XC6SLX45-3CSG324C - Spartan-6 LX FPGA | AMD | 324-BGA
N.º de pieza: XC6SLX45-3CSG324C ✓ ActivoXC6SLX45-3CSG324C Descripción general
An FPGA is a reconfigurable digital semiconductor whose logic, interconnect, and memory resources can be programmed after manufacture. Within the semiconductor hierarchy, the Spartan-6 LX FPGA sits below FPGA, above programmable logic, and combines configurable logic blocks, programmable interconnect, block RAM, DSP resources, and clock-management circuitry. This integration makes it suitable for designs requiring parallel processing, real-time control, flexible interfaces, or field-updatable logic without redesigning a fixed-function ASIC.
The XC6SLX45-3CSG324C provides 43,661 logic cells, 218 I/O, and an internal frequency listed as 500 MHz. Its dedicated digital clock managers and PLLs support generated, phase-shifted, and synchronized clock architectures. The 1.14 V to 1.26 V core-supply range supports low-voltage designs, while the 324-ball CSBGA offers a compact, high-pin-count footprint for advanced bridging, control, and interface applications.
The device is built on 45 nm process technology and is positioned as a cost-conscious Spartan-6 solution for high-volume embedded systems. Programmable logic resources can implement parallel datapaths, protocol bridges, control engines, and signal processing, while dedicated hard resources offload clocking and frequently used memory operations. Engineers still must complete system-level timing closure, power budgeting, and I/O assignment against the selected design.
Typical applications include automotive infotainment, industrial automation, consumer video processing, embedded communications, and general-purpose bridging. In an automotive infotainment design, the FPGA can combine multiple video interfaces, audio routing, and control logic. In industrial equipment, it can coordinate sensors, motion-control logic, and fieldbus adapters while supporting updateable configurations after deployment.
For new layouts, follow the AMD Spartan-6 package pinout file and the device-specific PCB design guidance when assigning power, ground, configuration pins, and differential I/O. BGA assembly requires thermal-via and pad-stack planning, while the 1.14 V to 1.26 V core rail needs sequencing and decoupling appropriate to the selected power architecture. Verify all pin assignments and constraints in the final Vivado design.
This product record combines the verified device identity, electrical limits, package details, speed-grade context, and same-family replacement candidates with practical selection and layout guidance. It also distinguishes same-footprint alternatives by speed grade and temperature suffix, helping engineers identify candidates that require qualification rather than assuming that every CSG324 variant is interchangeable.
Alternativas directas para XC6SLX45-3CSG324C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC6SLX45-3CSG324C (mismo factor de forma y huella) — difiere en Device Type, Logic Cells, Speed Grade, Core Supply Voltage, Operating Temperature.
XC6SLX45-3CSG324I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC6SLX45T-3CSG324C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC6SLX45-2CSG324C
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Ver hoja de datos →XC6SLX45-2CSG324I
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Ver hoja de datos →XC6SLX45-L1CSG324I
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XC6SLX45-3CSG324C Valores máximos y características eléctricas
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 43,661 cells |
| User I/O | 218 I/O |
| Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Speed Grade | -3 |
| Temperatura de funcionamiento | 0°C to 85°C |
| Package Type | CSBGA-324 |
| Package Dimensions | 15 mm × 15 mm |
| Ball Pitch | 0.80 mm |
| Recuento de pines | 324 pins |
| Process Technology | 45 nm |
| Clock Management | DCM and PLL |
| Tipo de montaje | Surface Mount |
| Lead-Free Package | Yes |
Guía de configuración de pines de XC6SLX45-3CSG324C yes
Configuración de pines para XC6SLX45-3CSG324C (encapsulado yes). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC6SLX45-3CSG324C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC6SLX45-3CSG324C es adecuado para 6 aplicacións: Automotive Infotainment, Industrial Automation and Motion Control, Video Processing and Display Bridging, Embedded Communications and Protocol Bridging, Test and Measurement Equipment, High-Volume Consumer and Embedded Products.
Automotive Infotainment
The XC6SLX45-3CSG324C fits automotive infotainment systems that must combine video interfaces, control logic, and real-time signal routing in one programmable device. Its 43,661 logic cells and 218 I/O provide substantial parallel-processing capacity, while the -3 grade targets the highest Spartan-6 LX performance class. The commercial 0°C to 85°C range is suitable when the enclosure remains within that limit. Designers should use the exact CSG324 pin file, confirm transient and EMC requirements, and reserve an I industrial-temperature variant when the specified environment extends below 0°C.
Recomendado
Industrial Automation and Motion Control
For industrial automation, the XC6SLX45-3CSG324C can coordinate sensors, actuators, machine vision, and deterministic control logic through a single Spartan-6 LX implementation. The 43,661 available logic cells allow parallel datapaths and protocol handling, while DCMs and PLLs support multiple generated and phase-aligned clocks. Its -3 performance grade is useful when control loops or interface converters need the highest available Spartan-6 speed class. The 1.14 V to 1.26 V core range requires careful rail design, and a complete production design should re-run timing and power analysis after any lower-speed substitution.
Recomendado
Video Processing and Display Bridging
The XC6SLX45-3CSG324C is well suited to video timing generation, pixel-format conversion, scaler control, and multiple display-interface bridges because parallel logic can be implemented efficiently in FPGA fabric. Its 218 user I/O provide substantial connectivity for external video devices and control signals, and its dedicated clock-management resources can support related pixel and streaming clocks. The -3 speed grade favors timing-sensitive pipelines compared with lower Spartan-6 grades. Engineers should constrain input and output timing carefully and use the CSG324 package assignments to distinguish supply, clock, configuration, and user I/O balls.
Recomendado
Embedded Communications and Protocol Bridging
The XC6SLX45-3CSG324C can implement multiple communication adapters and protocol converters in parallel, making it useful in embedded gateways, test equipment, and control systems. The 43,661 logic cells support transmit and receive pipelines, while the 218 I/O accommodate byte-wide buses, serial transceivers, status signals, and memory interfaces. DCM and PLL resources help produce clock domains required by independently timed interfaces. Because protocol timing may depend on device speed grade, an XC6SLX45-2CSG324I substitution should be accepted only after Vivado timing closure confirms sufficient margin at the required I/O rates.
Recomendado
Test and Measurement Equipment
A programmable FPGA is useful in test and measurement equipment for acquisition sequencing, pattern generation, timing control, and real-time analysis. The XC6SLX45-3CSG324C combines 43,661 logic cells with 218 I/O, allowing multiple instrument channels and control paths to share a compact device. Its -3 speed grade supports the highest Spartan-6 LX performance class, while PLLs and DCMs simplify the creation of related clock signals. For laboratory-grade designs, pay particular attention to analog-interface isolation outside the FPGA, clean power rails, deterministic clocking, and completion of the manufacturer's recommended BGA layout and decoupling checks.
Recomendado
High-Volume Consumer and Embedded Products
The XC6SLX45-3CSG324C supports programmable control and interface functions in high-volume consumer and embedded products where lifecycle flexibility can reduce redesign costs. Its 45 nm Spartan-6 LX implementation offers 43,661 logic cells, 218 I/O, dedicated memory, and clocking in one compact CSBGA-324 package. The commercial-temperature C option covers 0°C to 85°C for indoor products, while the -3 grade preserves maximum timing performance. Developers should verify configuration memory, startup behavior, board density, and cost-effective manufacturing rules, and confirm that a lower-speed alternative still meets all external interface timing requirements.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC6SLX45-3CSG324C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC6SLX45-3CSG324I | XC6SLX45T-3CSG324C | XC6SLX45-2CSG324C | XC6SLX45-2CSG324I | XC6SLX45-L1CSG324I |
|---|---|---|---|---|---|---|
| Package | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 | CSBGA-324 |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 | -3 | -2 | -2 | -1L |
| Temperature Designation | C commercial grade | I industrial grade | C commercial grade with T suffix | C commercial grade | I industrial grade | I industrial grade |
Diferenciadores clave
- Highest-performance Spartan-6 LX speed option (frente a XC6SLX45-2CSG324C)
- Commercial-temperature configuration matches indoor and controlled environments (frente a XC6SLX45-3CSG324I)
- Full performance grade without the low-power -1L designation (frente a XC6SLX45-L1CSG324I)
- Established 218-I/O integration in a compact 15 mm by 15 mm package (frente a XC6SLX45-2CSG324I)
Notas de diseño
Use the device-specific CSG324 package file and AMD package drawing for every ball assignment; a generic 324-ball symbol is not sufficient for production routing. The 0.80 mm pitch requires escaped routing with the selected board stack-up, and power, ground, configuration, clock, and user-I/O balls must retain the manufacturer's layer and via guidance. Complete drill, annular-ring, solder-mask, and assembly checks against the selected PCB process before releasing fabrication files.
Plan the 1.14 V to 1.26 V core rail together with all required auxiliary rails rather than treating the core range as a complete power specification. Use the manufacturer's recommended decoupling and sequencing arrangement, place high-frequency bypass capacitance close to the relevant supply balls, and preserve continuous return paths through the BGA array. Verify voltage drop, transient response, plane resonance, and startup behavior across temperature and worst-case load conditions.
Keep sensitive clock and high-speed interface routing short, with return paths referenced by an uninterrupted ground plane. Apply the Spartan-6 recommended device placement and thermal-via pattern to improve heat transfer from the CSBGA-324. Avoid placing noisy sources near clock inputs and sensitive configuration or differential pairs. After PCB routing, run Vivado timing analysis with the actual board timing constraints and inspect signal-integrity, crosstalk, and via-stack effects.
Do not approve a replacement solely because its package designation is CSG324. Speed-grade changes can invalidate timing closure, temperature suffix changes can affect environmental margins, and the T ordering suffix requires manufacturer-specific interpretation. For every proposed substitution, rerun Vivado implementation, compare utilization and power, verify configuration compatibility, and revalidate the PCB ball map before changing the released BOM.
Información de cumplimiento
The package is identified as lead-free. The device is a 45 nm FPGA and is not identified as an AEC-Q100 automotive-qualified ordering option. RoHS, REACH, halogen-free, and conflict-minerals status require confirmation from the current manufacturer compliance documentation.
