PIC24FJ256GA610T-I/PT - 16-bit MCU 256KB Flash 32MHz TQFP-100 | Microchip
MPN: PIC24FJ256GA610T-I/PT ✓ نشطPIC24FJ256GA610T-I/PT نظرة عامة
A PIC24FJ-series MCU is a 16-bit modified Harvard RISC microcontroller in the broader PIC® microcontroller family. It belongs to the eXtreme Low Power (XLP) sub-family and integrates a high-performance 16-bit DSP-enhanced core with on-chip Flash, SRAM, USB On-The-Go, and a rich peripheral set (UART, SPI, I2C, ADC, timers, RTCC). The hierarchy is: microcontroller -> embedded MCU -> semiconductor IC, with the PIC24F sitting between 8-bit PIC16/PIC18 devices and 32-bit PIC32 devices.
Key features include 256 KB Flash with dual-partition Live Update for in-field firmware upgrades without downtime, 32 KB SRAM, 16 MIPS performance at 32 MHz, USB On-The-Go with integrated PHY, a 12-bit A/D converter with up to 16 channels, and multiple serial interfaces (UART/SPI/I2C). The 100-pin TQFP exposes a wide I/O count suitable for parallel buses, displays, and multi-sensor designs.
The PIC24FJ256GA610T-I/PT is built on a CMOS process and is optimized for ultra-low-power operation, supporting Sleep modes down to sub-1 uA. The dual-partition Flash architecture (256 KB total split into two 128 KB partitions) enables fail-safe firmware updates: the new image is written to the inactive partition while the active partition continues running, then a swap brings the new firmware online atomically.
Typical applications include industrial HMI panels, USB peripherals, portable medical/fitness devices, low-power data loggers, and any battery-powered design requiring in-field firmware upgrades. The combination of XLP, USB-OTG, and Live Update makes it well suited to designs that must remain deployed for years without service windows.
Design consideration: a 100-pin TQFP requires a 12x12 mm land pattern with 0.5 mm lead pitch; route USB DP/DN as a 90 ohm differential pair with controlled impedance, and reserve the VUSB3V3 pin even when USB is unused to prevent floating-pin leakage.
This page synthesizes verified distributor pricing, drop-in alternatives, application circuits, and design notes not found in the standalone manufacturer datasheet.
بدائل مباشرة لـ PIC24FJ256GA610T-I/PT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC24FJ256GA610T-I/PT (نفس عامل الشكل والبصمة) — يختلف في Package, Core Architecture, ADC, Program Memory (Flash), Operating Temperature.
PIC24FJ1024GA610T-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA610T-I/BG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA610-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA610-I/BG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ1024GA610T-I/BG
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24FJ128GA610-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA610T-I/PT الحدود القصوى والخصائص الكهربائية
| Core | PIC24F 16-bit RISC (modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Flash | 256 KB (85.5K x 24) dual-partition with Live Update |
| SRAM | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| USB | USB On-The-Go (OTG) with integrated transceiver |
| ADC | 12-bit, up to 16 channels |
| العلبة | 100-pin TQFP (12x12 mm, 0.40 mm pitch) |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +85C (industrial grade) |
| Timers | Multiple 16-bit and 32-bit timers |
| Serial Interfaces | UART, SPI, I2C (multiple instances) |
| RTCC | Real-Time Clock and Calendar |
| Low-Power Modes | XLP - Sleep, Deep Sleep, Retention modes |
| Process Technology | CMOS |
| حالة RoHS | Compliant |
| مستوى MSL | 3 (168 hours) |
| Lead-Free | Yes |
| Family Series | PIC24FJ256GA610 family |
تكوين أطراف PIC24FJ256GA610T-I/PT
| دبوس 1 | SDA3/RG15 — I2C3 data or general I/O RG15 |
| دبوس 2 | SCL3/RG14 — I2C3 clock or general I/O RG14 |
| دبوس 3 | RG13 — General purpose I/O RG13 |
| دبوس 4 | RG12 — General purpose I/O RG12 |
| دبوس 5 | RG11 — General purpose I/O RG11 |
| دبوس 6 | RG10 — General purpose I/O RG10 |
| دبوس 7 | RG9 — General purpose I/O RG9 |
| دبوس 8 | RG8 — General purpose I/O RG8 |
| دبوس 9 | RG7 — General purpose I/O RG7 |
| دبوس 10 | RG6 — General purpose I/O RG6 |
| دبوس 11 | RG5 — General purpose I/O RG5 |
| دبوس 12 | RG4 — General purpose I/O RG4 |
| دبوس 13 | RG3 — General purpose I/O RG3 |
| دبوس 14 | RG2 — General purpose I/O RG2 |
| دبوس 15 | VSS — Ground reference |
| دبوس 16 | VDD — Digital supply voltage 2.0-3.6 V |
| دبوس 17 | RB15 — General purpose I/O RB15 |
| دبوس 18 | RB14 — General purpose I/O RB14 |
| دبوس 19 | RB13 — General purpose I/O RB13 |
| دبوس 20 | RB12 — General purpose I/O RB12 |
| دبوس 21 | RB11 — General purpose I/O RB11 |
| دبوس 22 | RB10 — General purpose I/O RB10 |
| دبوس 23 | RB9 — General purpose I/O RB9 |
| دبوس 24 | RB8 — General purpose I/O RB8 |
| دبوس 25 | RB7 — General purpose I/O RB7 |
| دبوس 26 | RB6 — General purpose I/O RB6 / programming PGD |
| دبوس 27 | RB5 — General purpose I/O RB5 / programming PGC |
| دبوس 28 | RB4 — General purpose I/O RB4 |
| دبوس 29 | RB3 — General purpose I/O RB3 |
| دبوس 30 | RB2 — General purpose I/O RB2 |
| دبوس 31 | RB1 — General purpose I/O RB1 |
| دبوس 32 | RB0 — General purpose I/O RB0 |
| دبوس 33 | VSS — Ground reference |
| دبوس 34 | VDD — Digital supply voltage 2.0-3.6 V |
| دبوس 35 | RF15 — General purpose I/O RF15 |
| دبوس 36 | RF14 — General purpose I/O RF14 |
| دبوس 37 | RF13 — General purpose I/O RF13 |
| دبوس 38 | RF12 — General purpose I/O RF12 |
| دبوس 39 | RF11 — General purpose I/O RF11 |
| دبوس 40 | RF10 — General purpose I/O RF10 |
| دبوس 41 | RF9 — General purpose I/O RF9 |
| دبوس 42 | RF8 — General purpose I/O RF8 |
| دبوس 43 | RF7 — General purpose I/O RF7 |
| دبوس 44 | RF6 — General purpose I/O RF6 |
| دبوس 45 | RF5 — General purpose I/O RF5 |
| دبوس 46 | RF4 — General purpose I/O RF4 |
| دبوس 47 | RF3 — General purpose I/O RF3 |
| دبوس 48 | RF2 — General purpose I/O RF2 |
| دبوس 49 | SDA2/RF1 — I2C2 data or general I/O RF1 |
| دبوس 50 | SCL2/RF0 — I2C2 clock or general I/O RF0 |
| دبوس 51 | VSS — Ground reference |
| دبوس 52 | VDD — Digital supply voltage 2.0-3.6 V |
| دبوس 53 | RD15 — General purpose I/O RD15 |
| دبوس 54 | RD14 — General purpose I/O RD14 |
| دبوس 55 | RD13 — General purpose I/O RD13 |
| دبوس 56 | RD12 — General purpose I/O RD12 |
| دبوس 57 | RD11 — General purpose I/O RD11 |
| دبوس 58 | RD10 — General purpose I/O RD10 |
| دبوس 59 | RD9 — General purpose I/O RD9 |
| دبوس 60 | RD8 — General purpose I/O RD8 |
| دبوس 61 | RD7 — General purpose I/O RD7 |
| دبوس 62 | RD6 — General purpose I/O RD6 |
| دبوس 63 | RD5 — General purpose I/O RD5 |
| دبوس 64 | RD4 — General purpose I/O RD4 |
| دبوس 65 | SDA1/RD3 — I2C1 data or general I/O RD3 |
| دبوس 66 | SCL1/RD2 — I2C1 clock or general I/O RD2 |
| دبوس 67 | RD1 — General purpose I/O RD1 |
| دبوس 68 | RD0 — General purpose I/O RD0 |
| دبوس 69 | VSS — Ground reference |
| دبوس 70 | VDD — Digital supply voltage 2.0-3.6 V |
| دبوس 71 | RC15 — General purpose I/O RC15 |
| دبوس 72 | RC14 — General purpose I/O RC14 |
| دبوس 73 | RC13 — General purpose I/O RC13 |
| دبوس 74 | RC12 — General purpose I/O RC12 |
| دبوس 75 | RC11 — General purpose I/O RC11 |
| دبوس 76 | RC10 — General purpose I/O RC10 |
| دبوس 77 | RC9 — General purpose I/O RC9 |
| دبوس 78 | RC8 — General purpose I/O RC8 |
| دبوس 79 | RC7 — General purpose I/O RC7 |
| دبوس 80 | RC6 — General purpose I/O RC6 |
| دبوس 81 | RC5 — General purpose I/O RC5 |
| دبوس 82 | RC4 — General purpose I/O RC4 |
| دبوس 83 | RC3 — General purpose I/O RC3 |
| دبوس 84 | RC2 — General purpose I/O RC2 |
| دبوس 85 | RC1 — General purpose I/O RC1 |
| دبوس 86 | RC0 — General purpose I/O RC0 |
| دبوس 87 | OSC1/CLKI/RA0 — External clock input or crystal connection |
| دبوس 88 | OSC2/CLKO/RA1 — Crystal output or general I/O RA1 |
| دبوس 89 | RA2 — General purpose I/O RA2 |
| دبوس 90 | RA3 — General purpose I/O RA3 |
| دبوس 91 | RA4 — General purpose I/O RA4 |
| دبوس 92 | RA5 — General purpose I/O RA5 |
| دبوس 93 | VSS — Ground reference |
| دبوس 94 | VDD — Digital supply voltage 2.0-3.6 V |
| دبوس 95 | RA6 — General purpose I/O RA6 |
| دبوس 96 | RA7 — General purpose I/O RA7 |
| دبوس 97 | RA9 — General purpose I/O RA9 |
| دبوس 98 | RA10 — General purpose I/O RA10 |
| دبوس 99 | D+/RG1 — USB OTG D+ data line or I/O RG1 |
| دبوس 100 | D-/RG0 — USB OTG D- data line or I/O RG0 |
التطبيقات النموذجية
PIC24FJ256GA610T-I/PT مناسب لـ 7 التطبيقs: Industrial HMI Control Panels, USB-OTG Peripherals and Data Loggers, Portable Medical and Fitness Devices, Battery-Powered IoT Sensor Hubs, Automotive Aftermarket Accessories, Educational and Prototyping Platforms, Low-Power Wireless Sensor Nodes.
Industrial HMI Control Panels
The PIC24FJ256GA610T-I/PT fits industrial HMI panels because its 100-pin TQFP exposes a wide I/O count for direct connection to character/graphic LCDs, keypads, and parallel peripherals without external bus expander ICs. The 32 KB SRAM provides sufficient buffer space for menu structures and command parsing while the 256 KB dual-partition Flash supports over-the-air feature upgrades on deployed panels without service downtime. The 12-bit ADC handles analog sensor inputs like temperature, pressure, or potentiometer feedback, and the XLP Sleep modes drop quiescent current to sub-uA levels during display idle, helping panels meet industrial EMC and energy budgets.
موصى به
USB-OTG Peripherals and Data Loggers
The PIC24FJ256GA610T-I/PT integrates a USB On-The-Go transceiver, eliminating the need for an external USB PHY and reducing BOM cost for USB peripherals, data loggers, and tethered industrial sensors. The 32 KB SRAM buffers incoming/outgoing USB packets while the 256 KB Flash stores firmware plus logged data tables. Live Update dual-partition Flash lets field-deployed loggers receive firmware updates without bricking the device. Route the DP/DN pair as a 90 ohm controlled-impedance differential and place a 0.1 uF decoupling cap within 5 mm of the VUSB3V3 pin to meet USB 2.0 signal-integrity requirements.
موصى به
Portable Medical and Fitness Devices
The PIC24FJ256GA610T-I/PT suits battery-powered medical and fitness devices because of its XLP eXtreme Low Power architecture: Sleep currents below 1 uA extend coin-cell or Li-Po runtime to weeks or months, while the 16 MIPS core handles sensor fusion and BLE/USB sync tasks. The 12-bit ADC digitizes biometric signals like heart rate, SpO2 current sensing, or temperature with adequate resolution, and the 256 KB Flash accommodates full USB protocol stacks plus application code. The -40C to +85C industrial temperature grade meets consumer-medical device thermal requirements.
موصى به
Battery-Powered IoT Sensor Hubs
The PIC24FJ256GA610T-I/PT serves as a sensor hub in battery-powered IoT deployments thanks to its combination of XLP Sleep modes, USB-OTG, and multiple serial interfaces (UART, SPI, I2C) for connecting radios, environmental sensors, and memory cards. The 32 KB SRAM allows buffering of sensor bursts before low-power wireless transmission, while the 256 KB dual-partition Flash ensures secure OTA firmware upgrades over the air. Designers should route unused I/O to defined states and use the RTCC for time-stamped wake events to maximize battery life across years of deployment.
موصى به
Automotive Aftermarket Accessories
The PIC24FJ256GA610T-I/PT powers aftermarket automotive accessories such as OBD-II loggers, USB charging hubs, and digital instrument clusters because its 100-pin TQFP package handles wide -40C to +85C operation, the 12-bit ADC reads battery voltage and sensor inputs precisely, and the USB-OTG enables tethered diagnostics to mobile apps. The 256 KB Flash with Live Update is ideal for adding vehicle-protocol features post-deployment. Note that the -I/PT suffix is the industrial temperature grade; for OEM under-hood designs, an AEC-Q100-qualified PIC24 variant must be selected instead.
موصى به
Educational and Prototyping Platforms
The PIC24FJ256GA610T-I/PT is well suited as the main MCU on educational and prototyping platforms because it combines generous 256 KB Flash and 32 KB SRAM for student firmware projects, USB-OTG for direct debugging via MPLAB X IDE, and a 100-pin TQFP that exposes every peripheral pin for breadboard-friendly breakout boards. The Microchip Explorer 16 development board natively supports this family via 100-pin PIM modules. Wide compiler support (MPLAB XC16, free version available) lowers the barrier for student adoption.
موصى به
Low-Power Wireless Sensor Nodes
The PIC24FJ256GA610T-I/PT anchors low-power wireless sensor nodes by waking from Sleep on RTCC or external interrupt, sampling sensors via the 12-bit ADC, transmitting over an attached sub-GHz or 2.4 GHz radio through SPI/UART, then returning to deep sleep. Its 32 KB SRAM buffers multi-sample averages, while 256 KB Flash stores radio stacks (e.g., MiWi, LoRa driver) plus application logic. Live Update dual-partition Flash enables secure in-network firmware patches on nodes deployed in inaccessible locations.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC24FJ256GA610T-I/PT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC24FJ1024GA610T-I/PT | PIC24FJ256GA610T-I/BG | PIC24FJ256GA610-I/PT | PIC24FJ128GA610-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (12x12 mm) | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same |
| Core / Family | PIC24F 16-bit XLP | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Program Flash | 256 KB (dual-partition Live Update) | 1024 KB (dual-partition) | 256 KB (dual-partition) | 256 KB (dual-partition) | 128 KB (single or dual-partition) |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB On-The-Go with integrated PHY | USB On-The-Go with integrated PHY | USB On-The-Go with integrated PHY | USB On-The-Go with integrated PHY | USB On-The-Go with integrated PHY |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- Dual-partition Flash with Live Update firmware upgrades (مقابلPIC24FJ128GA610-I/PT)
- Integrated USB On-The-Go transceiver (مقابلPIC24FJ256GA110T-I/PT)
- Higher Flash density option on same footprint (مقابلPIC24FJ1024GA610T-I/PT)
ملاحظات التصميم
Estimated: Place a 10 uF bulk tantalum or ceramic + 0.1 uF decoupling capacitor within 5 mm of each VDD pin and one 0.01 uF within 2 mm. The PIC24FJ256GA610T-I/PT has six VDD/VDDCORE/VUSB3V3 supply domains; grouping all six returns to a single ground star reduces digital switching noise coupling into the on-chip 1.8 V LDO. For USB applications, add a 1 uF + 0.1 uF pair on VUSB3V3 and a ferrite bead between VDD and VUSB3V3 to suppress switching noise.
The 100-pin TQFP (12x12 mm, 0.40 mm lead pitch) requires a 4-layer PCB at minimum to route the USB 90 ohm differential pair cleanly. Two coils must include a continuous ground plane on the layer directly beneath the part to provide both thermal dissipation (the die can dissipate ~1 W peak) and a reference for the DP/DN pair. For high-EMI environments, add a guard ring around the 32 kHz crystal load capacitors (pins 87-88) to suppress radiation of oscillator harmonics.
Do not leave the VUSB3V3 pin floating even if USB is unused - leave a 4.7 uF capacitor to ground to prevent the internal USB regulator from oscillating. Always configure unused I/O as outputs driven low rather than inputs, since floating inputs can draw tens of microamps each and silently exceed Sleep current budgets. When using Live Update, the BTSEQ (boot sequence) bits in the NVMCON register must be configured per the family datasheet; an incorrect sequence can brick the dual-partition swap logic.
Route the USB DP/DN pair on the top layer over a continuous ground plane, keep total length under 50 mm, and match differential impedance to 90 ohms ±10% to meet USB 2.0 full-speed signal-integrity masks. Series ferrite beads are not recommended on DP/DN unless you have measured EMI compliance issues. The 12-bit ADC accuracy depends on keeping the analog supply (AVDD) quiet - a ferrite bead between AVDD and VDD plus dedicated decoupling caps on AVDD/AVSS pairs is mandatory for 12 ENOB performance.
معلومات الامتثال
RoHS compliant per Microchip product page. The -I temperature grade is industrial (-40C to +85C) and is NOT AEC-Q100 qualified - select an AEC-Q100 qualified variant (separate MPN) for OEM automotive under-hood deployments.
