PIC32MX270F256D-I/ML - 256KB Flash 32-bit MCU 44-QFN | Microchip
Référence : PIC32MX270F256D-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.21 | $521,00 |
| 500 | $4.69 | $2 345,00 |
| 1 000 | $4.18 | $4 180,00 |
PIC32MX270F256D-I/ML Présentation
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals such as timers, communication interfaces, and analog blocks. The PIC32MX270 family sits inside Microchip's PIC32MX1XX/2XX lineup - 32-bit MIPS microcontrollers that scale up from the 8-bit PIC16/PIC18 architectures. Within the broader product taxonomy, this part is a 32-bit MCU -> microcontroller (MCU) -> embedded processor -> semiconductor device.
Key features include a 32-bit MIPS M4K core delivering up to 83 DMIPS, two I2S/SPI modules for audio codecs, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) for graphics interfaces, and a USB 2.0 full-speed device/host/OTG controller. The 10-bit ADC, multiple UART/I2C/SPI channels, mTouch capacitive-touch support, and a 1 ns high-resolution timer make it a versatile analog-and-connectivity platform.
Technically, the PIC32MX270F256D-I/ML uses a 5-stage pipeline MIPS32 core, hardware Multiply/Divide, and tightly-coupled peripherals sharing a multi-channel DMA. The 44-QFN package exposes up to 33 GPIO through PPS remapping, freeing pin-out planning. The integrated USB PHY and on-chip transceiver eliminate external USB components for full-speed applications.
Typical applications include Bluetooth audio development kits (the official Microchip PIC32 Bluetooth Audio Dev Kit uses this device as the PIM), USB audio peripherals, PMP-driven TFT graphic HMIs, capacitive-touch user panels, and low-power connected sensor nodes.
When designing with this part, plan decoupling with a 0.1 uF plus 10 uF bulk arrangement and verify PPS mappings early - mis-mapped PPS functions are the most common bring-up issue. The QFN package requires careful thermal pad soldering and a properly sized ground plane.
This page synthesizes distributor pricing, verified same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a focused engineering reference for the PIC32MX270F256D-I/ML.
Alternatives de remplacement direct pour PIC32MX270F256D-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX270F256D-I/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, DMA Channels, Maximum CPU Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX270F256DT-I/ML
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX270F256D-V/ML
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →PIC32MX270F256DT-50I/ML
✅ Remplacement direct✓ En stock
$4.61 / unité
Voir la fiche technique →PIC32MX270F256D-50I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.74 / unité
Voir la fiche technique →PIC32MX270F256DT-V/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX270F256D-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| Performance | 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Active Current Consumption | 0.5 mA/MHz (Typical) |
| ADC | 10-bit |
| I2S / SPI Audio Modules | 2 |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| Capacitive Touch (mTouch) | Yes |
| High-Resolution Timer | 1 ns resolution |
| Plage de température de fonctionnement | -40C to +85C (Industrial -I grade) |
| Boîtier | 44-pin QFN (8x8 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX270F256D-I/ML
| Broche 1 | RPB0/AN0/C1IND/RT0 — Remappable GPIO / ADC analog input / Comparator input |
| Broche 2 | RPB1/AN1/C1INC/RT1 — Remappable GPIO / ADC analog input / Comparator input |
| Broche 3 | RPB2/AN2/C2IND/RT2 — Remappable GPIO / ADC analog input / Comparator input |
| Broche 4 | RPB3/AN3/C2INC/RT3 — Remappable GPIO / ADC analog input / Comparator input |
| Broche 5 | VDD — Positive supply for I/O logic (2.3V-3.6V) |
| Broche 6 | VSS — Ground reference for I/O pins |
| Broche 7 | RPB4/AN4/C1INB/RT4 — Remappable GPIO / ADC analog input / Comparator input |
| Broche 8 | RPB5/AN5/C1INA/RT5 — Remappable GPIO / ADC analog input / Comparator input |
| Broche 9 | VSS — Ground |
| Broche 10 | RPB6/AN6/C2INA — Remappable GPIO / ADC analog input |
| Broche 11 | RPB7/AN7/C2INB — Remappable GPIO / ADC analog input |
| Broche 12 | VDD — Positive supply for I/O logic |
| Broche 13 | RPA0/T1CK — Remappable GPIO / Timer1 clock input |
| Broche 14 | RPA1 — Remappable GPIO |
| Broche 15 | AVDD — Positive supply for analog modules |
| Broche 16 | AVSS — Ground for analog modules |
| Broche 17 | RPA2 — Remappable GPIO |
| Broche 18 | RPA3 — Remappable GPIO |
| Broche 19 | VDD — Positive supply for I/O logic |
| Broche 20 | VSS — Ground |
| Broche 21 | RPA4 — Remappable GPIO |
| Broche 22 | RPA5 — Remappable GPIO |
| Broche 23 | RPC6/PMA4 — Remappable GPIO / PMP address line |
| Broche 24 | RPC7/PMA5 — Remappable GPIO / PMP address line |
| Broche 25 | RPC8/PMA6 — Remappable GPIO / PMP address line |
| Broche 26 | RPC9/PMA7 — Remappable GPIO / PMP address line |
| Broche 27 | VSS — Ground |
| Broche 28 | VDD — Positive supply for I/O logic |
| Broche 29 | RPD0/RT0 — Remappable GPIO |
| Broche 30 | RPD1/RT1 — Remappable GPIO |
| Broche 31 | RPD2/RT2 — Remappable GPIO |
| Broche 32 | RPD3/RT3 — Remappable GPIO |
| Broche 33 | RPD4/RT4 — Remappable GPIO |
| Broche 34 | RPD5/RT5 — Remappable GPIO |
| Broche 35 | VSS — Ground |
| Broche 36 | RPD6 — Remappable GPIO |
| Broche 37 | RPD7 — Remappable GPIO |
| Broche 38 | VDD — Positive supply for I/O logic |
| Broche 39 | VUSB3V3 — USB internal transceiver 3.3V supply |
| Broche 40 | D+/RGPU — USB D+ / Remappable GPIO |
| Broche 41 | D-/RGPU — USB D- / Remappable GPIO |
| Broche 42 | VSS — Ground |
| Broche 43 | OSC1/CLKI/RC0 — Crystal oscillator input / External clock input |
| Broche 44 | OSC2/CLKO/RC1 — Crystal oscillator output / System clock output |
Applications typiques
PIC32MX270F256D-I/ML convient pour 7 applications: Bluetooth Audio Development Kit (PIM), USB Audio Peripherals (Headset Dongle, Sound Card), PMP-Driven TFT Graphic HMI, Capacitive-Touch Control Panels (mTouch), Low-Power Connected Sensor Nodes, Industrial Control / Factory Automation, Consumer Audio Devices (Docking Stations, Toys).
Bluetooth Audio Development Kit (PIM)
The PIC32MX270F256D-I/ML is the Plug-In Module (PIM) for the official Microchip PIC32 Bluetooth Audio Development Kit, designed to showcase the PIC32MX1XX/2XX family for Bluetooth-audio applications. The 50 MHz MIPS32 M4K core, 64 KB SRAM, and dual I2S/SPI modules make it ideal for stereo audio decoding, Bluetooth-stream buffering, and DSP-style sample manipulation. The USB 2.0 full-speed OTG controller and PMP interface let the PIM serve as a USB-audio sink or drive a TFT HMI. The 256 KB Flash comfortably fits Bluetooth profile stacks plus audio codecs; the 44-QFN package exposes 33 GPIO for codec control and HMI.
Recommandé
USB Audio Peripherals (Headset Dongle, Sound Card)
The PIC32MX270F256D-I/ML integrates a USB 2.0 full-speed device/host/OTG controller with on-chip transceiver - eliminating external USB PHY components and shrinking BOM for USB audio peripherals. With 256 KB Flash and 64 KB SRAM, the MCU can host USB audio class 1.0 firmware plus custom DSP routines for noise suppression or EQ. The two I2S/SPI modules multiplex into the audio codec, while PPS lets engineers reroute USB, I2S, and I2C signals across the 33 available GPIO. The 44-QFN (8x8 mm) footprint keeps PCB area under 60 mm squared, suitable for compact USB dongles.
Recommandé
PMP-Driven TFT Graphic HMI
The PIC32MX270F256D-I/ML includes a Parallel Master Port (PMP) that directly interfaces 8/16-bit parallel TFT LCDs and SRAM/EEPROM, ideal for small graphic HMIs in industrial control and consumer appliances. The 50 MHz MIPS32 core delivers 83 DMIPS, enough to refresh QVGA displays at 30 fps with simple on-chip frame memory. The 10-bit ADC and mTouch capacitive-touch sensing allow direct connection to resistive touchscreens or cap-touch buttons. Peripheral Pin Select (PPS) decouples PMP data/control lines from fixed pins, simplifying layout against TFT connector geometry.
Recommandé
Capacitive-Touch Control Panels (mTouch)
The PIC32MX270F256D-I/ML supports Microchip's mTouch capacitive-touch sensing library, enabling up to ~16 touch buttons or a slider without external touch ICs. The on-chip CTMU (Charge Time Measurement Unit) provides hardware-driven capacitance measurement, reducing CPU overhead. Combined with PPS, the same 44-QFN PCB can be reused across product variants with different touch sensor layouts. The 256 KB Flash is generous for touch firmware, debounce, and water-tolerance algorithms.
Recommandé
Low-Power Connected Sensor Nodes
The PIC32MX270F256D-I/ML combines 0.5 mA/MHz active current with multiple low-power sleep modes, suiting battery-powered connected sensor nodes that wake periodically to read data and report over UART, I2C, or USB. The 64 KB SRAM accommodates moderate sensor data buffers, while the 256 KB Flash stores wireless protocol stacks (Bluetooth LE, LoRa, or sub-GHz proprietary). The 1 ns high-resolution timer enables precise timestamping of sensor events; the 10-bit ADC handles analog sensor front-ends. PPS allows the same MCU to serve varied sensor populations without PCB redesign.
Recommandé
Industrial Control / Factory Automation
The PIC32MX270F256D-I/ML's industrial -40C to +85C temperature rating, USB OTG for configuration, PMP for local HMI panels, and multiple UART/I2C/SPI channels make it a flexible factory-automation controller for small PLCs, motor-control front-ends, and sensor aggregation gateways. The 50 MHz MIPS32 core executes control loops fast enough for low-to-mid-speed motor control, while the 10-bit ADC samples current/voltage feedback signals. Hardware DMA offloads serial traffic, freeing CPU for deterministic control code. The 44-QFN footprint and Microchip MPLAB Harmony support shorten industrial product development cycles.
Recommandé
Consumer Audio Devices (Docking Stations, Toys)
The PIC32MX270F256D-I/ML drives consumer audio products such as iPod-style docking stations, musical toys, and Bluetooth speakers, where dual I2S/SPI support stream audio to external DACs/amps. The integrated USB full-speed OTG enables MP3 playback from USB sticks or direct digital audio from a host PC. The 256 KB Flash supports MP3/AAC decoding libraries plus UI firmware, while the 64 KB SRAM buffers compressed audio streams. The 44-QFN (8x8 mm) footprint fits compact consumer enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX270F256D-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX270F256DT-I/ML | PIC32MX270F256D-V/ML | PIC32MX270F256DT-50I/ML | PIC32MX270F256D-50I/ML | PIC32MX270F256DT-V/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 40 MHz (-I grade) | 40 MHz (-I grade) | 50 MHz (-V grade) | 50 MHz (-50I grade) | 50 MHz (-50I grade) | 50 MHz (-V grade) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +105C |
| Packaging Format | Tray (non-T&R) | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG |
| I2S/SPI Audio Modules | 2 | 2 | 2 | 2 | 2 | 2 |
| Parallel Master Port (PMP) | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Native USB 2.0 full-speed OTG with on-chip transceiver (vs PIC32MX230F256D-I/ML)
- Dual I2S/SPI modules for stereo audio codec support (vs PIC32MX150F128D-I/PL)
- Peripheral Pin Select (PPS) flexibility for layout reuse (vs PIC32MX170F256D-I/PT)
Notes de conception
Place a 0.1 uF ceramic decoupling capacitor as close as possible to every VDD/AVDD pin, and add one 10 uF bulk capacitor per power domain. The 44-QFN package exposes a center thermal pad on the underside; solder it to a continuous ground plane with multiple thermal vias to dissipate up to ~400 mW typical MCU dissipation. USB D+/D- traces should be 90 ohm differential, length-matched, and kept away from switching signals.
Peripheral Pin Select (PPS) mis-mappings are the most common PIC32MX270 bring-up issue. Always configure PPS input/output mapping via unlock sequence (PPSUNLOCK), or peripherals will not appear on the expected pins. Do not assume default pin assignments; verify the PPS table against your schematic before debugging. JTAG pins (TMS/TCK/TDO/TDI) are fixed and NOT remappable.
The PIC32MX270F256D-I/ML has separate AVDD/AVSS analog supply pins that must be tied to VDD/VSS even if the ADC is unused, with their own decoupling. USB applications should connect VUSB3V3 to a regulated 3.3V rail; this pin powers the internal USB transceiver and must remain within 3.0V-3.6V. For low-power modes, the on-chip Voltage Regulator (VCAP) requires a 10 uF capacitor on the VCAP pin for stability.
Informations de conformité
RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable for industrial -I temperature grade; -V grade is the closest automotive/extended option but is not formally AEC-Q100 qualified.