XC6SLX45-3CSG324C - Spartan-6 LX FPGA | AMD | 324-BGA
MPN: XC6SLX45-3CSG324C ✓ نشطXC6SLX45-3CSG324C نظرة عامة
An FPGA is a reconfigurable digital semiconductor whose logic, interconnect, and memory resources can be programmed after manufacture. Within the semiconductor hierarchy, the Spartan-6 LX FPGA sits below FPGA, above programmable logic, and combines configurable logic blocks, programmable interconnect, block RAM, DSP resources, and clock-management circuitry. This integration makes it suitable for designs requiring parallel processing, real-time control, flexible interfaces, or field-updatable logic without redesigning a fixed-function ASIC.
The XC6SLX45-3CSG324C provides 43,661 logic cells, 218 I/O, and an internal frequency listed as 500 MHz. Its dedicated digital clock managers and PLLs support generated, phase-shifted, and synchronized clock architectures. The 1.14 V to 1.26 V core-supply range supports low-voltage designs, while the 324-ball CSBGA offers a compact, high-pin-count footprint for advanced bridging, control, and interface applications.
The device is built on 45 nm process technology and is positioned as a cost-conscious Spartan-6 solution for high-volume embedded systems. Programmable logic resources can implement parallel datapaths, protocol bridges, control engines, and signal processing, while dedicated hard resources offload clocking and frequently used memory operations. Engineers still must complete system-level timing closure, power budgeting, and I/O assignment against the selected design.
Typical applications include automotive infotainment, industrial automation, consumer video processing, embedded communications, and general-purpose bridging. In an automotive infotainment design, the FPGA can combine multiple video interfaces, audio routing, and control logic. In industrial equipment, it can coordinate sensors, motion-control logic, and fieldbus adapters while supporting updateable configurations after deployment.
For new layouts, follow the AMD Spartan-6 package pinout file and the device-specific PCB design guidance when assigning power, ground, configuration pins, and differential I/O. BGA assembly requires thermal-via and pad-stack planning, while the 1.14 V to 1.26 V core rail needs sequencing and decoupling appropriate to the selected power architecture. Verify all pin assignments and constraints in the final Vivado design.
This product record combines the verified device identity, electrical limits, package details, speed-grade context, and same-family replacement candidates with practical selection and layout guidance. It also distinguishes same-footprint alternatives by speed grade and temperature suffix, helping engineers identify candidates that require qualification rather than assuming that every CSG324 variant is interchangeable.
بدائل مباشرة لـ XC6SLX45-3CSG324C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC6SLX45-3CSG324C (نفس عامل الشكل والبصمة) — يختلف في Device Type, Logic Cells, Speed Grade, Core Supply Voltage, Operating Temperature.
XC6SLX45-3CSG324I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45T-3CSG324C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX45-2CSG324C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-2CSG324I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-L1CSG324I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX45-3CSG324C الحدود القصوى والخصائص الكهربائية
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 43,661 cells |
| User I/O | 218 I/O |
| Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Speed Grade | -3 |
| درجة حرارة التشغيل | 0°C to 85°C |
| Package Type | CSBGA-324 |
| Package Dimensions | 15 mm × 15 mm |
| Ball Pitch | 0.80 mm |
| عدد الأطراف | 324 pins |
| Process Technology | 45 nm |
| Clock Management | DCM and PLL |
| نوع التركيب | Surface Mount |
| Lead-Free Package | Yes |
دليل تكوين أطراف XC6SLX45-3CSG324C yes
تكوين الأطراف لـ XC6SLX45-3CSG324C (حزمة yes). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC6SLX45-3CSG324C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC6SLX45-3CSG324C مناسب لـ 6 التطبيقs: Automotive Infotainment, Industrial Automation and Motion Control, Video Processing and Display Bridging, Embedded Communications and Protocol Bridging, Test and Measurement Equipment, High-Volume Consumer and Embedded Products.
Automotive Infotainment
The XC6SLX45-3CSG324C fits automotive infotainment systems that must combine video interfaces, control logic, and real-time signal routing in one programmable device. Its 43,661 logic cells and 218 I/O provide substantial parallel-processing capacity, while the -3 grade targets the highest Spartan-6 LX performance class. The commercial 0°C to 85°C range is suitable when the enclosure remains within that limit. Designers should use the exact CSG324 pin file, confirm transient and EMC requirements, and reserve an I industrial-temperature variant when the specified environment extends below 0°C.
موصى به
Industrial Automation and Motion Control
For industrial automation, the XC6SLX45-3CSG324C can coordinate sensors, actuators, machine vision, and deterministic control logic through a single Spartan-6 LX implementation. The 43,661 available logic cells allow parallel datapaths and protocol handling, while DCMs and PLLs support multiple generated and phase-aligned clocks. Its -3 performance grade is useful when control loops or interface converters need the highest available Spartan-6 speed class. The 1.14 V to 1.26 V core range requires careful rail design, and a complete production design should re-run timing and power analysis after any lower-speed substitution.
موصى به
Video Processing and Display Bridging
The XC6SLX45-3CSG324C is well suited to video timing generation, pixel-format conversion, scaler control, and multiple display-interface bridges because parallel logic can be implemented efficiently in FPGA fabric. Its 218 user I/O provide substantial connectivity for external video devices and control signals, and its dedicated clock-management resources can support related pixel and streaming clocks. The -3 speed grade favors timing-sensitive pipelines compared with lower Spartan-6 grades. Engineers should constrain input and output timing carefully and use the CSG324 package assignments to distinguish supply, clock, configuration, and user I/O balls.
موصى به
Embedded Communications and Protocol Bridging
The XC6SLX45-3CSG324C can implement multiple communication adapters and protocol converters in parallel, making it useful in embedded gateways, test equipment, and control systems. The 43,661 logic cells support transmit and receive pipelines, while the 218 I/O accommodate byte-wide buses, serial transceivers, status signals, and memory interfaces. DCM and PLL resources help produce clock domains required by independently timed interfaces. Because protocol timing may depend on device speed grade, an XC6SLX45-2CSG324I substitution should be accepted only after Vivado timing closure confirms sufficient margin at the required I/O rates.
موصى به
Test and Measurement Equipment
A programmable FPGA is useful in test and measurement equipment for acquisition sequencing, pattern generation, timing control, and real-time analysis. The XC6SLX45-3CSG324C combines 43,661 logic cells with 218 I/O, allowing multiple instrument channels and control paths to share a compact device. Its -3 speed grade supports the highest Spartan-6 LX performance class, while PLLs and DCMs simplify the creation of related clock signals. For laboratory-grade designs, pay particular attention to analog-interface isolation outside the FPGA, clean power rails, deterministic clocking, and completion of the manufacturer's recommended BGA layout and decoupling checks.
موصى به
High-Volume Consumer and Embedded Products
The XC6SLX45-3CSG324C supports programmable control and interface functions in high-volume consumer and embedded products where lifecycle flexibility can reduce redesign costs. Its 45 nm Spartan-6 LX implementation offers 43,661 logic cells, 218 I/O, dedicated memory, and clocking in one compact CSBGA-324 package. The commercial-temperature C option covers 0°C to 85°C for indoor products, while the -3 grade preserves maximum timing performance. Developers should verify configuration memory, startup behavior, board density, and cost-effective manufacturing rules, and confirm that a lower-speed alternative still meets all external interface timing requirements.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC6SLX45-3CSG324C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC6SLX45-3CSG324I | XC6SLX45T-3CSG324C | XC6SLX45-2CSG324C | XC6SLX45-2CSG324I | XC6SLX45-L1CSG324I |
|---|---|---|---|---|---|---|
| Package | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 | -3 | -2 | -2 | -1L |
| Temperature Designation | C commercial grade | I industrial grade | C commercial grade with T suffix | C commercial grade | I industrial grade | I industrial grade |
أبرز الفروقات
- Highest-performance Spartan-6 LX speed option (مقابلXC6SLX45-2CSG324C)
- Commercial-temperature configuration matches indoor and controlled environments (مقابلXC6SLX45-3CSG324I)
- Full performance grade without the low-power -1L designation (مقابلXC6SLX45-L1CSG324I)
- Established 218-I/O integration in a compact 15 mm by 15 mm package (مقابلXC6SLX45-2CSG324I)
ملاحظات التصميم
Use the device-specific CSG324 package file and AMD package drawing for every ball assignment; a generic 324-ball symbol is not sufficient for production routing. The 0.80 mm pitch requires escaped routing with the selected board stack-up, and power, ground, configuration, clock, and user-I/O balls must retain the manufacturer's layer and via guidance. Complete drill, annular-ring, solder-mask, and assembly checks against the selected PCB process before releasing fabrication files.
Plan the 1.14 V to 1.26 V core rail together with all required auxiliary rails rather than treating the core range as a complete power specification. Use the manufacturer's recommended decoupling and sequencing arrangement, place high-frequency bypass capacitance close to the relevant supply balls, and preserve continuous return paths through the BGA array. Verify voltage drop, transient response, plane resonance, and startup behavior across temperature and worst-case load conditions.
Keep sensitive clock and high-speed interface routing short, with return paths referenced by an uninterrupted ground plane. Apply the Spartan-6 recommended device placement and thermal-via pattern to improve heat transfer from the CSBGA-324. Avoid placing noisy sources near clock inputs and sensitive configuration or differential pairs. After PCB routing, run Vivado timing analysis with the actual board timing constraints and inspect signal-integrity, crosstalk, and via-stack effects.
Do not approve a replacement solely because its package designation is CSG324. Speed-grade changes can invalidate timing closure, temperature suffix changes can affect environmental margins, and the T ordering suffix requires manufacturer-specific interpretation. For every proposed substitution, rerun Vivado implementation, compare utilization and power, verify configuration compatibility, and revalidate the PCB ball map before changing the released BOM.
معلومات الامتثال
The package is identified as lead-free. The device is a 45 nm FPGA and is not identified as an AEC-Q100 automotive-qualified ordering option. RoHS, REACH, halogen-free, and conflict-minerals status require confirmation from the current manufacturer compliance documentation.
