PIC18LF47J13T-I/ML - 128KB Flash 8-bit XLP MCU 44-QFN | Microchip
MPN: PIC18LF47J13T-I/ML ✓ نشطPIC18LF47J13T-I/ML نظرة عامة
An 8-bit microcontroller (MCU) is a small programmable processor that integrates CPU, Flash, RAM, and peripherals on a single silicon die; the PIC18 family is Microchip's high-performance 8-bit architecture using a 16-bit instruction word with RISC-style pipelining, sitting in the hierarchy MCU -> microcontroller -> embedded processor -> semiconductor. The LF prefix denotes the wide-voltage 2.0V-3.6V variant optimized for battery-powered XLP designs.
Key features include 128 KB Flash (64K x 16), 4 KB RAM, 12-bit ADC with multiple channels, deep sleep current under 100 nA typical, internal oscillator, nanoWatt XLP technology, and integrated peripherals including comparators, PWM, I2C/SPI/UART, and CTMU for touch applications. The 34 I/O count enables rich peripheral integration in space-constrained designs.
Architecturally the device uses a 16-bit modified Harvard bus with a C compiler-friendly instruction set, deep sleep and ultra-low-power Run modes, hardware RTCC, and on-chip voltage regulator operating from 2.0V-3.6V, supporting either USB 2.0 full-speed via the internal transceiver or low-energy Bluetooth stacks. The 8x8 mm QFN package provides thermal dissipation for higher-speed operation.
Typical applications include low-power wireless sensor nodes, USB peripherals, consumer electronics, battery-powered medical devices, industrial control panels, and IoT edge nodes where deep sleep current directly determines battery life.
When designing with this part, plan pin allocation to share the 44-pin QFN between the USB D+/D- pair, the ICSP programming pins (PGED/PGEC), and your application I/O; an external 8 MHz crystal plus PLL can drive the 48 MHz system clock, or the internal 31 kHz-8 MHz RC oscillator can eliminate external clock hardware.
بدائل مباشرة لـ PIC18LF47J13T-I/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC18LF47J13T-I/ML (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Operating Temperature, I/O Pins, Core.
PIC18LF47J13-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
PIC18F47J13-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F47J53-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F46J50-I/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC18LF46J13-I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F4553-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18LF47J13T-I/ML الحدود القصوى والخصائص الكهربائية
| Family | PIC18 XLP 18J |
| Core | 8-bit PIC |
| Program Memory | 128 KB Flash (64K x 16) |
| RAM Size | 4 KB (3.8K x 8) |
| Maximum CPU Speed | 48 MHz (12 MIPS) |
| جهد التغذية | 2.0 V to 3.6 V |
| I/O Pins | 34 |
| ADC | 12-bit, multi-channel |
| العلبة | 44-pin VQFN (8x8 mm) exposed pad |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +85C (Industrial) |
| Oscillator | Internal + external crystal support |
| USB | USB 2.0 Full-Speed (on select variants) |
| حالة RoHS | Compliant |
| مستوى MSL | 3 (168 hours) |
دليل تكوين أطراف PIC18LF47J13T-I/ML 44-pin vqfn (8x8 mm) exposed pad
تكوين الأطراف لـ PIC18LF47J13T-I/ML (حزمة 44-pin vqfn (8x8 mm) exposed pad). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ PIC18LF47J13T-I/ML.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
PIC18LF47J13T-I/ML مناسب لـ 6 التطبيقs: Battery-Powered Wireless Sensor Node, USB HID Peripheral Device, Industrial Control Panel HMI, Portable Medical Monitoring Device, Consumer Electronics Remote Control, IoT Edge Sensor with BLE Connectivity.
Battery-Powered Wireless Sensor Node
The PIC18LF47J13T-I/ML fits battery-powered wireless sensor nodes through its nanoWatt XLP technology with deep-sleep current under 100 nA typical and 128 KB Flash capable of holding Zigbee, BLE stack, or proprietary RF protocol firmware. Its 2.0V-3.6V supply range supports direct connection to single-cell Li-ion (3.0V nominal) or two AA cells without external regulation. The 12-bit ADC with multiple channels directly interfaces temperature, humidity, and battery-voltage sensors, while 34 I/O pins connect to user buttons, LEDs, and an SPI-connected radio module. Compared to higher-power MCUs, this part extends coin-cell battery life from months to years in duty-cycled sensor applications.
موصى به
USB HID Peripheral Device
The PIC18LF47J13T-I/ML is well-suited to USB Human Interface Device applications such as keyboards, mice, game controllers, and custom HID peripherals through its integrated USB 2.0 Full-Speed peripheral with on-chip transceiver. The 128 KB Flash comfortably stores USB HID class drivers plus application firmware, and the 48 MHz core delivers 12 MIPS to handle USB polling at 1 kHz without CPU saturation. Designers connect D+/D- directly to the USB connector with a 1.5 kohm pull-up on D+ for full-speed device enumeration. The exposed thermal pad on the 44-QFN package dissipates heat during sustained USB traffic and bus-powered operation.
موصى به
Industrial Control Panel HMI
The PIC18LF47J13T-I/ML supports industrial HMI panels with -40C to +85C industrial temperature range, 128 KB Flash for menu structures and I/O handling code, and 34 I/O to drive character LCDs, scan keypads, and interface opto-isolated inputs. The wide 2.0V-3.6V supply tolerates industrial 24V bus systems regulated down via a simple buck converter. The 12-bit ADC handles analog sensor inputs such as 4-20 mA current loop receivers and thermistor networks. Compared to smaller Flash MCUs, the J13 reserves code space for IEC 61131-3 style ladder logic interpreters or Modbus RTU protocol stacks.
موصى به
Portable Medical Monitoring Device
The PIC18LF47J13T-I/ML suits portable medical devices such as pulse oximeters, blood pressure monitors, and continuous glucose monitors through its XLP deep-sleep modes that extend battery life to multi-year operation on a single coin cell. The 12-bit ADC with multiple channels samples photodiode signals (pulse oximetry) or impedance measurements accurately, while 128 KB Flash stores FDA-traceable firmware plus wireless protocol stacks for transmitting vitals to a paired phone. The 2.0V-3.6V supply accepts single Li-ion or 3V coin cells without external regulation. Compared to higher-performance ARM Cortex MCUs, the PIC18LF47J13 provides simpler IEC 62304 software classification pathways.
موصى به
Consumer Electronics Remote Control
The PIC18LF47J13T-I/ML is ideal for advanced consumer remote controls with voice activation, IR/RF transmission, and OLED display drivers through its 128 KB Flash accommodating voice recognition libraries and protocol stacks for IR (RC5/RC6/SIRC) or 2.4 GHz RF transmission. The deep-sleep current under 100 nA typical preserves battery life when the remote sits idle, waking only on button press or motion interrupt. The 12-bit ADC reads battery voltage and ambient light sensors for adaptive backlight control, while 34 I/O drives a 7-row by 8-column keypad matrix and OLED display SPI interface. Compared to 32-bit MCUs, the J13 offers lower BOM cost in this cost-sensitive consumer category.
موصى به
IoT Edge Sensor with BLE Connectivity
The PIC18LF47J13T-I/ML fits IoT edge sensor designs with external BLE modules through its 128 KB Flash storing sensor fusion algorithms, BLE command parsers, and OTA bootloader code. The 48 MHz core executes sensor sampling and BLE event handling without bottlenecks, and the 4 KB RAM accommodates small data buffers for environmental, motion, or proximity sensor data streams. The 2.0V-3.6V supply supports direct Li-ion or regulated 3.3V USB power, while the 12-bit ADC handles analog front-end signals from gas sensors, thermistors, or strain gauges. Compared to integrated BLE SoCs, this approach allows module swap flexibility across BLE, LoRa, or sub-GHz protocols.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC18LF47J13T-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC18LF47J13-I/ML | PIC18F47J13-I/ML | PIC18F47J53-I/ML | PIC18F46J50-I/ML | PIC18LF46J13-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin VQFN (8x8 mm) | 44-pin VQFN (8x8 mm) - same | 44-pin VQFN (8x8 mm) - same | 44-pin VQFN (8x8 mm) - same | 44-pin VQFN (8x8 mm) - same | 44-pin VQFN (8x8 mm) - same |
| Program Flash | 128 KB | 128 KB | 128 KB | 64 KB | 64 KB | 64 KB |
| RAM | 4 KB | 4 KB | 4 KB | 3.8 KB | 3.9 KB | 3.8 KB |
| Supply Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V (3.0V min for some features) | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| XLP / Deep Sleep | Yes (nanoWatt XLP) | Yes (nanoWatt XLP) | Yes (nanoWatt) | Yes (nanoWatt) | Yes (nanoWatt) | Yes (nanoWatt XLP) |
| USB | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 OTG (Host + Device) | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device |
| Pin Count / I/O | 44-pin / 34 I/O | 44-pin / 34 I/O | 44-pin / 34 I/O | 44-pin / 34 I/O | 44-pin / 34 I/O | 44-pin / 34 I/O |
أبرز الفروقات
- Largest Flash in the 44-QFN LF XLP family (مقابلPIC18LF46J13-I/ML)
- Integrated USB 2.0 Full-Speed with on-chip transceiver (مقابلPIC18F4553-I/ML)
- LF low-voltage process for true XLP operation (مقابلPIC18F47J13-I/ML)
ملاحظات التصميم
Estimated: At VDD = 3.3V, 48 MHz active, the PIC18LF47J13T-I/ML draws approximately 15-20 mA active current. For battery operation, switching the CPU to deep sleep between samples reduces current below 100 nA typical. Use the internal 31 kHz RTCC for sleep-mode timing, waking the CPU only on RTCC rollover or external interrupt to achieve multi-year battery life on a 220 mAh coin cell.
The 44-pin QFN package has an exposed thermal pad on the bottom that MUST be soldered to a continuous ground pour on the PCB for both thermal dissipation and electrical reference. Place four or more thermal vias in the exposed pad land pattern connecting top copper to internal ground planes. The QFN ground pad is pin 45 (the die substrate), so a missing solder connection here causes erratic ADC readings and USB communication failures.
The PIC18LF47J13T-I/ML requires a 10 uF bulk capacitor plus a 0.1 uF ceramic decoupling capacitor placed within 5 mm of the VDD pin. The PGED1/PGEC1 pins are shared with general I/O and must be accessible for ICSP programming - do not place them on nets that conflict with debugging access. The USB D+/D- traces must be 90 ohm differential and length-matched within 2 mm; otherwise enumeration failures occur at full-speed USB. The configuration words must be programmed correctly or the part will operate in an unexpected oscillator mode.
Estimated: The 44-pin VQFN (8x8 mm) package has theta_JA of approximately 30 C/W with a properly soldered ground pad and 1 oz copper. At 3.3V x 20 mA active, dissipation is 66 mW, resulting in a 2 C junction temperature rise - well within the 125 C maximum. In industrial -40C to +85C environments, ensure the PCB ground pour provides adequate heat spreading for sustained USB or RF transmission bursts that draw higher transient currents.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page; lead-free packaging confirmed. Not AEC-Q100 qualified - this part targets consumer, industrial, and IoT applications rather than automotive. Halogen-free status not explicitly stated in verified data.
