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XC7A200T-2FBG484I - Artix-7 FPGA 740K Logic Cells | AMD Xilinx

Name: XC7A200T-2FBG484I
Brand: AMD Xilinx
Price: 495.00 USD
Availability: InStock

MPN: XC7A200T-2FBG484I ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.0V Vdss FBG484 (484-ball FBGA) Package -2 Speed

$495 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$495	$495.00
10	$445.5	$4,455.00
100	$396	$39,600.00
500	$356.4	$178,200.00
1,000	$316.8	$316,800.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7A200T-2FBG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7A200T-1FBG484I

AMD

Artix-7 · 740K · 215K · 13 Mb · 740 · 10 · 285 · 0.95V to 1.05V

✓ 99,999 In Stock

$147 / Unit

View Datasheet →

XC7A200T-2FBG484C

AMD

Artix-7 · 740K · 215K · 13 Mb · 10.3 Mb · 740 · 16 (up to 6.6 Gbps) · 10

✓ 99,999 In Stock

$320 / Unit

View Datasheet →

XC7A200T-3FBG484I

Same logic and package, faster -3 speed grade

📋 Reference alternative (not in catalog)

XC7A200T-2FBG484I Maximum Ratings & Electrical Characteristics

Family	Artix-7
Logic Cells	740K
Logic Slices	215,360
Block RAM	13 Mb
DSP Slices	740
Transceivers	16 (up to 6.6 Gb/s)
I/O Pins	500
Package	FBG484 (484-ball FBGA)
Speed Grade	-2
Temperature Range	-40°C to +100°C (industrial)
Core Voltage	1.0V
Process Technology	28nm HKMG
PCIe Blocks	1 (Gen2 x8)
Ethernet MACs	4 (10/100/1000)
XADC	1 (12-bit, 1 MSPS)
Configuration	SRAM-based, supports partial reconfiguration

XC7A200T-2FBG484I Pin Configuration

Pin A1	IO_L1P_T0_100 — I/O pin, Bank 100, differential pair P
Pin A2	IO_L1N_T0_100 — I/O pin, Bank 100, differential pair N
Pin B1	IO_L2P_T0_100 — I/O pin, Bank 100, differential pair P
Pin B2	IO_L2N_T0_100 — I/O pin, Bank 100, differential pair N
Pin C1	IO_L3P_T0_100 — I/O pin, Bank 100, differential pair P
Pin C2	IO_L3N_T0_100 — I/O pin, Bank 100, differential pair N
Pin D1	IO_L4P_T0_100 — I/O pin, Bank 100, differential pair P
Pin D2	IO_L4N_T0_100 — I/O pin, Bank 100, differential pair N
Pin E1	VCCINT — Core voltage 1.0V
Pin E2	GND — Ground
Pin F1	VCCAUX — Auxiliary voltage 1.8V
Pin F2	GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7A200T-2FBG484I is suitable for 6 applications: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, High-Performance Computing (HPC) Acceleration, Communications Infrastructure, Aerospace and Defense.

📡

Software-Defined Radio (SDR)

The XC7A200T-2FBG484I is ideal for SDR platforms due to its 740 DSP slices and 16 high-speed transceivers. In a typical SDR, the FPGA handles digital down-conversion (DDC), channel filtering, and modulation/demodulation. The DSP slices implement FIR filters and FFTs, while the transceivers interface with RF front-ends via JESD204B or LVDS. The 13 Mb Block RAM supports large sample buffers and coefficient storage. Compared to ASICs, the FPGA allows reconfiguration for multiple waveforms, making it versatile for military and amateur radio applications. Power consumption is manageable with the 28nm process, and the industrial temperature range supports deployment in field environments.

Recommended

AD9361 (RF transceiver interfacing via JESD204B) LMK04828 (Clock jitter cleaner for transceivers)

💊

Medical Imaging

In medical imaging systems like ultrasound and CT scanners, the XC7A200T-2FBG484I accelerates image processing algorithms. The 740 DSP slices perform real-time filtering, beamforming, and image enhancement. The high I/O count (500 pins) connects to multiple ADC/DAC channels, while the Block RAM buffers image frames. The FPGA's parallel processing capability reduces latency compared to sequential processors, enabling real-time imaging. The industrial temperature range ensures reliability in clinical environments. Designers can implement custom processing pipelines in Vivado, optimizing for power and performance. The -2 speed grade provides sufficient clock rates for high-resolution imaging without excessive power draw.

Recommended

ADS5263 (Quad-channel ADC for ultrasound) DAC5682Z (Dual-channel DAC for signal generation)

🏭

Industrial Motor Control

The XC7A200T-2FBG484I is well-suited for advanced motor control in industrial automation. Its DSP slices implement complex control algorithms like field-oriented control (FOC) and space-vector modulation (SVM) with high precision. The FPGA's deterministic timing ensures consistent PWM generation, improving motor efficiency and reducing torque ripple. The 500 I/O pins interface with encoders, current sensors, and gate drivers. The industrial temperature range (-40°C to +100°C) is critical for factory environments. Compared to MCUs, the FPGA offers lower latency and higher reliability, making it ideal for safety-critical applications. The device supports multiple motor axes in a single chip, reducing system cost and complexity.

Recommended

ADS7953 (ADC for current/voltage sensing) ISO7741 (Digital isolator for gate driver interface)

🖥️

High-Performance Computing (HPC) Acceleration

In HPC, the XC7A200T-2FBG484I accelerates compute-intensive workloads such as genomics, financial modeling, and data analytics. The 740 DSP slices and 13 Mb Block RAM enable efficient implementation of custom arithmetic units and data pipelines. The FPGA can be used as a co-processor alongside CPUs, offloading parallel tasks. The PCIe Gen2 block provides a high-bandwidth host interface, while the transceivers enable high-speed inter-FPGA communication. The -2 speed grade balances performance and power, making it suitable for power-constrained data centers. Designers can use High-Level Synthesis (HLS) in Vivado to accelerate development. The industrial temperature range is not required for data centers, but the commercial variant (XC7A200T-2FBG484C) is available for such applications.

Recommended

DDR4 SDRAM (External memory for data buffering) PCIe Switch (Host interface expansion)

🌐

Communications Infrastructure

The XC7A200T-2FBG484I is used in LTE/5G base stations, network switches, and routers. Its 16 transceivers support CPRI, JESD204B, and 10GbE protocols, enabling high-speed backhaul and fronthaul interfaces. The DSP slices handle channel coding, modulation, and beamforming algorithms. The FPGA's reconfigurability allows support for multiple standards (LTE, 5G NR) on the same hardware. The 500 I/O pins connect to PHYs, MACs, and memory. The industrial temperature range is essential for outdoor base station equipment. Compared to ASICs, the FPGA offers flexibility for evolving standards, reducing time-to-market. The -2 speed grade provides sufficient performance for 5G NR requirements.

Recommended

AD9371 (Integrated transceiver for base station) SFP+ Modules (Optical transceivers for backhaul)

✈️

Aerospace and Defense

In aerospace and defense, the XC7A200T-2FBG484I is used in radar, electronic warfare, and secure communications systems. The FPGA's high DSP throughput enables real-time signal processing for target detection and jamming. The industrial temperature range and robust packaging meet military environmental standards. The device supports bitstream encryption for security, protecting intellectual property. The 16 transceivers interface with high-speed ADCs and DACs, while the 500 I/O pins connect to sensors and actuators. The FPGA's reconfigurability allows mission-specific updates without hardware changes. The -2 speed grade provides a balance of performance and power, critical for airborne platforms. Radiation-tolerant variants are available for space applications, but this standard part is suitable for ground and airborne systems.

Recommended

ADC12DJ3200 (High-speed ADC for radar) DAC38RF82 (RF DAC for waveform generation)

Recommended Products Summary

AD9361 RF transceiver interfacing via JESD204B Used in: Software-Defined Radio (SDR) LMK04828 Clock jitter cleaner for transceivers Used in: Software-Defined Radio (SDR) ADS5263 Quad-channel ADC for ultrasound Used in: Medical Imaging DAC5682Z Dual-channel DAC for signal generation Used in: Medical Imaging ADS7953 ADC for current/voltage sensing Used in: Industrial Motor Control ISO7741 Digital isolator for gate driver interface Used in: Industrial Motor Control DDR4 SDRAM External memory for data buffering Used in: High-Performance Computing (HPC) Acceleration PCIe Switch Host interface expansion Used in: High-Performance Computing (HPC) Acceleration AD9371 Integrated transceiver for base station Used in: Communications Infrastructure SFP+ Modules Optical transceivers for backhaul Used in: Communications Infrastructure ADC12DJ3200 High-speed ADC for radar Used in: Aerospace and Defense DAC38RF82 RF DAC for waveform generation Used in: Aerospace and Defense

What is the logic capacity of XC7A200T-2FBG484I?

The XC7A200T-2FBG484I contains 740K logic cells, 215,360 logic slices, and 13 Mb of Block RAM. According to the AMD Xilinx Artix-7 data sheet (DS181), this makes it one of the largest devices in the Artix-7 family, suitable for complex digital designs.

What is the price of XC7A200T-2FBG484I?

As of 2026-08-04, the XC7A200T-2FBG484I is priced at approximately $495.00 for single-unit quantities, with volume pricing dropping to $316.80 at 1000 units. Prices are indicative from distributor listings and may vary by supplier and availability.

Where can I buy XC7A200T-2FBG484I?

The XC7A200T-2FBG484I can be purchased from authorized distributors such as DigiKey and Mouser Electronics. As of 2026-08-04, both distributors list the part as active, and you can check real-time stock and pricing on their websites.

What is the lead time for XC7A200T-2FBG484I?

The typical lead time for XC7A200T-2FBG484I is 12-16 weeks from order placement, as it is a high-density FPGA with complex manufacturing. However, lead times can fluctuate based on global supply chain conditions; check with distributors for current estimates.

Is XC7A200T-2FBG484I in stock?

Stock availability for XC7A200T-2FBG484I varies by distributor. As of 2026-08-04, DigiKey and Mouser may have limited stock; it is recommended to check their websites for real-time inventory and lead times.

XC7A200T-2FBG484I vs XC7A200T-1FBG484I - which is better for high-speed designs?

The XC7A200T-2FBG484I has a -2 speed grade, which provides faster logic and I/O performance compared to the -1 speed grade of the XC7A200T-1FBG484I. For high-speed designs requiring maximum clock frequencies, the -2 variant is superior, though it may consume slightly more power.

What is the difference between XC7A200T-2FBG484I and XC7A200T-2FBG676I?

The XC7A200T-2FBG484I and XC7A200T-2FBG676I share the same logic resources (740K cells) but differ in package and I/O count. The FBG484 package has 500 I/O pins, while the FBG676 package offers 500 I/O pins as well, but with a larger ball count for improved thermal and routing. The FBG676 is physically larger and may be easier to route in complex designs.

When should I choose XC7A200T-2FBG484I over XC7A200T-2FBG676I?

Choose the XC7A200T-2FBG484I when board space is constrained and you need a compact footprint with 500 I/O pins. The FBG484 package is smaller than the FBG676, making it suitable for space-limited applications. If you require more routing layers or better thermal performance, the FBG676 may be preferable.

What is the best drop-in replacement for XC7A200T-2FBG484I?

The XC7A200T-2FBG484I has several drop-in replacements in the same FBG484 package, including the XC7A200T-1FBG484I (same logic, slower speed grade) and the XC7A200T-3FBG484I (same logic, faster speed grade). These are pin-compatible and can be swapped without PCB changes, though speed grade differences affect performance.

Can XC7A200T-1FBG484I replace XC7A200T-2FBG484I?

Yes, the XC7A200T-1FBG484I is a drop-in replacement for the XC7A200T-2FBG484I in terms of package and pinout, but it has a slower -1 speed grade. This means maximum clock frequencies will be lower, which may impact timing closure in high-speed designs. Verify your design's timing requirements before substituting.

Where can I download the XC7A200T-2FBG484I datasheet PDF?

The official datasheet for XC7A200T-2FBG484I is the Artix-7 FPGA Data Sheet (DS181), available for download from the AMD Xilinx website at https://www.xilinx.com/support/documentation/data_sheets/ds181_Artix_7_Data_Sheet.pdf. This document contains full specifications, pinout, and electrical characteristics.

Where can I find the XC7A200T-2FBG484I pinout?

The pinout for XC7A200T-2FBG484I is provided in the AMD Xilinx Artix-7 FPGA Package Pinout File, available on the Xilinx website. The FBG484 package pinout lists all 484 balls with their functions, including I/O, power, ground, and configuration pins.

What is the maximum clock frequency of XC7A200T-2FBG484I?

The maximum clock frequency of XC7A200T-2FBG484I depends on the design and resource usage. According to the Artix-7 data sheet, the -2 speed grade supports clock frequencies up to 628 MHz for logic and 1.25 Gb/s for I/O. Actual achievable frequencies depend on routing and logic depth.

What are the power supply requirements for XC7A200T-2FBG484I?

The XC7A200T-2FBG484I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO depending on I/O banks (typically 1.2V to 3.3V). Proper power sequencing is required, with VCCINT and VCCAUX ramping up before VCCO. Refer to the Artix-7 data sheet for detailed specifications.

Is XC7A200T-2FBG484I suitable for software-defined radio (SDR) applications?

Yes, the XC7A200T-2FBG484I is well-suited for SDR due to its 740 DSP slices and 16 high-speed transceivers, enabling digital down/up conversion and high-throughput baseband processing. The 13 Mb of Block RAM supports large filter coefficients and buffering, making it a popular choice for SDR platforms.

What is the thermal resistance of XC7A200T-2FBG484I?

The thermal resistance (theta_JA) of the XC7A200T-2FBG484I in the FBG484 package is approximately 8.4°C/W under typical airflow conditions. For high-power designs, consider adding a heatsink or forced airflow to keep junction temperature within the industrial range of -40°C to +100°C.

Does XC7A200T-2FBG484I support partial reconfiguration?

Yes, the XC7A200T-2FBG484I supports partial reconfiguration, allowing specific regions of the FPGA to be reprogrammed while the rest continues operating. This is useful for applications requiring dynamic updates, such as adaptive signal processing or firmware upgrades without system downtime.

What development tools are compatible with XC7A200T-2FBG484I?

The XC7A200T-2FBG484I is fully supported by AMD Xilinx Vivado Design Suite (HLx editions) and ISE Design Suite. Vivado is the recommended tool for new designs, offering synthesis, implementation, and debugging capabilities. The device is also supported by Vitis for embedded software development.

What is the lifecycle status of XC7A200T-2FBG484I?

As of 2026-08-04, the XC7A200T-2FBG484I is in active production with no announced end-of-life (EOL) plans. AMD Xilinx continues to support the Artix-7 family, and the device is widely available from distributors.

Is XC7A200T-2FBG484I RoHS compliant?

Yes, the XC7A200T-2FBG484I is RoHS compliant, as are all AMD Xilinx products. It is also lead-free and halogen-free, meeting current environmental regulations. For detailed compliance information, refer to the product's environmental data sheet.

Engineering reference data for XC7A200T-2FBG484I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7A200T-2FBG484I when you need a high-density FPGA with industrial temperature range and balanced performance. It is ideal for applications requiring 740K logic cells, 16 transceivers, and 500 I/O pins in a compact FBG484 package. If you require higher clock speeds, consider the -3 speed grade (XC7A200T-3FBG484I), but be aware of increased power consumption. For cost-sensitive designs with commercial temperature requirements, the XC7A200T-2FBG484C offers the same logic at a lower price. If you need more I/O or better thermal performance, the FBG676 package variant (XC7A200T-2FBG676I) provides the same logic with a larger footprint. All alternatives are drop-in compatible in terms of package and pinout, allowing easy substitution without PCB redesign.

Comparison with Alternatives

Parameter	This Product	XC7A200T-1FBG484I	XC7A200T-3FBG484I	XC7A200T-2FBG484C
Package	FBG484	FBG484 - same	FBG484 - same	FBG484 - same
Logic Cells	740K	740K	740K	740K
Speed Grade	-2	-1	-3	-2
Temperature Range	-40°C to +100°C (industrial)	-40°C to +100°C (industrial)	-40°C to +100°C (industrial)	0°C to +85°C (commercial)
Block RAM	13 Mb	13 Mb	13 Mb	13 Mb
DSP Slices	740	740	740	740
Transceivers	16	16	16	16
I/O Pins	500	500	500	500

Key Differentiators

Industrial temperature range (vs XC7A200T-2FBG484C)
Balanced -2 speed grade (vs XC7A200T-1FBG484I)
Same package and pinout (vs XC7A200T-2FBG676I)

Design Notes

The XC7A200T-2FBG484I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO depending on I/O standards. Use low-dropout regulators (LDOs) or DC-DC converters with proper decoupling. Place 100nF and 10uF capacitors near each power pin. Follow the power sequencing requirements in the Artix-7 data sheet: VCCINT and VCCAUX must ramp up before VCCO. Use a power monitor like the TI UCD90120A for sequencing and monitoring.

The FBG484 package has a theta_JA of approximately 8.4°C/W. For high-utilization designs, power dissipation can exceed 10W, leading to junction temperatures above 100°C. Use a heatsink or forced airflow to maintain junction temperature within the industrial range. Consider using the commercial variant (XC7A200T-2FBG484C) if the operating environment is 0°C to +85°C, as it may have different thermal characteristics. Perform thermal simulation early in the design phase.

For high-speed transceivers, use controlled impedance traces (e.g., 100 ohm differential) and minimize via stubs. Place transceiver power supply decoupling capacitors close to the pins. For the 500 I/O pins, use a multi-layer PCB with dedicated power and ground planes. Follow the PCB design guidelines in UG483 (Artix-7 PCB Design Guide) for optimal signal integrity. Use ground vias around high-speed differential pairs to reduce crosstalk.