XC7A200T-2SB484I - 215K Artix-7 FPGA | AMD | Industrial
MPN: XC7A200T-2SB484I ✓ نشطXC7A200T-2SB484I نظرة عامة
An FPGA is a semiconductor whose digital logic, interconnects, memory, and I/O behavior are configured after manufacture. The Artix-7 family occupies the hierarchy between lower-capacity programmable-logic devices and larger Zynq-class adaptive SoCs. It is intended for designs requiring substantially more parallel processing and storage than a microcontroller while avoiding the cost and complexity of a larger FPGA platform. Configuration logic determines how the internal resources implement a completed digital design.
The XC7A200T provides 215,360 logic cells and 13,455,360 RAM bits, making it suitable for parallel image processing, industrial control, communications, instrumentation, and embedded signal-processing systems. The device exposes 285 general-purpose I/O and includes four high-speed serial transceiver channels in the associated 484-ball family information. Its 28 nm process technology supports a balance of performance, capacity, and power efficiency. Exact clock, transceiver, and I/O performance limits must be selected from the appropriate speed-grade and temperature tables in the manufacturer datasheet.
The SB484 package is a 19 x 19 mm, 0.80 mm-pitch FBGA with 484 bottom-side terminals. Package construction, power delivery, and exposed thermal behavior are critical in an FPGA design because dynamic power depends on configuration, clock activity, I/O toggling, and resource utilization. Decoupling, controlled rise time, and heat removal should be planned with the same care as high-speed signal routing. The -2 speed grade should not be assumed to satisfy -1, -2L, or -3 timing requirements in an existing design.
Typical applications include industrial machine vision, high-speed data acquisition, serial-interface aggregation, programmable logic controllers, test equipment, and embedded control systems. A 215K-cell device can consolidate parallel pipelines and interface logic that would otherwise require several discrete devices. Its block RAM supports packet buffering and data-plane storage, while DSP slices accelerate fixed-point filtering, correlation, and waveform-processing tasks. The available serial transceivers can reduce the need for external line drivers in suitable links.
The primary design tradeoff is package migration. XC7A200T ordering codes containing a different package suffix can represent the same base FPGA but not necessarily the same footprint, height, ball map, or power architecture. For a drop-in decision, compare the exact package drawing, pinout file, voltage rails, decoupling requirements, configuration interface, and thermal design rather than relying only on the 484-ball ball count.
This product record combines the verified manufacturer-family characteristics, package information, searchable ordering-code references, and design-oriented selection guidance. It also distinguishes true same-footprint options from superficially similar Artix-7 devices, helping engineers evaluate capacity, speed grade, temperature grade, package construction, and board-level compatibility before committing to a replacement or second-source strategy.
بدائل مباشرة لـ XC7A200T-2SB484I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC7A200T-2SB484I (نفس عامل الشكل والبصمة) — يختلف في Package.
XC7A200T-2SB484C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC7A200T-2SBG484I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC7A200T-2FBG484I
✅ بديل مباشر✗ غير متوفر
$89.15 / وحدة
عرض ورقة البيانات ←XC7A200T-2SB484I الحدود القصوى والخصائص الكهربائية
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 215,360 cells |
| RAM Bits | 13,455,360 bits |
| General-Purpose I/O | 285 I/Os |
| Process Technology | 28 nm |
| Speed Grade | -2 |
| Temperature Grade | Industrial, I suffix |
| العلبة | 484-FBGA, lidless FCBGA |
| Package Dimensions | 19 x 19 mm |
| Package Pitch | 0.80 mm |
| Ball Count | 484 terminals |
| DSP Slices | 740 DSP slices |
| High-Speed Transceiver Channels | 4 GTP channels |
| Core Supply | 1 V |
دليل تكوين أطراف XC7A200T-2SB484I 0.80 mm
تكوين الأطراف لـ XC7A200T-2SB484I (حزمة 0.80 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC7A200T-2SB484I.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC7A200T-2SB484I مناسب لـ 6 التطبيقs: Industrial Machine Vision, High-Speed Data Acquisition, Programmable Automation Controller, Communications and Protocol Aggregation, Test and Measurement Instrumentation, Embedded Signal Processing.
Industrial Machine Vision
The XC7A200T-2SB484I fits industrial vision systems that need parallel pixel processing and deterministic control in one programmable device. Its 215,360 logic cells and 740 DSP slices can support image preprocessing, filtering, thresholding, and feature extraction, while 13,455,360 RAM bits provide line and frame-buffer capacity. The 285 general-purpose I/Os are useful for camera interface timing, encoders, and digital control. Designers should pipeline timing-critical image paths and use the SB484 package pinout, power rails, decoupling network, and thermal design from AMD documentation.
موصى به
High-Speed Data Acquisition
The XC7A200T-2SB484I is suitable for multichannel acquisition and real-time processing where parallel conversion, buffering, and analysis must share a common timing domain. Its 285 I/Os can connect digital converters and interface logic, while 13,455,360 RAM bits support sample buffering and block processing. The 740 DSP slices can accelerate filtering, correlation, and interpolation. Clocking architecture becomes critical: constrain timing-critical paths, use dedicated clock resources where appropriate, and verify that every acquisition interface and memory interface meets the selected -2 speed-grade limits.
موصى به
Programmable Automation Controller
The XC7A200T-2SB484I can consolidate deterministic machine control, communication adaptation, and safety-adjacent logic isolation in a compact FPGA. The large cell count supports parallel motion-control sequencing, while DSP resources can process position feedback and condition-monitoring signals. Block RAM supports protocol and diagnostic data storage, and the 285 I/Os provide connectivity for encoders, resolvers, sensors, actuators, and field buses. The industrial I grade is relevant to factory environments, although the complete machine still requires separate system qualification and protective shutdown logic.
موصى به
Communications and Protocol Aggregation
The XC7A200T-2SB484I can consolidate several serial and packet-processing functions when a design needs programmable throughput and flexible interface logic. Its four GTP channels provide high-speed serial resources for appropriate links, while 215,360 logic cells and 13,455,360 RAM bits support framing, queues, protocol conversion, and test logic. Designers should use clock-domain-crossing structures for asynchronous interfaces, apply device-specific timing constraints, and check the SB484 transceiver pin assignments against the selected board schematic.
موصى به
Test and Measurement Instrumentation
The XC7A200T-2SB484I suits instrumentation that combines wide parallel data capture, pattern generation, real-time analysis, and a compact control interface. Its 285 I/Os can service multi-channel digital stimulus and response logic, while block RAM stores captured waveforms and DSP slices execute filters, correlation, and interpolation. A practical implementation should partition the design into clocked acquisition, processing, and interface domains, preserve timing margin through pipelining, and use the AMD package and power guidance to prevent supply-noise or thermal problems during sustained operation.
موصى به
Embedded Signal Processing
The XC7A200T-2SB484I provides enough parallel logic, RAM, and DSP capacity for local real-time processing of sensor data without relying on a separate processor for every pipeline. The 740 DSP slices can implement fixed-point filters and transforms, while 13,455,360 RAM bits accommodate sample histories and intermediate data. Its 285 I/Os support sensor, ADC, DAC, and digital-interface connections. Engineers should select fixed-point widths carefully, pipeline arithmetic to meet clock targets, and validate the final design against timing, power, and operating-temperature limits for the -2 industrial device.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC7A200T-2SB484I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC7A200T-2SB484C | XC7A200T-2SBG484I | XC7A200T-2FBG484I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 484-FBGA, SB484 | 484-FBGA, SB484 | 484-FBGA, SBG484 | 484-FBGA, FBG484 |
| Logic Cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells |
| RAM Bits | 13,455,360 bits | 13,455,360 bits | 13,455,360 bits | 13,455,360 bits |
| General-Purpose I/O | 285 I/Os | 285 I/Os | 285 I/Os | 285 I/Os |
| DSP Slices | 740 DSP slices | 740 DSP slices | 740 DSP slices | 740 DSP slices |
| Speed Grade | -2 | -2 | -2 | -2 |
| Temperature Grade | Industrial (I) | Commercial (C) | Industrial (I) | Industrial (I) |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm |
| Price | Request a Quote | Request a Quote | Request a Quote | Request a Quote |
أبرز الفروقات
- Industrial temperature designation (مقابلXC7A200T-2SB484C)
- Exact SB484 package-code alignment (مقابلXC7A200T-2SBG484I)
- Exact package-code and family continuity (مقابلXC7A200T-2FBG484I)
ملاحظات التصميم
Treat the SB484 footprint as a complete power-and-signal layout rather than a generic 484-ball BGA. Use the AMD SB484 package drawing and pinout file to assign every supply, ground, configuration, clock, transceiver, and user I/O ball. Place the required bulk and high-frequency decoupling capacitors according to the manufacturer power architecture, keep loop areas small, and route the configuration signals to avoid contention during startup.
Estimated thermal design should begin with the implementation-specific FPGA power report because configured logic, switching I/O, and GTP activity can materially change dissipation. Multiply estimated junction-temperature rise by the applicable package thermal resistance and include board-copper and airflow effects. Verify the result against the manufacturer maximum junction temperature and use added copper or forced airflow when the worst-case operating condition lacks margin.
Do not reuse an SB484 layout for SBG484 or FBG484 without a ball-by-ball comparison. Package code changes can alter ball mapping, package height, thermal behavior, and power connectivity even when the device family and nominal ball count remain unchanged. Compare the AMD package pinout files, then rerun high-speed transceiver, clock, and I/O signal-integrity analysis if any ball assignment changes.
A common error is treating XC7A200T-2SB484C as an unrestricted substitute for the industrial I version because the base device and package code match. The temperature-grade change can invalidate environmental assumptions even though the logic resources are identical. Another common error is selecting by logic-cell count alone; confirm speed grade, temperature suffix, package dimensions, pinout, and intended supply conditions.
معلومات الامتثال
The listed Artix-7 packaging information mentions Pb-free package availability, but no exact RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals declaration for XC7A200T-2SB484I appears in the cited source content.
