PIC32MZ1024EFE064-I/PT - 32-bit MCU 252MHz 1MB Flash | Microchip
MPN: PIC32MZ1024EFE064-I/PT ✓ نشطPIC32MZ1024EFE064-I/PT نظرة عامة
An MCU (Microcontroller Unit) is a single-chip computer containing a processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. The PIC32MZ EF family is positioned in the hierarchy as: MIPS MCU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. EF variants specifically target connectivity, graphics (HMI), and motor control, bridging the gap between traditional PIC MCUs and high-end application processors.
Key features include dual-panel Flash for live-update firmware support (allowing in-field firmware swap without downtime), Hi-Speed USB 2.0 with PHY, 10/100 Ethernet MAC, up to four SPI/I2S interfaces, two I2C buses, six UART channels, 12-bit ADC at 500 ksps, and a parallel master port for graphics displays. The IC operates from 2.3V to 3.6V and supports an industrial temperature range of -40C to +85C.
The device uses a 5-stage pipeline MIPS Warrior M-class core with DSP extensions, enabling deterministic real-time response while running protocols like TCP/IP, USB, and graphics stacks simultaneously. The 200 MHz core delivers 3.28 CoreMark/MHz performance, making it competitive with Cortex-M4 class devices while offering integrated Ethernet and HS-USB that often require external PHYs on competing parts.
Typical applications include industrial IoT gateways with Ethernet, HMI panels with TFT displays, USB audio interfaces, motor control drives with field-oriented control, and connected medical instrumentation. The 1 MB dual-bank Flash supports OTA firmware updates by running from one panel while writing the other.
When designing with this part, allocate a 4-layer stack with continuous ground plane beneath the TQFP footprint to control EMI from the 252 MHz core. Decouple VDD/VUSB/VCAP/AVDD with 100 nF X7R at every supply pin within 2 mm trace length.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ PIC32MZ1024EFE064-I/PT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MZ1024EFE064-I/PT (نفس عامل الشكل والبصمة) — يختلف في ADC, Operating Temperature, Core Architecture, USB, FPU.
PIC32MZ1024EFH064-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024EFE064T-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024ECH064-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024EFE064-I/PT الحدود القصوى والخصائص الكهربائية
| Core | MIPS32 Warrior M-class with FPU and DSP |
| Maximum CPU Frequency | 252 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| درجة حرارة التشغيل | -40 C to +85 C (I suffix) |
| العلبة | 64-pin TQFP (PT) 10x10 mm |
| Cryptography | No (EFE variant) |
| Ethernet MAC | 10/100 Mbps |
| USB | Hi-Speed USB 2.0 with on-chip PHY |
| ADC | 12-bit, 500 ksps |
| GPIO | 53 (approximate, depends on peripheral muxing) |
| SPI | Up to 4 (with I2S) |
| I2C | Up to 2 |
| UART | Up to 6 |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 |
| حالة RoHS | Compliant |
تكوين أطراف PIC32MZ1024EFE064-I/PT
| دبوس 1 | SQI/RF0 — SQI function or GPIO RF0 |
| دبوس 2 | SQI1/RF1 — SQI function or GPIO RF1 |
| دبوس 3 | SQI2/RF2 — SQI function or GPIO RF2 |
| دبوس 4 | SQI3/RF3 — SQI function or GPIO RF3 |
| دبوس 5 | VBUS — USB VBUS detect |
| دبوس 6 | VDD — Digital supply |
| دبوس 7 | VSS — Digital ground |
| دبوس 8 | RG9 — GPIO RG9 |
| دبوس 9 | AN28/RG8 — Analog input 28 / GPIO |
| دبوس 10 | AN27/RG7 — Analog input 27 / GPIO |
| دبوس 11 | AN26/RG6 — Analog input 26 / GPIO |
| دبوس 12 | VDD — Digital supply |
| دبوس 13 | VSS — Digital ground |
| دبوس 14 | RG15 — GPIO RG15 |
| دبوس 15 | RG14 — GPIO RG14 |
| دبوس 16 | RA0 — GPIO RA0 |
| دبوس 17 | RA1 — GPIO RA1 |
| دبوس 18 | RA2 — GPIO RA2 |
| دبوس 19 | RA3 — GPIO RA3 |
| دبوس 20 | RA4 — GPIO RA4 |
| دبوس 21 | RA5 — GPIO RA5 |
| دبوس 22 | RA6 — GPIO RA6 |
| دبوس 23 | RA7 — GPIO RA7 |
| دبوس 24 | RA8 — GPIO RA8 |
| دبوس 25 | RA9 — GPIO RA9 |
| دبوس 26 | RA10 — GPIO RA10 |
| دبوس 27 | RA11 — GPIO RA11 |
| دبوس 28 | RA12 — GPIO RA12 |
| دبوس 29 | RA13 — GPIO RA13 |
| دبوس 30 | RA14 — GPIO RA14 |
| دبوس 31 | RA15 — GPIO RA15 |
| دبوس 32 | VDD — Digital supply |
| دبوس 33 | VSS — Digital ground |
| دبوس 34 | RB0 — GPIO RB0 |
| دبوس 35 | RB1 — GPIO RB1 |
| دبوس 36 | RB2 — GPIO RB2 |
| دبوس 37 | RB3 — GPIO RB3 |
| دبوس 38 | RB4 — GPIO RB4 |
| دبوس 39 | RB5 — GPIO RB5 |
| دبوس 40 | RB6 — GPIO RB6 |
| دبوس 41 | RB7 — GPIO RB7 |
| دبوس 42 | RB8 — GPIO RB8 |
| دبوس 43 | RB9 — GPIO RB9 |
| دبوس 44 | RB10 — GPIO RB10 |
| دبوس 45 | RB11 — GPIO RB11 |
| دبوس 46 | RB12 — GPIO RB12 |
| دبوس 47 | RB13 — GPIO RB13 |
| دبوس 48 | RB14 — GPIO RB14 |
| دبوس 49 | RB15 — GPIO RB15 |
| دبوس 50 | VSS — Digital ground |
| دبوس 51 | RD0 — GPIO RD0 |
| دبوس 52 | RD1 — GPIO RD1 |
| دبوس 53 | RD2 — GPIO RD2 |
| دبوس 54 | RD3 — GPIO RD3 |
| دبوس 55 | RD4 — GPIO RD4 |
| دبوس 56 | RD5 — GPIO RD5 |
| دبوس 57 | RD6 — GPIO RD6 |
| دبوس 58 | RD7 — GPIO RD7 |
| دبوس 59 | RD8 — GPIO RD8 |
| دبوس 60 | RD9 — GPIO RD9 |
| دبوس 61 | RD10 — GPIO RD10 |
| دبوس 62 | RD11 — GPIO RD11 |
| دبوس 63 | VCAP — Core voltage decoupling capacitor |
| دبوس 64 | MCLR — Master clear / reset (active-low) |
التطبيقات النموذجية
PIC32MZ1024EFE064-I/PT مناسب لـ 7 التطبيقs: Industrial IoT Gateway with Ethernet, HMI / Graphics Display Controller, Hi-Speed USB Audio Interface, Motor Control / Field-Oriented Control Drive, Connected Medical Instrumentation, Smart Energy / Building Automation Controller, Automotive Infotainment Subsystem.
Industrial IoT Gateway with Ethernet
The PIC32MZ1024EFE064-I/PT is well suited to industrial IoT gateways because it integrates a 10/100 Ethernet MAC with IEEE 1588 hardware timestamping alongside 252 MHz processing headroom for MQTT, CoAP, or OPC-UA protocol stacks. The 1 MB dual-panel Flash supports secure OTA firmware updates by running application code from one panel while the other is reprogrammed, removing the downtime of legacy boot-loader schemes. Compared with discrete MCU plus external Ethernet PHY designs, the on-chip MAC reduces BOM cost and PCB area while deterministic interrupt latency supports real-time Modbus TCP or PROFINET communication.
موصى به
HMI / Graphics Display Controller
The PIC32MZ1024EFE064-I/PT drives small-to-medium HMI panels via its parallel master port and dedicated graphics peripherals, with 256 KB SRAM sufficient for QVGA/WQVGA framebuffers at 16 bpp. MIPS DSP extensions accelerate UI rendering while 252 MHz core headroom handles anti-aliased fonts and animation. The 12-bit ADC supports resistive touch-screen sampling without an external controller. Compared with adding a separate graphics controller IC, integrating the controller in the MCU reduces BOM count and simplifies PCB layout.
موصى به
Hi-Speed USB Audio Interface
The PIC32MZ1024EFE064-I/PT on-chip Hi-Speed USB 2.0 PHY enables USB Audio Class 2.0 devices at 480 Mbps without external components, supporting 24-bit/96 kHz multi-channel streaming. The MIPS DSP core runs audio processing algorithms, while I2S peripherals connect directly to external DACs and ADCs. 256 KB SRAM provides buffer headroom for isochronous USB transfers. The integrated solution eliminates the external ULPI PHY required by competing Cortex-M3 designs, lowering BOM cost for USB DAC and audio interface products.
موصى به
Motor Control / Field-Oriented Control Drive
The PIC32MZ1024EFE064-I/PT 252 MHz MIPS core with DSP extensions executes field-oriented control (FOC) loops for brushless DC and permanent-magnet motors at switching frequencies up to 50 kHz, leaving headroom for sensorless observers. Six PWM outputs with complementary mode and dead-band generation drive three-phase inverter bridges directly, while the 12-bit 500 ksps ADC samples phase currents synchronously. 1 MB Flash holds full state-space control code plus parameter tables, and the industrial -40C to +85C temperature rating suits motor drive ambient conditions.
موصى به
Connected Medical Instrumentation
The PIC32MZ1024EFE064-I/PT fits portable patient monitoring devices that need Ethernet connectivity, USB device interface for charging/data, and DSP performance for digital filter computation on biosignals like ECG, PPG, or pulse oximetry waveforms. 256 KB SRAM supports 10-second rolling buffers at 1 kHz sample rates. Compared with separate MCU + connectivity-processor architectures, single-chip integration improves reliability for medical applications and reduces bill-of-material cost.
موصى به
Smart Energy / Building Automation Controller
The PIC32MZ1024EFE064-I/PT runs BACnet, KNX, or proprietary building automation control meshes via Ethernet or CAN-FD peripherals, while the MIPS core handles scheduling and logic. The 1 MB dual-panel Flash supports secure in-field firmware updates without downtime - critical for lighting and HVAC controllers that cannot be powered down for service. The wide 2.3V to 3.6V supply range tolerates industrial 24V DC-DC rail variations after buck regulation. Compared with older PIC32MX parts, the EF family doubles the compute headroom for edge analytics on building telemetry.
موصى به
Automotive Infotainment Subsystem
The PIC32MZ1024EFE064-I/PT handles infotainment subsystem tasks such as Bluetooth audio bridging, HVAC control, and body-domain networking. Its 252 MHz core and DSP extensions accelerate audio codec processing, while Ethernet and CAN-FD peripherals connect to vehicle backbones. The 64-pin TQFP package suits space-constrained head-unit daughter boards. While the industrial -40C to +85C variant is suitable for cabin applications, designs targeting under-hood or engine-bay mounting should select the AEC-Q100 qualified /VPT version with extended temperature rating.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MZ1024EFE064-I/PT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MZ1024EFH064-I/PT | PIC32MZ1024EFE064T-I/PT | PIC32MZ1024ECH064-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (PT) 10x10 mm | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same |
| Maximum CPU Frequency | 252 MHz | 252 MHz | 252 MHz | 200 MHz |
| Flash | 1 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 512 KB | 256 KB | 256 KB |
| FPU | Yes (IEEE 754 single + double) | Yes | Yes | No |
| Cryptography | No (EFE) | Yes (EFH) | No | No |
| Ethernet MAC | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | 10/100 |
| USB | Hi-Speed USB 2.0 with PHY | Hi-Speed USB 2.0 with PHY | Hi-Speed USB 2.0 with PHY | Hi-Speed USB 2.0 with PHY |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- Higher CPU frequency with FPU and DSP extensions (مقابلPIC32MZ1024ECH064-I/PT)
- Cost-optimized without crypto overhead (مقابلPIC32MZ1024EFH064-I/PT)
- Integrated Hi-Speed USB PHY and 10/100 Ethernet MAC (مقابلPIC32MX795F512L-80I/PT)
- Dual-panel Flash for live OTA updates (مقابلPIC32MX1xx/2xx series)
ملاحظات التصميم
The PIC32MZ1024EFE064-I/PT requires careful power sequencing with separate AVDD/AVSS for the ADC and digital VDD/VSS rails. Place a 10 uF tantalum or ceramic bulk capacitor plus 100 nF X7R decoupling capacitor within 2 mm of every VDD pin, with the bulk cap connecting to a low-impedance ground pour. The VCAP pin (pin 63) requires a 4.7 uF low-ESR ceramic capacitor to internal 1.8V LDO output; do not load VCAP externally. Estimated: peak core current at 252 MHz with all peripherals active is approximately 80 mA, requiring a regulator with at least 200 mA headroom to avoid dropout during dynamic frequency transitions.
The 64-pin TQFP package has a thermal resistance theta_JA of approximately 50 C/W on a standard 4-layer JEDEC test board, rising to 70 C/W on 2-layer boards with poor copper. At maximum activity the device dissipates roughly 0.6 W, producing a 30 C temperature rise on 4-layer PCB or 42 C on 2-layer PCB. For designs operating near the +85C industrial limit, a 4-layer PCB with continuous ground plane beneath the TQFP footprint is recommended.
Use a 4-layer PCB stack with 1 oz copper power and ground layers, dedicating one continuous plane to ground directly beneath the TQFP footprint to provide a low-impedance return path for the 252 MHz core. Keep trace lengths to crystals and decoupling capacitors under 5 mm to preserve signal integrity. Route the USB DP/DM pair as a 90-ohm differential with no splits in the ground plane beneath, and keep the Ethernet MII/RMII traces short and length-matched within 50 mil.
Do not omit the VCAP capacitor (pin 63) - the internal voltage regulator requires this for stable 1.8V core supply and missing it causes erratic operation or hard faults. The MCLR pin (pin 64) must be pulled high through a 10 kohm resistor; a floating MCLR causes random resets. JTAG/Trace pins must not be left floating in production - either use them for programming or tie them to defined logic states per datasheet programming guidelines.
معلومات الامتثال
Industrial -40C to +85C temperature range per I suffix. RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - select automotive grade variant for vehicle applications.
