PIC32MK1024GPD064T-I/MR - 120MHz MCU, 1MB Flash, 64-QFN | Microchip
MPN: PIC32MK1024GPD064T-I/MR ✓ نشطPIC32MK1024GPD064T-I/MR نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O into one package. The PIC32MK family belongs to the broader PIC32 family, which uses the MIPS32 microAptiv core architecture; the GPD sub-family is a dual-partition variant with separate Flash and SRAM regions optimized for deterministic real-time control. Within Microchip's portfolio, PIC32MK MCUs sit between the lower-pin-count PIC32MX and the higher-performance dsPIC33CH dual-core DSP controllers.
Key features include 120 MHz core speed with DSP instructions and FPU, 1 MB dual-bank Flash, 256 KB SRAM, four independent analog comparators with 32 ns response, multiple 12-bit ADCs up to 3.5 MSPS, three 4-channel high-speed PWM modules (250 ps resolution), six UART, three SPI, four I2C, USB-FS, and CAN-FD. The device also integrates a Cryptographic Engine, a Random Number Generator, and an RTCC.
Technically, the PIC32MK1024GPD064T-I/MR uses a Harvard architecture with separate instruction and data paths, dual partition Flash for live update, and a 32-channel DMA controller. The 12-bit ADC includes oversampling and a shared 1.5 MSPS SAR core; the motor-control PWM (MCPWM) supports up to 12 outputs with 250 ps edge resolution. Operating voltage is 2.3V to 3.6V, with a -40C to +85C industrial temperature range, and the chip is supplied in tape-and-reel.
Typical applications include digital power conversion (DC-DC, PFC, inverters), field-oriented motor control (BLDC, PMSM), industrial PLC modules, and functional safety designs. The part is recommended for new motor-control and digital-power designs by Microchip.
When designing with the PIC32MK1024GPD064T-I/MR, ensure adequate decoupling on AVDD rails (4.7 uF plus 0.1 uF ceramic) and route the analog ground plane to minimize ADC noise coupling. The 9x9 mm QFN has a thermal pad that must be soldered to a continuous ground plane for heat dissipation, especially at full 120 MHz with all peripherals active.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC32MK1024GPD064T-I/MR, including same-family PIC32MK variants and direct cross-brand equivalents not found in the manufacturer datasheet.
بدائل مباشرة لـ PIC32MK1024GPD064T-I/MR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MK1024GPD064T-I/MR (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Operating Temperature, Program Memory (Flash), USB.
PIC32MK1024GPD064-I/MR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC32MK1024GPD064-E/MR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC32MK1024GPD064-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MK0512GPD064-E/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MK0256GPD064-I/R4X
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC32MK1024GPD064T-I/MR الحدود القصوى والخصائص الكهربائية
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum CPU Speed | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| درجة حرارة التشغيل | -40C to +85C |
| العلبة | 64-pin QFN (9x9 mm) with exposed pad |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 |
| ADC | 12-bit, up to 3.5 MSPS |
| PWM Channels | 12 high-speed (250 ps resolution) |
| UART | 6 |
| SPI | 3 |
| I2C | 4 |
| CAN-FD | Yes |
| USB | USB-FS |
| حالة RoHS | Compliant |
دليل تكوين أطراف PIC32MK1024GPD064T-I/MR 64-pin qfn (9x9 mm) with exposed pad
تكوين الأطراف لـ PIC32MK1024GPD064T-I/MR (حزمة 64-pin qfn (9x9 mm) with exposed pad). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ PIC32MK1024GPD064T-I/MR.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
PIC32MK1024GPD064T-I/MR مناسب لـ 6 التطبيقs: Field-Oriented Motor Control (FOC) for PMSM/BLDC, Digital Power Conversion (DC-DC, PFC, Inverters), Industrial PLC and Control Modules, Functional Safety and SIL-rated Industrial Systems, Solar Microinverters and Power Optimizers, USB-Connected Industrial Data Acquisition.
Field-Oriented Motor Control (FOC) for PMSM/BLDC
The PIC32MK1024GPD064T-I/MR is purpose-built for FOC of PMSM and BLDC motors. Its 12-output MCPWM module with 250 ps edge resolution delivers clean 20-100 kHz switching with sub-1% current ripple, and the 12-bit ADC samples at 3.5 MSPS for accurate phase current sensing. The 120 MHz MIPS32 core with FPU and DSP executes the FOC loop (Clarke/Park transform, SVPWM modulation) in under 5 us, leaving CPU headroom for sensor handling and CAN communication. The 1 MB Flash fits full motor-control firmware plus communication stacks.
موصى به
Digital Power Conversion (DC-DC, PFC, Inverters)
The PIC32MK1024GPD064T-I/MR's high-resolution PWM and fast ADC make it ideal for digital power supplies including buck/boost converters, totem-pole PFC, and solar inverters. The 250 ps PWM resolution enables peak-current-mode control at 1 MHz switching frequency, while the 3.5 MSPS ADC samples voltage and current loops with minimal phase lag. The dual-bank 1 MB Flash supports field-upgradeable firmware for grid-tied inverter firmware updates, and the CAN-FD interface enables real-time telemetry in industrial power systems.
موصى به
Industrial PLC and Control Modules
The PIC32MK1024GPD064T-I/MR is well-suited to industrial PLC I/O modules and process controllers. Six UARTs support RS-232/RS-485 multi-drop industrial networks, four I2C buses handle sensor aggregation, and CAN-FD provides deterministic industrial bus communication. The 256 KB SRAM supports TCP/IP stacks via external PHYs, while 1 MB Flash stores firmware for IEC 61131-3 logic plus Modbus/CANopen stack. The industrial -40C to +85C operating range ensures reliable operation in factory cabinets and outdoor enclosures.
موصى به
Functional Safety and SIL-rated Industrial Systems
The PIC32MK1024GPD064T-I/MR's ECC-protected Flash, dual-bank A/B boot, and integrated safety peripherals support IEC 61508 SIL-2 capable designs. The dual-partition Flash enables fail-safe firmware updates without downtime, and the watchdog timer plus clock fail-safe monitor provide hardware fault detection. The 250 ps PWM resolution and fast ADC enable precise control loops in safety-critical applications like robotic motion control and emergency shutdown systems. Microchip provides safety manuals and FMEDA reports for this device.
موصى به
Solar Microinverters and Power Optimizers
The PIC32MK1024GPD064T-I/MR's combination of dual-bank Flash, fast ADC, and high-resolution PWM is ideal for solar microinverters and module-level power optimizers. The 1 MB Flash stores MPPT algorithms plus grid-tie compliance firmware, and dual-bank operation enables over-the-air firmware updates per NEC 2017 rapid shutdown requirements. The 6 UART channels support daisy-chained module communication, and CAN-FD enables real-time panel-level telemetry to central inverters for arc-fault detection and rapid shutdown coordination.
موصى به
USB-Connected Industrial Data Acquisition
The PIC32MK1024GPD064T-I/MR's integrated USB-FS and 12-bit ADC make it suitable for USB-connected industrial data acquisition modules. The USB-FS device interface enumerates as a CDC or vendor-class device for high-speed streaming of ADC samples, while the 256 KB SRAM buffers multi-channel ADC acquisitions at 3.5 MSPS. Six UARTs allow multi-protocol sensor aggregation, and the 1 MB Flash stores USB stack plus application firmware with room for future expansion.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MK1024GPD064T-I/MR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MK1024GPD064-I/MR | PIC32MK1024GPD064-E/MR | PIC32MK1024GPD064-I/PT | PIC32MK0512GPD064-E/PT | PIC32MK0256GPD064-I/R4X |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-TQFP (10x10 mm) - same pins | 64-TQFP (10x10 mm) - same pins | 64-QFN (9x9 mm) - same |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 256 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB | 32 KB |
| Core Speed | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
| ADC Speed | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS |
| PWM Resolution | 250 ps | 250 ps | 250 ps | 250 ps | 250 ps | 250 ps |
أبرز الفروقات
- Highest ADC throughput in PIC32MK GPD family at 3.5 MSPS (مقابلPIC32MK1024GPK064)
- Dual-bank 1 MB Flash for live firmware updates (مقابلPIC32MK0512GPD064-E/PT)
- Compact 64-pin QFN package with full peripheral set (مقابلPIC32MK1024GPD064-I/PT)
- Industrial -40C to +85C operating range as standard (مقابلPIC32MK1024GPD064-E/MR)
ملاحظات التصميم
The PIC32MK1024GPD064T-I/MR requires separate AVDD/AVSS analog supplies for the 12-bit ADC; place a 4.7 uF tantalum plus 0.1 uF ceramic decoupling pair within 5 mm of the AVDD pins. The internal 1.2V core regulator needs a 1 uF ceramic on the VCAP pin. Inrush current at startup can exceed 80 mA on the 3.3V rail; ensure upstream DC-DC has sufficient bulk capacitance (>= 47 uF) for clean rise. Brown-out reset (BOR) must be enabled to prevent code execution at low voltage.
Estimated: at maximum 120 MHz with all peripherals active, the 64-QFN package dissipates approximately 0.45W, yielding a junction temperature rise of about 30C above ambient (theta_JA = 65 C/W on a 4-layer PCB). For designs operating above 70C ambient, solder the exposed thermal pad to a continuous ground pour of at least 1 square inch. Avoid placing the MCU directly above high-current switching components; thermal coupling from MOSFETs can push the junction above 105C during FOC operation.
The 64-QFN 9x9 mm package has a 0.5 mm pitch and exposed thermal pad requiring precise PCB layout. Use NSMD pads with a 1:1 pad-to-pitch ratio and 0.3 mm via-in-pad thermal array (8-12 vias, 0.3 mm drill) under the EP for thermal dissipation. Route analog signals (ADC inputs) on the top layer with ground guard traces, and keep PWM traces away from analog inputs by at least 3 mm to prevent switching noise coupling into ADC samples.
Do not attempt live firmware updates on a single-bank Flash configuration - the PIC32MK1024GPD064T-I/MR's dual-bank feature must be enabled in the FBOOT configuration bits, otherwise the MCU will fail to boot after a bad update. The MCPWM module requires specific unlock sequence before accessing protected PWM control registers; failure to unlock causes silent PWM output disable. USB-FS requires a 48 MHz clock from the Primary Oscillator with PLL; crystal accuracy must be within 50 ppm for USB compliance.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - automotive applications should use -A or -V automotive-graded PIC32MK variants. Lead-free and halogen-free packaging confirmed.
