PIC24FJ256GU406-I/MR - 16-Bit MCU 256KB Flash USB LCD 64-QFN | Microchip
MPN: PIC24FJ256GU406-I/MR ✓ نشطPIC24FJ256GU406-I/MR نظرة عامة
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a range of analog and digital peripherals. Within the broader system hierarchy, the PIC24FJ belongs to the 16-bit microcontroller tier -> the PIC24F XLP subfamily -> eXtreme Low Power devices -> Microchip's embedded product portfolio. The 16-bit modified Harvard architecture delivers higher code density and arithmetic throughput than 8-bit AVR/PIC MCUs while retaining deterministic interrupt behaviour familiar to PIC users.
Key features of this part include Core Independent Peripherals (CIPs) such as Configurable Logic Cells (CLC), a 12-bit ADC with 500 ksps throughput, multiple UART/SPI/I2C peripherals, a Real-Time Clock and Calendar (RTCC) with backup battery domain, and an integrated segmented LCD driver supporting up to 480 segments. Hardware crypto acceleration (AES, DES, 3DES, SHA, MD5, HMAC) and a true random number generator (TRNG) make it suited to authenticated and secure IoT nodes.
Typical applications include battery-powered IoT sensor nodes with USB-C charging, BLE/Sub-GHz gateway controllers, secure medical monitoring devices, industrial HMI panels with segmented LCD readouts, low-power wireless instrumentation, and consumer devices requiring OTA firmware with the dual-partition flash guarantee. The 9x9 mm 64-QFN package supports dense PCB designs while still providing ample GPIO (54+ I/O pins) for peripheral expansion.
Designers should use Microchip's MPLAB X IDE with the XC16 compiler and configure the RTCC battery domain with an external coin cell to maintain timekeeping below 1 uA in deep sleep. For secure OTA, place the new image in the inactive partition, verify its signature against a public key stored in secure Flash, then atomically swap partitions on next boot.
بدائل مباشرة لـ PIC24FJ256GU406-I/MR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC24FJ256GU406-I/MR (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Core Architecture, Operating Temperature, LCD Driver.
PIC24FJ256GU406-E/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GU405-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ128GU406-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GL406-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GB406T-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA406-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GU406-I/MR الحدود القصوى والخصائص الكهربائية
| Core Architecture | 16-bit PIC24F modified Harvard |
| CPU Frequency | 32 MHz (16 MIPS) |
| Program Flash (ECC) | 256 KB (128 KB ECC) |
| RAM | 32 KB |
| Dual-Partition Flash | Yes (live OTA support) |
| USB | USB 2.0 Full-Speed Device |
| LCD Controller | Segmented, up to 480 segments |
| Crypto Accelerator | AES, DES, 3DES, SHA, MD5, HMAC, TRNG |
| Operating Voltage | 2.0 V to 3.6 V |
| درجة حرارة التشغيل | -40C to +85C (Industrial) |
| العلبة | 64-QFN (MR) 9x9 mm |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 (168 hours) |
| حالة RoHS | Compliant |
تكوين أطراف PIC24FJ256GU406-I/MR
| دبوس 1 | RB0 — GPIO / programming clock |
| دبوس 2 | RB1 — GPIO |
| دبوس 3 | RB2 — GPIO |
| دبوس 4 | RB3 — GPIO |
| دبوس 5 | RB4 — GPIO |
| دبوس 6 | RB5 — GPIO |
| دبوس 7 | RB6 — GPIO / ICS PGC |
| دبوس 8 | RB7 — GPIO / ICS PGD |
| دبوس 9 | RB8 — GPIO |
| دبوس 10 | RB9 — GPIO |
| دبوس 11 | VSS — Ground |
| دبوس 12 | VDD — Supply voltage |
| دبوس 13 | RA0 — GPIO / LCD segment |
| دبوس 14 | RA1 — GPIO / LCD segment |
| دبوس 15 | RA2 — GPIO / LCD segment |
| دبوس 16 | RA3 — GPIO / LCD segment |
| دبوس 17 | RA4 — GPIO / LCD segment |
| دبوس 18 | RA5 — GPIO / LCD segment |
| دبوس 19 | RA6 — GPIO / LCD segment |
| دبوس 20 | RA7 — GPIO / LCD segment |
| دبوس 21 | RC0 — GPIO |
| دبوس 22 | RC1 — GPIO |
| دبوس 23 | RC2 — GPIO |
| دبوس 24 | RC3 — GPIO |
| دبوس 25 | RC4 — GPIO |
| دبوس 26 | RC5 — GPIO |
| دبوس 27 | RC6 — GPIO / UART TX |
| دبوس 28 | RC7 — GPIO / UART RX |
| دبوس 29 | RC8 — GPIO |
| دبوس 30 | RC9 — GPIO |
| دبوس 31 | VSS — Ground |
| دبوس 32 | VDD — Supply voltage |
| دبوس 33 | RD0 — GPIO / LCD segment |
| دبوس 34 | RD1 — GPIO / LCD segment |
| دبوس 35 | RD2 — GPIO / LCD segment |
| دبوس 36 | RD3 — GPIO / LCD segment |
| دبوس 37 | RD4 — GPIO / LCD segment |
| دبوس 38 | RD5 — GPIO / LCD segment |
| دبوس 39 | RD6 — GPIO / LCD segment |
| دبوس 40 | RD7 — GPIO / LCD segment |
| دبوس 41 | RD8 — GPIO / LCD segment |
| دبوس 42 | RD9 — GPIO / LCD segment |
| دبوس 43 | RD10 — GPIO / LCD segment |
| دبوس 44 | RD11 — GPIO / LCD segment |
| دبوس 45 | RE0 — GPIO / LCD segment |
| دبوس 46 | RE1 — GPIO / LCD segment |
| دبوس 47 | RE2 — GPIO / LCD segment |
| دبوس 48 | RE3 — GPIO / LCD segment |
| دبوس 49 | RE4 — GPIO / LCD segment |
| دبوس 50 | RE5 — GPIO / LCD segment |
| دبوس 51 | RE6 — GPIO / LCD segment |
| دبوس 52 | RE7 — GPIO / LCD segment |
| دبوس 53 | RF0 — GPIO |
| دبوس 54 | RF1 — GPIO |
| دبوس 55 | RF2 — GPIO |
| دبوس 56 | RF3 — GPIO |
| دبوس 57 | RF4 — GPIO |
| دبوس 58 | RF5 — GPIO |
| دبوس 59 | VUSB — USB 3.3V regulator output |
| دبوس 60 | VBUS — USB VBUS sense input |
| دبوس 61 | D+ — USB D+ data line |
| دبوس 62 | D- — USB D- data line |
| دبوس 63 | VBAT — RTCC backup battery domain |
| دبوس 64 | EP — Exposed thermal pad (connect to ground) |
التطبيقات النموذجية
PIC24FJ256GU406-I/MR مناسب لـ 6 التطبيقs: Battery-Powered IoT Sensor Node, Secure Medical Monitoring Device, Industrial HMI with Segmented LCD, USB-C Charging Smart Accessory, Low-Power Wireless Gateway Controller, Consumer Device with OTA Firmware.
Battery-Powered IoT Sensor Node
The PIC24FJ256GU406-I/MR fits IoT sensor nodes because its 16 MIPS core, integrated USB, hardware crypto engine, and dual-partition Flash deliver a complete connected platform in a single 9x9 mm QFN. The AES/SHA accelerator authenticates uplink packets and the TRNG supports secure key generation, while eXtreme Low Power (XLP) modes drop quiescent current to single-digit microamps, enabling multi-year coin-cell operation on remote environmental or asset-tracking sensors.
موصى به
Secure Medical Monitoring Device
The PIC24FJ256GU406-I/MR is well suited to secure medical monitors because the hardware crypto block performs AES-128/256 encryption on patient data at line rate without burdening the 16 MIPS core. The segmented LCD controller drives a 480-segment glass readout directly, removing external display drivers, and dual-partition OTA allows safe in-field firmware updates that comply with FDA cyber-security guidance on medical device firmware integrity.
موصى به
Industrial HMI with Segmented LCD
For industrial human-machine interfaces, the PIC24FJ256GU406-I/MR's integrated LCD controller drives up to 480 segments of segmented glass, eliminating external driver ICs and reducing BOM cost in panel meters, thermostat keypads, and weigh-scale displays. The Core Independent Peripherals (CLC, MCCP, 16-bit timers) handle keypad scanning, buzzer PWM, and encoder decoding in hardware, freeing the CPU to manage Modbus, CAN, or USB-HID communications.
موصى به
USB-C Charging Smart Accessory
The PIC24FJ256GU406-I/MR simplifies USB-C smart accessories by integrating a full-speed USB 2.0 device controller plus the segmented LCD for real-time status display. The 32 KB RAM buffers USB descriptors and HID reports, while the 256 KB Flash stores OEM firmware and configuration profiles. XLP sleep currents below 5 uA allow battery-powered accessories to remain attached to USB for months without draining the host port.
موصى به
Low-Power Wireless Gateway Controller
As a gateway controller, the PIC24FJ256GU406-I/MR bridges Sub-GHz or BLE peripherals to a wired USB host. The 32 MIPS class performance handles protocol translation between UART-attached radio modules and the USB stack, while the hardware AES block encrypts the wireless hop. The dual-partition Flash provides safe gateway firmware updates without bricking remote installations, a critical reliability feature for managed IoT fleets.
موصى به
Consumer Device with OTA Firmware
The PIC24FJ256GU406-I/MR's dual-partition Flash architecture lets consumer products pull signed firmware images over USB or wireless and swap partitions on next reboot without bricking. Combined with the LCD driver, crypto accelerator, and 32 KB RAM, it is a single-chip solution for connected toys, smart-home remotes, and fitness wearables that demand secure field upgradability in a compact 9x9 mm footprint.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC24FJ256GU406-I/MR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC24FJ256GU406-E/MR | PIC24FJ256GU405-I/PT | PIC24FJ128GU406-I/MR | PIC24FJ256GL406-I/MR | PIC24FJ256GB406T-I/MR | PIC24FJ256GA406-I/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-TQFP (PT) - different package code | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Program Flash (ECC) | 256 KB (128 KB ECC) | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB | 256 KB |
| Crypto Accelerator | AES/DES/SHA/HMAC/TRNG | AES/DES/SHA/HMAC/TRNG | AES/DES/SHA/HMAC/TRNG | No | |||
| Dual-Partition OTA Flash | Yes | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
أبرز الفروقات
- Integrated hardware crypto accelerator (مقابلPIC24FJ256GA406-I/MR)
- 256 KB Flash versus 128 KB on the lower-density sibling (مقابلPIC24FJ128GU406-I/MR)
- Same-package extended-temperature upgrade (مقابلPIC24FJ256GU406-E/MR)
ملاحظات التصميم
The PIC24FJ256GU406-I/MR supports XLP deep-sleep modes with quiescent current in the single-digit microamp range. Configure unused peripherals off and gate the system clock via the OSCCON register before entering Sleep. Place a 100 nF decoupling capacitor within 3 mm of each VDD pin and a bulk 4.7 uF ceramic near the package exposed pad (EP). The EP must be soldered to the ground plane for thermal dissipation and electrical reference.
Route the USB D+ and D- lines as a 90-ohm differential pair with matched length, keeping them well away from switching nodes like the LCD charge pump. Place the 12 MHz external crystal (or resonator) within 5 mm of OSCI/OSCO with a grounded guard ring to minimize EMI into the USB bus. Per IPC-2221, the 64-QFN land pattern requires NSMD pads with a 1:1 pad-to-mask ratio for reliable rework.
Estimated: At 32 MHz full speed with all peripherals active, the core draws ~15 mA from 3.3 V. Power dissipation at peak (PD ~ 50 mW) is negligible for the 64-QFN but the EP must still be soldered. Do not omit the 1 uF VBAT capacitor - the RTCC loses timekeeping without it. Do not program the dual-partition swap bit until the new image's CRC and signature have been verified; otherwise a corrupted OTA image will brick the device.
معلومات الامتثال
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (standard part); automotive designs should consider PIC24FJ256GU406-E/MR extended-temp variant.