PIC32MX270F256D-I/ML - 256KB Flash 32-bit MCU 44-QFN | Microchip
MPN: PIC32MX270F256D-I/ML ✓ نشطPIC32MX270F256D-I/ML نظرة عامة
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals such as timers, communication interfaces, and analog blocks. The PIC32MX270 family sits inside Microchip's PIC32MX1XX/2XX lineup - 32-bit MIPS microcontrollers that scale up from the 8-bit PIC16/PIC18 architectures. Within the broader product taxonomy, this part is a 32-bit MCU -> microcontroller (MCU) -> embedded processor -> semiconductor device.
Key features include a 32-bit MIPS M4K core delivering up to 83 DMIPS, two I2S/SPI modules for audio codecs, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) for graphics interfaces, and a USB 2.0 full-speed device/host/OTG controller. The 10-bit ADC, multiple UART/I2C/SPI channels, mTouch capacitive-touch support, and a 1 ns high-resolution timer make it a versatile analog-and-connectivity platform.
Technically, the PIC32MX270F256D-I/ML uses a 5-stage pipeline MIPS32 core, hardware Multiply/Divide, and tightly-coupled peripherals sharing a multi-channel DMA. The 44-QFN package exposes up to 33 GPIO through PPS remapping, freeing pin-out planning. The integrated USB PHY and on-chip transceiver eliminate external USB components for full-speed applications.
Typical applications include Bluetooth audio development kits (the official Microchip PIC32 Bluetooth Audio Dev Kit uses this device as the PIM), USB audio peripherals, PMP-driven TFT graphic HMIs, capacitive-touch user panels, and low-power connected sensor nodes.
When designing with this part, plan decoupling with a 0.1 uF plus 10 uF bulk arrangement and verify PPS mappings early - mis-mapped PPS functions are the most common bring-up issue. The QFN package requires careful thermal pad soldering and a properly sized ground plane.
This page synthesizes distributor pricing, verified same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a focused engineering reference for the PIC32MX270F256D-I/ML.
بدائل مباشرة لـ PIC32MX270F256D-I/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MX270F256D-I/ML (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Operating Temperature, DMA Channels, Maximum CPU Frequency.
PIC32MX270F256DT-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX270F256D-V/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX270F256DT-50I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX270F256D-50I/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX270F256DT-V/ML
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX270F256D-I/ML الحدود القصوى والخصائص الكهربائية
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| Performance | 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Active Current Consumption | 0.5 mA/MHz (Typical) |
| ADC | 10-bit |
| I2S / SPI Audio Modules | 2 |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| Capacitive Touch (mTouch) | Yes |
| High-Resolution Timer | 1 ns resolution |
| نطاق درجة حرارة التشغيل | -40C to +85C (Industrial -I grade) |
| العلبة | 44-pin QFN (8x8 mm) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف PIC32MX270F256D-I/ML
| دبوس 1 | RPB0/AN0/C1IND/RT0 — Remappable GPIO / ADC analog input / Comparator input |
| دبوس 2 | RPB1/AN1/C1INC/RT1 — Remappable GPIO / ADC analog input / Comparator input |
| دبوس 3 | RPB2/AN2/C2IND/RT2 — Remappable GPIO / ADC analog input / Comparator input |
| دبوس 4 | RPB3/AN3/C2INC/RT3 — Remappable GPIO / ADC analog input / Comparator input |
| دبوس 5 | VDD — Positive supply for I/O logic (2.3V-3.6V) |
| دبوس 6 | VSS — Ground reference for I/O pins |
| دبوس 7 | RPB4/AN4/C1INB/RT4 — Remappable GPIO / ADC analog input / Comparator input |
| دبوس 8 | RPB5/AN5/C1INA/RT5 — Remappable GPIO / ADC analog input / Comparator input |
| دبوس 9 | VSS — Ground |
| دبوس 10 | RPB6/AN6/C2INA — Remappable GPIO / ADC analog input |
| دبوس 11 | RPB7/AN7/C2INB — Remappable GPIO / ADC analog input |
| دبوس 12 | VDD — Positive supply for I/O logic |
| دبوس 13 | RPA0/T1CK — Remappable GPIO / Timer1 clock input |
| دبوس 14 | RPA1 — Remappable GPIO |
| دبوس 15 | AVDD — Positive supply for analog modules |
| دبوس 16 | AVSS — Ground for analog modules |
| دبوس 17 | RPA2 — Remappable GPIO |
| دبوس 18 | RPA3 — Remappable GPIO |
| دبوس 19 | VDD — Positive supply for I/O logic |
| دبوس 20 | VSS — Ground |
| دبوس 21 | RPA4 — Remappable GPIO |
| دبوس 22 | RPA5 — Remappable GPIO |
| دبوس 23 | RPC6/PMA4 — Remappable GPIO / PMP address line |
| دبوس 24 | RPC7/PMA5 — Remappable GPIO / PMP address line |
| دبوس 25 | RPC8/PMA6 — Remappable GPIO / PMP address line |
| دبوس 26 | RPC9/PMA7 — Remappable GPIO / PMP address line |
| دبوس 27 | VSS — Ground |
| دبوس 28 | VDD — Positive supply for I/O logic |
| دبوس 29 | RPD0/RT0 — Remappable GPIO |
| دبوس 30 | RPD1/RT1 — Remappable GPIO |
| دبوس 31 | RPD2/RT2 — Remappable GPIO |
| دبوس 32 | RPD3/RT3 — Remappable GPIO |
| دبوس 33 | RPD4/RT4 — Remappable GPIO |
| دبوس 34 | RPD5/RT5 — Remappable GPIO |
| دبوس 35 | VSS — Ground |
| دبوس 36 | RPD6 — Remappable GPIO |
| دبوس 37 | RPD7 — Remappable GPIO |
| دبوس 38 | VDD — Positive supply for I/O logic |
| دبوس 39 | VUSB3V3 — USB internal transceiver 3.3V supply |
| دبوس 40 | D+/RGPU — USB D+ / Remappable GPIO |
| دبوس 41 | D-/RGPU — USB D- / Remappable GPIO |
| دبوس 42 | VSS — Ground |
| دبوس 43 | OSC1/CLKI/RC0 — Crystal oscillator input / External clock input |
| دبوس 44 | OSC2/CLKO/RC1 — Crystal oscillator output / System clock output |
التطبيقات النموذجية
PIC32MX270F256D-I/ML مناسب لـ 7 التطبيقs: Bluetooth Audio Development Kit (PIM), USB Audio Peripherals (Headset Dongle, Sound Card), PMP-Driven TFT Graphic HMI, Capacitive-Touch Control Panels (mTouch), Low-Power Connected Sensor Nodes, Industrial Control / Factory Automation, Consumer Audio Devices (Docking Stations, Toys).
Bluetooth Audio Development Kit (PIM)
The PIC32MX270F256D-I/ML is the Plug-In Module (PIM) for the official Microchip PIC32 Bluetooth Audio Development Kit, designed to showcase the PIC32MX1XX/2XX family for Bluetooth-audio applications. The 50 MHz MIPS32 M4K core, 64 KB SRAM, and dual I2S/SPI modules make it ideal for stereo audio decoding, Bluetooth-stream buffering, and DSP-style sample manipulation. The USB 2.0 full-speed OTG controller and PMP interface let the PIM serve as a USB-audio sink or drive a TFT HMI. The 256 KB Flash comfortably fits Bluetooth profile stacks plus audio codecs; the 44-QFN package exposes 33 GPIO for codec control and HMI.
موصى به
USB Audio Peripherals (Headset Dongle, Sound Card)
The PIC32MX270F256D-I/ML integrates a USB 2.0 full-speed device/host/OTG controller with on-chip transceiver - eliminating external USB PHY components and shrinking BOM for USB audio peripherals. With 256 KB Flash and 64 KB SRAM, the MCU can host USB audio class 1.0 firmware plus custom DSP routines for noise suppression or EQ. The two I2S/SPI modules multiplex into the audio codec, while PPS lets engineers reroute USB, I2S, and I2C signals across the 33 available GPIO. The 44-QFN (8x8 mm) footprint keeps PCB area under 60 mm squared, suitable for compact USB dongles.
موصى به
PMP-Driven TFT Graphic HMI
The PIC32MX270F256D-I/ML includes a Parallel Master Port (PMP) that directly interfaces 8/16-bit parallel TFT LCDs and SRAM/EEPROM, ideal for small graphic HMIs in industrial control and consumer appliances. The 50 MHz MIPS32 core delivers 83 DMIPS, enough to refresh QVGA displays at 30 fps with simple on-chip frame memory. The 10-bit ADC and mTouch capacitive-touch sensing allow direct connection to resistive touchscreens or cap-touch buttons. Peripheral Pin Select (PPS) decouples PMP data/control lines from fixed pins, simplifying layout against TFT connector geometry.
موصى به
Capacitive-Touch Control Panels (mTouch)
The PIC32MX270F256D-I/ML supports Microchip's mTouch capacitive-touch sensing library, enabling up to ~16 touch buttons or a slider without external touch ICs. The on-chip CTMU (Charge Time Measurement Unit) provides hardware-driven capacitance measurement, reducing CPU overhead. Combined with PPS, the same 44-QFN PCB can be reused across product variants with different touch sensor layouts. The 256 KB Flash is generous for touch firmware, debounce, and water-tolerance algorithms.
موصى به
Low-Power Connected Sensor Nodes
The PIC32MX270F256D-I/ML combines 0.5 mA/MHz active current with multiple low-power sleep modes, suiting battery-powered connected sensor nodes that wake periodically to read data and report over UART, I2C, or USB. The 64 KB SRAM accommodates moderate sensor data buffers, while the 256 KB Flash stores wireless protocol stacks (Bluetooth LE, LoRa, or sub-GHz proprietary). The 1 ns high-resolution timer enables precise timestamping of sensor events; the 10-bit ADC handles analog sensor front-ends. PPS allows the same MCU to serve varied sensor populations without PCB redesign.
موصى به
Industrial Control / Factory Automation
The PIC32MX270F256D-I/ML's industrial -40C to +85C temperature rating, USB OTG for configuration, PMP for local HMI panels, and multiple UART/I2C/SPI channels make it a flexible factory-automation controller for small PLCs, motor-control front-ends, and sensor aggregation gateways. The 50 MHz MIPS32 core executes control loops fast enough for low-to-mid-speed motor control, while the 10-bit ADC samples current/voltage feedback signals. Hardware DMA offloads serial traffic, freeing CPU for deterministic control code. The 44-QFN footprint and Microchip MPLAB Harmony support shorten industrial product development cycles.
موصى به
Consumer Audio Devices (Docking Stations, Toys)
The PIC32MX270F256D-I/ML drives consumer audio products such as iPod-style docking stations, musical toys, and Bluetooth speakers, where dual I2S/SPI support stream audio to external DACs/amps. The integrated USB full-speed OTG enables MP3 playback from USB sticks or direct digital audio from a host PC. The 256 KB Flash supports MP3/AAC decoding libraries plus UI firmware, while the 64 KB SRAM buffers compressed audio streams. The 44-QFN (8x8 mm) footprint fits compact consumer enclosures.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MX270F256D-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MX270F256DT-I/ML | PIC32MX270F256D-V/ML | PIC32MX270F256DT-50I/ML | PIC32MX270F256D-50I/ML | PIC32MX270F256DT-V/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 40 MHz (-I grade) | 40 MHz (-I grade) | 50 MHz (-V grade) | 50 MHz (-50I grade) | 50 MHz (-50I grade) | 50 MHz (-V grade) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +105C |
| Packaging Format | Tray (non-T&R) | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG |
| I2S/SPI Audio Modules | 2 | 2 | 2 | 2 | 2 | 2 |
| Parallel Master Port (PMP) | Yes | Yes | Yes | Yes | Yes | Yes |
أبرز الفروقات
- Native USB 2.0 full-speed OTG with on-chip transceiver (مقابلPIC32MX230F256D-I/ML)
- Dual I2S/SPI modules for stereo audio codec support (مقابلPIC32MX150F128D-I/PL)
- Peripheral Pin Select (PPS) flexibility for layout reuse (مقابلPIC32MX170F256D-I/PT)
ملاحظات التصميم
Place a 0.1 uF ceramic decoupling capacitor as close as possible to every VDD/AVDD pin, and add one 10 uF bulk capacitor per power domain. The 44-QFN package exposes a center thermal pad on the underside; solder it to a continuous ground plane with multiple thermal vias to dissipate up to ~400 mW typical MCU dissipation. USB D+/D- traces should be 90 ohm differential, length-matched, and kept away from switching signals.
Peripheral Pin Select (PPS) mis-mappings are the most common PIC32MX270 bring-up issue. Always configure PPS input/output mapping via unlock sequence (PPSUNLOCK), or peripherals will not appear on the expected pins. Do not assume default pin assignments; verify the PPS table against your schematic before debugging. JTAG pins (TMS/TCK/TDO/TDI) are fixed and NOT remappable.
The PIC32MX270F256D-I/ML has separate AVDD/AVSS analog supply pins that must be tied to VDD/VSS even if the ADC is unused, with their own decoupling. USB applications should connect VUSB3V3 to a regulated 3.3V rail; this pin powers the internal USB transceiver and must remain within 3.0V-3.6V. For low-power modes, the on-chip Voltage Regulator (VCAP) requires a 10 uF capacitor on the VCAP pin for stability.
معلومات الامتثال
RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable for industrial -I temperature grade; -V grade is the closest automotive/extended option but is not formally AEC-Q100 qualified.