGC1/RB6 and PGD1/RB7; ensure these pins are not strapped to ground or VDD via strong pull resistors during reset. According to Microchip errata, configuring the on-chip voltage regulator with insufficient bypass capacitance can cause PLL lock failures.
Route the 48 MHz system clock traces as short as possible and keep OSC1/OSC2 away from switching I/O. For ADC accuracy above 10 bits, use a separate AVSS/AVDD pair with its own ferrite bead; route analog traces away from digital traces with at least 3x trace-width separation. Estimated: at 12-bit ADC operation, expect 1 LSB degradation per 50 mV VDD ripple - a clean 3.3V LDO is recommended over switching regulators when ADC performance matters.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. Industrial temperature -40C to +85C only; NOT AEC-Q100 qualified - for automotive applications migrate to PIC18F27J13 family automotive grades or PIC18F K-series AEC-Q100 parts. Halogen-free per Microchip environmental certification.
