PIC32MZ1024EFE064-I/PT - 32-bit MCU 252MHz 1MB Flash | Microchip
부품 번호: PIC32MZ1024EFE064-I/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.84 | $9.84 |
| 10 | $8.95 | $89.50 |
| 100 | $7.62 | $762.00 |
| 500 | $6.85 | $3,425.00 |
| 1,000 | $6.2 | $6,200.00 |
PIC32MZ1024EFE064-I/PT 개요
An MCU (Microcontroller Unit) is a single-chip computer containing a processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. The PIC32MZ EF family is positioned in the hierarchy as: MIPS MCU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. EF variants specifically target connectivity, graphics (HMI), and motor control, bridging the gap between traditional PIC MCUs and high-end application processors.
Key features include dual-panel Flash for live-update firmware support (allowing in-field firmware swap without downtime), Hi-Speed USB 2.0 with PHY, 10/100 Ethernet MAC, up to four SPI/I2S interfaces, two I2C buses, six UART channels, 12-bit ADC at 500 ksps, and a parallel master port for graphics displays. The IC operates from 2.3V to 3.6V and supports an industrial temperature range of -40C to +85C.
The device uses a 5-stage pipeline MIPS Warrior M-class core with DSP extensions, enabling deterministic real-time response while running protocols like TCP/IP, USB, and graphics stacks simultaneously. The 200 MHz core delivers 3.28 CoreMark/MHz performance, making it competitive with Cortex-M4 class devices while offering integrated Ethernet and HS-USB that often require external PHYs on competing parts.
Typical applications include industrial IoT gateways with Ethernet, HMI panels with TFT displays, USB audio interfaces, motor control drives with field-oriented control, and connected medical instrumentation. The 1 MB dual-bank Flash supports OTA firmware updates by running from one panel while writing the other.
When designing with this part, allocate a 4-layer stack with continuous ground plane beneath the TQFP footprint to control EMI from the 252 MHz core. Decouple VDD/VUSB/VCAP/AVDD with 100 nF X7R at every supply pin within 2 mm trace length.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: PIC32MZ1024EFE064-I/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFE064-I/PT (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Operating Temperature, Core Architecture, USB, FPU.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFH064-I/PT
✅ 드롭인✓ 재고 있음
$7.69 / 개
데이터시트 보기 →PIC32MZ1024EFE064T-I/PT
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →PIC32MZ1024ECH064-I/PT
✅ 드롭인✓ 재고 있음
$7.2 / 개
데이터시트 보기 →PIC32MZ1024EFE064-I/PT 최대 정격 & 전기적 특성
| Core | MIPS32 Warrior M-class with FPU and DSP |
| Maximum CPU Frequency | 252 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (I suffix) |
| 패키지 | 64-pin TQFP (PT) 10x10 mm |
| Cryptography | No (EFE variant) |
| Ethernet MAC | 10/100 Mbps |
| USB | Hi-Speed USB 2.0 with on-chip PHY |
| ADC | 12-bit, 500 ksps |
| GPIO | 53 (approximate, depends on peripheral muxing) |
| SPI | Up to 4 (with I2S) |
| I2C | Up to 2 |
| UART | Up to 6 |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
PIC32MZ1024EFE064-I/PT 핀 구성
| 핀 1 | SQI/RF0 — SQI function or GPIO RF0 |
| 핀 2 | SQI1/RF1 — SQI function or GPIO RF1 |
| 핀 3 | SQI2/RF2 — SQI function or GPIO RF2 |
| 핀 4 | SQI3/RF3 — SQI function or GPIO RF3 |
| 핀 5 | VBUS — USB VBUS detect |
| 핀 6 | VDD — Digital supply |
| 핀 7 | VSS — Digital ground |
| 핀 8 | RG9 — GPIO RG9 |
| 핀 9 | AN28/RG8 — Analog input 28 / GPIO |
| 핀 10 | AN27/RG7 — Analog input 27 / GPIO |
| 핀 11 | AN26/RG6 — Analog input 26 / GPIO |
| 핀 12 | VDD — Digital supply |
| 핀 13 | VSS — Digital ground |
| 핀 14 | RG15 — GPIO RG15 |
| 핀 15 | RG14 — GPIO RG14 |
| 핀 16 | RA0 — GPIO RA0 |
| 핀 17 | RA1 — GPIO RA1 |
| 핀 18 | RA2 — GPIO RA2 |
| 핀 19 | RA3 — GPIO RA3 |
| 핀 20 | RA4 — GPIO RA4 |
| 핀 21 | RA5 — GPIO RA5 |
| 핀 22 | RA6 — GPIO RA6 |
| 핀 23 | RA7 — GPIO RA7 |
| 핀 24 | RA8 — GPIO RA8 |
| 핀 25 | RA9 — GPIO RA9 |
| 핀 26 | RA10 — GPIO RA10 |
| 핀 27 | RA11 — GPIO RA11 |
| 핀 28 | RA12 — GPIO RA12 |
| 핀 29 | RA13 — GPIO RA13 |
| 핀 30 | RA14 — GPIO RA14 |
| 핀 31 | RA15 — GPIO RA15 |
| 핀 32 | VDD — Digital supply |
| 핀 33 | VSS — Digital ground |
| 핀 34 | RB0 — GPIO RB0 |
| 핀 35 | RB1 — GPIO RB1 |
| 핀 36 | RB2 — GPIO RB2 |
| 핀 37 | RB3 — GPIO RB3 |
| 핀 38 | RB4 — GPIO RB4 |
| 핀 39 | RB5 — GPIO RB5 |
| 핀 40 | RB6 — GPIO RB6 |
| 핀 41 | RB7 — GPIO RB7 |
| 핀 42 | RB8 — GPIO RB8 |
| 핀 43 | RB9 — GPIO RB9 |
| 핀 44 | RB10 — GPIO RB10 |
| 핀 45 | RB11 — GPIO RB11 |
| 핀 46 | RB12 — GPIO RB12 |
| 핀 47 | RB13 — GPIO RB13 |
| 핀 48 | RB14 — GPIO RB14 |
| 핀 49 | RB15 — GPIO RB15 |
| 핀 50 | VSS — Digital ground |
| 핀 51 | RD0 — GPIO RD0 |
| 핀 52 | RD1 — GPIO RD1 |
| 핀 53 | RD2 — GPIO RD2 |
| 핀 54 | RD3 — GPIO RD3 |
| 핀 55 | RD4 — GPIO RD4 |
| 핀 56 | RD5 — GPIO RD5 |
| 핀 57 | RD6 — GPIO RD6 |
| 핀 58 | RD7 — GPIO RD7 |
| 핀 59 | RD8 — GPIO RD8 |
| 핀 60 | RD9 — GPIO RD9 |
| 핀 61 | RD10 — GPIO RD10 |
| 핀 62 | RD11 — GPIO RD11 |
| 핀 63 | VCAP — Core voltage decoupling capacitor |
| 핀 64 | MCLR — Master clear / reset (active-low) |
일반적인 애플리케이션
PIC32MZ1024EFE064-I/PT 적합 용도: 7 애플리케이션s: Industrial IoT Gateway with Ethernet, HMI / Graphics Display Controller, Hi-Speed USB Audio Interface, Motor Control / Field-Oriented Control Drive, Connected Medical Instrumentation, Smart Energy / Building Automation Controller, Automotive Infotainment Subsystem.
Industrial IoT Gateway with Ethernet
The PIC32MZ1024EFE064-I/PT is well suited to industrial IoT gateways because it integrates a 10/100 Ethernet MAC with IEEE 1588 hardware timestamping alongside 252 MHz processing headroom for MQTT, CoAP, or OPC-UA protocol stacks. The 1 MB dual-panel Flash supports secure OTA firmware updates by running application code from one panel while the other is reprogrammed, removing the downtime of legacy boot-loader schemes. Compared with discrete MCU plus external Ethernet PHY designs, the on-chip MAC reduces BOM cost and PCB area while deterministic interrupt latency supports real-time Modbus TCP or PROFINET communication.
추천
HMI / Graphics Display Controller
The PIC32MZ1024EFE064-I/PT drives small-to-medium HMI panels via its parallel master port and dedicated graphics peripherals, with 256 KB SRAM sufficient for QVGA/WQVGA framebuffers at 16 bpp. MIPS DSP extensions accelerate UI rendering while 252 MHz core headroom handles anti-aliased fonts and animation. The 12-bit ADC supports resistive touch-screen sampling without an external controller. Compared with adding a separate graphics controller IC, integrating the controller in the MCU reduces BOM count and simplifies PCB layout.
추천
Hi-Speed USB Audio Interface
The PIC32MZ1024EFE064-I/PT on-chip Hi-Speed USB 2.0 PHY enables USB Audio Class 2.0 devices at 480 Mbps without external components, supporting 24-bit/96 kHz multi-channel streaming. The MIPS DSP core runs audio processing algorithms, while I2S peripherals connect directly to external DACs and ADCs. 256 KB SRAM provides buffer headroom for isochronous USB transfers. The integrated solution eliminates the external ULPI PHY required by competing Cortex-M3 designs, lowering BOM cost for USB DAC and audio interface products.
추천
Motor Control / Field-Oriented Control Drive
The PIC32MZ1024EFE064-I/PT 252 MHz MIPS core with DSP extensions executes field-oriented control (FOC) loops for brushless DC and permanent-magnet motors at switching frequencies up to 50 kHz, leaving headroom for sensorless observers. Six PWM outputs with complementary mode and dead-band generation drive three-phase inverter bridges directly, while the 12-bit 500 ksps ADC samples phase currents synchronously. 1 MB Flash holds full state-space control code plus parameter tables, and the industrial -40C to +85C temperature rating suits motor drive ambient conditions.
추천
Connected Medical Instrumentation
The PIC32MZ1024EFE064-I/PT fits portable patient monitoring devices that need Ethernet connectivity, USB device interface for charging/data, and DSP performance for digital filter computation on biosignals like ECG, PPG, or pulse oximetry waveforms. 256 KB SRAM supports 10-second rolling buffers at 1 kHz sample rates. Compared with separate MCU + connectivity-processor architectures, single-chip integration improves reliability for medical applications and reduces bill-of-material cost.
추천
Smart Energy / Building Automation Controller
The PIC32MZ1024EFE064-I/PT runs BACnet, KNX, or proprietary building automation control meshes via Ethernet or CAN-FD peripherals, while the MIPS core handles scheduling and logic. The 1 MB dual-panel Flash supports secure in-field firmware updates without downtime - critical for lighting and HVAC controllers that cannot be powered down for service. The wide 2.3V to 3.6V supply range tolerates industrial 24V DC-DC rail variations after buck regulation. Compared with older PIC32MX parts, the EF family doubles the compute headroom for edge analytics on building telemetry.
추천
Automotive Infotainment Subsystem
The PIC32MZ1024EFE064-I/PT handles infotainment subsystem tasks such as Bluetooth audio bridging, HVAC control, and body-domain networking. Its 252 MHz core and DSP extensions accelerate audio codec processing, while Ethernet and CAN-FD peripherals connect to vehicle backbones. The 64-pin TQFP package suits space-constrained head-unit daughter boards. While the industrial -40C to +85C variant is suitable for cabin applications, designs targeting under-hood or engine-bay mounting should select the AEC-Q100 qualified /VPT version with extended temperature rating.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFE064-I/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFH064-I/PT | PIC32MZ1024EFE064T-I/PT | PIC32MZ1024ECH064-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (PT) 10x10 mm | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same |
| Maximum CPU Frequency | 252 MHz | 252 MHz | 252 MHz | 200 MHz |
| Flash | 1 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 512 KB | 256 KB | 256 KB |
| FPU | Yes (IEEE 754 single + double) | Yes | Yes | No |
| Cryptography | No (EFE) | Yes (EFH) | No | No |
| Ethernet MAC | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | 10/100 |
| USB | Hi-Speed USB 2.0 with PHY | Hi-Speed USB 2.0 with PHY | Hi-Speed USB 2.0 with PHY | Hi-Speed USB 2.0 with PHY |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- Higher CPU frequency with FPU and DSP extensions (vs PIC32MZ1024ECH064-I/PT)
- Cost-optimized without crypto overhead (vs PIC32MZ1024EFH064-I/PT)
- Integrated Hi-Speed USB PHY and 10/100 Ethernet MAC (vs PIC32MX795F512L-80I/PT)
- Dual-panel Flash for live OTA updates (vs PIC32MX1xx/2xx series)
설계 노트
The PIC32MZ1024EFE064-I/PT requires careful power sequencing with separate AVDD/AVSS for the ADC and digital VDD/VSS rails. Place a 10 uF tantalum or ceramic bulk capacitor plus 100 nF X7R decoupling capacitor within 2 mm of every VDD pin, with the bulk cap connecting to a low-impedance ground pour. The VCAP pin (pin 63) requires a 4.7 uF low-ESR ceramic capacitor to internal 1.8V LDO output; do not load VCAP externally. Estimated: peak core current at 252 MHz with all peripherals active is approximately 80 mA, requiring a regulator with at least 200 mA headroom to avoid dropout during dynamic frequency transitions.
The 64-pin TQFP package has a thermal resistance theta_JA of approximately 50 C/W on a standard 4-layer JEDEC test board, rising to 70 C/W on 2-layer boards with poor copper. At maximum activity the device dissipates roughly 0.6 W, producing a 30 C temperature rise on 4-layer PCB or 42 C on 2-layer PCB. For designs operating near the +85C industrial limit, a 4-layer PCB with continuous ground plane beneath the TQFP footprint is recommended.
Use a 4-layer PCB stack with 1 oz copper power and ground layers, dedicating one continuous plane to ground directly beneath the TQFP footprint to provide a low-impedance return path for the 252 MHz core. Keep trace lengths to crystals and decoupling capacitors under 5 mm to preserve signal integrity. Route the USB DP/DM pair as a 90-ohm differential with no splits in the ground plane beneath, and keep the Ethernet MII/RMII traces short and length-matched within 50 mil.
Do not omit the VCAP capacitor (pin 63) - the internal voltage regulator requires this for stable 1.8V core supply and missing it causes erratic operation or hard faults. The MCLR pin (pin 64) must be pulled high through a 10 kohm resistor; a floating MCLR causes random resets. JTAG/Trace pins must not be left floating in production - either use them for programming or tie them to defined logic states per datasheet programming guidelines.
규정 준수 정보
Industrial -40C to +85C temperature range per I suffix. RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - select automotive grade variant for vehicle applications.
