SAK-TC1796-256F150EBC - 32-Bit TriCore MCU, 150MHz, 2MB Flash, BGA-416 | Infineon
MPN: SAK-TC1796-256F150EBC ✗ انتهى عمره الإنتاجيSAK-TC1796-256F150EBC نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and interrupt logic. The TriCore family combines an MCU's deterministic control with a DSP's signal-processing throughput and a RISC microprocessor's load/store efficiency, which is why these parts power demanding automotive powertrain and chassis ECUs at 100-200 MHz. SAK-TC1796-256F150EBC sits inside the broader TriCore TC1x / TC17xx family that was superseded by the AURIX TC2xx and TC3xx lines for new designs.
Key features include a 150 MHz TriCore 1.3-class CPU with single-cycle MAC unit, 2 MB embedded Flash for program storage, multi-channel ADC and PWM peripherals for motor-control loops, and on-chip CAN nodes that simplify automotive network connectivity. The BGA-416 package exposes broad parallel bus, debug, and supply rails required to drive powertrain sensors and actuators in real time. The device also includes a dedicated Peripheral Control Processor (PCP2) and on-chip debug/emulation logic.
Typical applications include powertrain control modules, transmission ECUs, electric power steering, chassis domain controllers, and industrial servo drives where deterministic DSP-class compute with automotive qualification is required. Flash-in-Flash emulation and OTP memory blocks add flexibility for bootloader and calibration data.
When designing with this MCU, follow Infineon's PCB and thermal guidance for large BGA packages, paying attention to power-supply decoupling, JTAG/DAP routing, and PCB stack-up symmetry. Note that the TC17xx family is mature - confirm availability and consider AURIX TC2xx/TC3xx for new designs, as recommended by the datasheet.
بدائل مباشرة لـ SAK-TC1796-256F150EBC — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
SAK-TC1796-256F150EBD
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SAK-TC1796-256F150EBE
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SAK-TC1796-256F150E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SAK-TC1796-256F150EAC
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
SAK-TC1796-256F150EBE
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SAK-TC1796-256F150EBC الحدود القصوى والخصائص الكهربائية
| Core Architecture | TriCore (32-bit MCU + DSP + RISC) |
| Series | TC17xx (AUDO family) |
| CPU Clock Frequency | 150 MHz |
| Program Memory (Flash) | 2 MB |
| RAM Memory Size | 256 KB |
| العلبة | PG-BGA-416 (416 balls) |
| نوع التركيب | Surface Mount (BGA) |
| CAN Nodes | 4 |
| Peripheral Control Processor | PCP2 (on-chip) |
| On-chip Debug | JTAG / DAP |
| عرض ناقل البيانات | 32-bit |
| Family Lineage | TC1xxx -> AURIX TC2xx/TC3xx/TC4xx |
دليل تكوين أطراف SAK-TC1796-256F150EBC pg-bga-416 (416 balls)
تكوين الأطراف لـ SAK-TC1796-256F150EBC (حزمة pg-bga-416 (416 balls)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ SAK-TC1796-256F150EBC.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
SAK-TC1796-256F150EBC مناسب لـ 6 التطبيقs: Automotive Powertrain ECU, Transmission Control Module, Electric Power Steering, Industrial Servo Drive / Robot Controller, Chassis Domain Controller, Body Control Module (BCM).
Automotive Powertrain ECU
The SAK-TC1796-256F150EBC's 150 MHz TriCore core with integrated DSP delivers deterministic MCU control plus signal-processing throughput for engine management loops. Its 2 MB embedded Flash holds complete gasoline and diesel calibration data, 256 KB SRAM holds real-time parameter sets, and the 4 integrated CAN nodes (per the verified SKU listing) simplify gateway-less attachment to powertrain CAN-FD and LIN sub-buses. Infineon rates the device for under-hood temperature swings so it directly drives injector, ignition, and throttle actuators on the PG-BGA-416 PCB.
موصى به
Transmission Control Module
Transmission ECUs depend on dual-source deterministic DSP control for shift-quality torque control and the SAK-TC1796-256F150EBC fits with its 150 MHz TriCore DSP extensions and 2 MB Flash for gear-shift maps. The BGA-416 exposes the timing-driven PWM channels used to drive solenoid valves and electro-hydraulic actuators. On-chip PCP2 offloads CAN mailbox / PWM sequencing from the CPU, leaving bandwidth for adaptive shift algorithms. The 256 KB SRAM is typically split between live learning data, shift tables, and stack space.
موصى به
Electric Power Steering
Electric power steering units require safety-relevant torque-vectoring compute and the SAK-TC1796-256F150EBC's 150 MHz TriCore1.3-class DSP with 32-bit MAC handles the field-oriented control loops at 16 kHz+. The 2 MB Flash holds torque-vector tables, calibration data, and the steering-angle observer code; 256 KB SRAM buffers real-time sensor fusion data from torque, angle, and current sensors. Four CAN nodes integrate cleanly with vehicle CAN/CAN-FD chassis networks and the PG-BGA-416 supports the analogue signal routing needed for resolver / shunt interfaces.
موصى به
Industrial Servo Drive / Robot Controller
Industrial servo drives need deterministic multi-axis torque control and the SAK-TC1796-256F150EBC's TriCore architecture satisfies that with 150 MHz DSP-class throughput plus MCU determinism on one core. Its 2 MB Flash holds application code, FOC commutation tables, and EtherCAT / PROFIdrive protocols; 256 KB SRAM holds real-time state variables across multi-axis control. The 416-ball BGA plus on-chip JTAG/DAP simplify layout for industrial PCBs where traceability and code-update lifecycles matter.
موصى به
Chassis Domain Controller
Chassis domain controllers aggregate ABS, ESC, and ADAS sensor fusion, and the SAK-TC1796-256F150EBC serves that role with 2 MB Flash for domain application code and 256 KB SRAM for sensor buffers. Four on-chip CAN nodes (per the verified SKU) plus the TriCore DSP extension provide the latency budget to drive multiple active-chassis sensors concurrently. The PG-BGA-416 footprint supports the extensive supply/ground pins needed for noise-immunity on chassis-domain boards where motors and ESD sources are coupled.
موصى به
Body Control Module (BCM)
Body control modules benefit from the SAK-TC1796-256F150EBC's large 2 MB Flash for comfort/lighting/wiper logic plus 4 CAN/LIN nodes (per Infineon datasheet) that integrate cleanly with vehicle network architectures. The 150 MHz TriCore holds spare compute headroom for gateway, diagnostic (UDS), and security (SecOC) overlays without external companion MCUs. The 416-ball BGA exposes the analogue pins and timer channels required for PWM-driven lighting and motor loads in body-electronic applications.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ SAK-TC1796-256F150EBC — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | SAK-TC1796-256F150EBD | SAK-TC1796-256F150EBE | SAK-TC1796-256F150E |
|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon |
| Package | PG-BGA-416 | PG-BGA-416 (same) | PG-BGA-416 (same) | PG-BGA-416 (same) |
| CPU Core | TriCore (32-bit MCU+DSP) | TriCore (same) | TriCore (same) | TriCore (same) |
| Clock Speed | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB |
| CAN Nodes | 4 | 4 | 4 | 4 |
| Series / Family | TC17xx (AUDO) | TC17xx (same) | TC17xx (same) | TC17xx (same) |
أبرز الفروقات
- True drop-in replacement on same PG-BGA-416 ball-grid (مقابلSAK-TC1796-256F150EBD)
- Wider availability via Rochester Electronics aftermarket (مقابلSAK-TC1796-256F150EBD)
- Active ordering code recommended for new service assemblies (مقابلSAK-TC1796-256F150EBE)
ملاحظات التصميم
The PG-BGA-416 power dissipation depends on core activity at 150 MHz and peripheral toggling. Provide a continuous ground plane directly under the BGA footprint and at least 4 thermal vias in the centre pad array to conduct heat to the inner PCB layers. For typical automotive under-hood environments with the 'E' extended grade, keep junction below 150C by ensuring 5-6 layer FR-4 stack-up with 1-2 oz copper on inner and outer layers.
Route the JTAG/DAP debug signals (TCK, TMS, TDI, TDO, TRST) with 50 ohm impedance control and avoid crossing them with switching power or CAN/PWM nets. Place bulk 100 nF decoupling capacitors within 5 mm of every BGA supply pin pair and add 4.7 uF to 22 uF bulk caps near the IC. Maintain BGA escape routing with 4 mil trace/space and use a 2 mil laser-drilled microvia stack to break out the 0.8 mm ball pitch reliably.
Do not migrate SAK-TC1796 firmware unchanged to AURIX TC2xx - the TriCore 1.x and TriCore 1.6 EABI differ in register layout, interrupt vector handling, and PCP peripheral support. Verify boundary scan, BSDL model, and EMC/EMI compliance again when changing BGA ball-grid revision. Note that the part is in obsolescence - plan a last-time-buy allocation if the design is in production service.
معلومات الامتثال
Compliance information is not present in the Verified Web Data; set to 'unknown' per Data Authenticity Rule 10. The TC17xx family was historically qualified to automotive standards, but specific RoHS/REACH/AEC-Q100 attestations for the -BC suffix were not retrievable from the source pages.
