R7F7010333AFP#KA3 - RH850/F1L 32-Bit MCU, 1MB Flash, 176-LFQFP | Renesas
MPN: R7F7010333AFP#KA3 ✓ نشطR7F7010333AFP#KA3 نظرة عامة
An automotive microcontroller (MCU) is a specialized microcontroller optimized for the harsh electrical and thermal environment of a vehicle. The RH850/F1L family sits within the broader Renesas RH850 family, which itself belongs to the 32-bit automotive MCU category — a segment that also includes Freescale/NXP MPC56xx, Infineon Aurix TC2xx, and Texas Instruments TMS570. RH850 cores are based on the V850E2M architecture extended with an FPU and lockstep dual-core options for ASIL-D applications.
Key features of the R7F7010333AFP#KA3 include 1 MB of code Flash, 80 MHz maximum CPU clock, hardware multiplier and divider, multiple 16-bit timers, A/D converters, and a multi-channel CAN controller compliant with ISO 11898. The 176-pin LFQFP exposes the full peripheral set, supporting simultaneous operation of multiple serial interfaces and PWM outputs required in body control modules and HVAC systems.
The RH850G3K core uses a 32-bit RISC architecture with 5-stage pipeline and hardware multiply-accumulate unit, delivering deterministic interrupt response. The on-chip Flash is single-voltage programmable and supports background operation (BGOP) and rewrite-in-rewrite without CPU stall — important for OBD-II compliant boot loaders.
Typical applications include automotive BCM (body control modules), HVAC control, instrument clusters, electric power steering (EPS) sensor nodes, transmission ECUs, and battery management slaves. The automotive-grade temperature range and CAN connectivity make it well suited to chassis networks.
Design consideration: when migrating from previous F1L variants, verify peripheral pinout mapping and ECLK/EMCLK clock source assignments against the user manual. The internal regulator requires careful VDD/VSS decoupling layout — at least four 0.1 µF X7R ceramic capacitors placed symmetrically around the package.
This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the Renesas datasheet itself.
بدائل مباشرة لـ R7F7010333AFP#KA3 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
R7F7010334AFP#KA3
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
R7F7010303AFP#KA3
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
R7F7010333AFP#AA3
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
R7F7010333AFP#KA4
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
R7F7010333AFP-C#KA4
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
R7F7010333AFP#KA3 الحدود القصوى والخصائص الكهربائية
| Core | RH850G3K (32-bit RISC) |
| Family | RH850/F1L |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| العلبة | 176-LFQFP (24x24 mm) |
| Operating Voltage | 3.0 V to 5.5 V (single supply) |
| نطاق درجة حرارة التشغيل | -40°C to +105°C (automotive grade) |
| CAN Interface | Multiple CAN channels (ISO 11898) |
| Timer/Counter | Multiple 16-bit/32-bit timers |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
دليل تكوين أطراف R7F7010333AFP#KA3 176-lfqfp (24x24 mm)
تكوين الأطراف لـ R7F7010333AFP#KA3 (حزمة 176-lfqfp (24x24 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ R7F7010333AFP#KA3.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
R7F7010333AFP#KA3 مناسب لـ 7 التطبيقs: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster MCU, Battery Management Slave (BMS), Electric Power Steering (EPS) Sensor Node, Transmission Gearbox ECU Slave, DC Motor / Pump Controller Node.
Automotive Body Control Module (BCM)
The R7F7010333AFP#KA3 fits BCM designs where multiple CAN buses, LIN nodes, and PWM-driven actuators must be coordinated in real time. Its 80 MHz RH850G3K core serves 10-25 kHz control loops with deterministic interrupt latency, and the 176-pin LFQFP exposes enough GPIO and timer channels to drive lighting, mirror, and wiper sub-functions. Source: Renesas RH850/F1L datasheet typical use-case diagram. Compared to NXP S32K1 in the same BCM class, the R7F7010333AFP#KA3 offers higher peripheral density per pin.
موصى به
HVAC Control Module
HVAC ECUs blend sensor inputs (temperature, pressure, blower RPM) with actuator drive (PWM stepper motors, solenoid valves). The R7F7010333AFP#KA3 with its on-chip A/D converters, timers, and CAN channels fits this exact workload, and its 1 MB Flash accommodates the lookup-table-rich control firmware plus bootloader. The 176-LFQFP package provides the heat-dissipation performance required for under-dash mounting where ambient can reach 70°C.
موصى به
Instrument Cluster MCU
Mid-range instrument clusters need a reliable MCU to drive stepper gauge motors, read CAN vehicle-speed messages, and run the odometer / service-interval logic. The R7F7010333AFP#KA3's on-chip data Flash supports OBD-II compliant rewriteable service records, while its timer resources generate the precise stepper pulse trains. Operating over -40°C to +105°C, it tolerates the extreme thermal environment of a dashboard.
موصى به
Battery Management Slave (BMS)
Distributed BMS slave nodes monitor 8-16 cells per module, balancing them and forwarding cell voltages over isolated CAN. The R7F7010333AFP#KA3 with its on-chip 12-bit A/D (subject to datasheet verification), CAN, and 1 MB Flash is well matched to 12-16 cell slave boards. The 176-LFQFP provides the GPIO and timer density for cell-balancing FET drive and current-sense sampling.
موصى به
Electric Power Steering (EPS) Sensor Node
EPS torque/angle sensor ECUs run high-rate (1 kHz) torque loop sensing and CAN-connected reporting to the central ECU. The R7F7010333AFP#KA3 combines 80 MHz CPU clock, fast analog front-end, and automotive-grade temperature range needed for EPS reliability. The package's exposed-pad thermal path handles motor-bay heat soak. Note: this is a sensor-node role, not the central EPS-CPU which requires ASIL-D.
موصى به
Transmission Gearbox ECU Slave
Inside automatic transmission ECUs, MCUs manage shift solenoids, pressure sensors, and torque-estimator interfaces. The R7F7010333AFP#KA3 with 1 MB Flash provides headroom for adaptive shift-maps and CAN links to the central powertrain ECU. Its 176-LFQFP footprint supports the timer count demanded by multi-solenoid PWM drive.
موصى به
DC Motor / Pump Controller Node
Water pumps, oil pumps, and auxiliary drives across vehicle subsystems often use a local MCU to apply soft-start, fault detection, and CAN diagnostics. The R7F7010333AFP#KA3 with on-chip timers and CAN fits a smart pump controller. Its LFQFP-176 footprint is large for a pump but enables BOM consolidation where multiple pumps share the same BOM.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ R7F7010333AFP#KA3 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | R7F7010334AFP#KA3 | R7F7010303AFP#KA3 | R7F7010333AFP#AA3 | R7F7010333AFP#KA4 | R7F7010333AFP-C#KA4 |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFQFP (24x24 mm) | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same | 176-LFQFP (24x24 mm) - same |
| Core | RH850G3K | RH850G3K | RH850G3K | RH850G3K | RH850G3K | RH850G3K |
| Maximum CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Family | RH850/F1L | RH850/F1L | RH850/F1L | RH850/F1L | RH850/F1L | RH850/F1L |
| Operating Temperature | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
أبرز الفروقات
- Same-footprint variant for scalability (مقابلR7F7010334AFP#KA3)
- Operational characteristic identical to #AA3 (مقابلR7F7010333AFP#AA3)
- Variant screen tier availability (مقابلR7F7010333AFP-C#KA4)
ملاحظات التصميم
Place at least four 0.1 µF X7R ceramic decoupling capacitors close to the VDD/VSS pins, plus a 4.7 µF bulk capacitor near the internal regulator output pin. The RH850/F1L requires strict power-up sequencing per the hardware user manual. Estimated: P_total ~ 0.5 W typical at 80 MHz, 5 V supply.
Route crystal traces (XIN/XOUT) symmetrically and shield them with a ground guard ring. Keep the analog AVDD/AVSS pair separated from noisy digital returns and place the AVSS pin capacitor within 3 mm of the AVSS pin. Avoid routing high-current motor drive traces parallel to analog inputs.
Common pitfalls: (1) programming the wrong flash rewrite mode will lock the MCU during normal operation — always enable BGOP before software reset; (2) using incorrect ECLK pin function for CAN sync — verify ECLK source in the CKSC_ICTL register; (3) ordering MPN #AA3 vs #KA3 by mistake — verify the exact suffix against the BOM before placing orders.
معلومات الامتثال
Renesas automotive-grade F1L family parts are AEC-Q100 qualified. RoHS compliant and lead-free per DigiKey listing.
