XC7Z045-2FF676I - 350K Zynq SoC in 676-FCBGA | AMD
MPN: XC7Z045-2FF676I ✓ نشطXC7Z045-2FF676I نظرة عامة
A Zynq-7000 SoC is a heterogeneous programmable system-on-chip, combining an FPGA fabric with a hard processor system. It occupies the FPGA & CPLD category while also serving as a processor-centric embedded platform. This integration allows software developers to execute operating-system and application code while hardware engineers implement parallel interfaces, accelerators, protocol logic, and real-time control directly in the programmable fabric.
The XC7Z045 device provides 350K logic cells and an 800 MHz dual-core ARM Cortex-A9 processor. Its integrated FPGA resources support customizable hardware data paths, while the processor subsystem handles sequential software workloads. The supplied distributor records identify the device as a 32-bit RISC system-on-chip with 1 V operation and a 676-pin FCBGA package. The FFG676I ordering designation also identifies the industrial-temperature and package configuration used for this part.
The architecture is particularly useful when a design requires both high-level control and deterministic hardware assistance. Parallel processing implemented in the FPGA can accelerate functions such as data filtering, packet handling, image preprocessing, or interface bridging, while the ARM cores manage control flow and application services. Designers can partition a design between software and programmable logic according to latency, throughput, flexibility, and power constraints.
Typical uses include industrial automation, embedded vision, communications infrastructure, test and measurement, defense-related processing, and high-performance embedded control. The 27 x 27 mm FCBGA package supports compact module-level integration but requires careful PCB layout, power delivery, thermal analysis, and BGA assembly capabilities. The component is suitable for designs that benefit from combining embedded Linux or bare-metal software with dedicated FPGA logic.
A critical implementation consideration is that the 676-ball FCBGA requires a qualified high-density board stack-up, appropriate escape routing, and power and ground planes that satisfy the Zynq power-supply requirements. Pin assignments, decoupling, configuration interface, memory connections, and high-speed routing must follow the AMD Zynq-7000 design guidance rather than general BGA conventions.
This page consolidates verified distributor and manufacturer information, identifies supported same-footprint alternatives, and provides practical selection guidance for designers evaluating the XC7Z045-2FF676I for embedded FPGA, processor, and high-speed system integration.
بدائل مباشرة لـ XC7Z045-2FF676I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC7Z045-2FF676I (نفس عامل الشكل والبصمة).
XC7Z045-2FFG676I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC7Z045-1FBG676I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC7Z045-1FBG676C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC7Z045-2FFG676C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC7Z045-2FFG676E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC7Z045-2FF676I الحدود القصوى والخصائص الكهربائية
| Device Type | Zynq-7000 Kintex-7 adaptive system-on-chip |
| Processor Core | Dual-core ARM Cortex-A9 MPCore |
| Processor Maximum Frequency | 800 MHz |
| FPGA Logic Cells | 350K |
| Architecture | 32-bit RISC with programmable logic |
| CoreSight Support | Yes |
| جهد التغذية | 1 V |
| Package Type | 676-ball FCBGA |
| Package Dimensions | 27 x 27 mm |
| Terminal Count | 676 balls |
| Terminal Position | Bottom |
| Package Shape | Square |
| Product Category | System on Chip (SoC) / programmable logic |
| Operating Temperature Grade | Industrial grade |
دليل تكوين أطراف XC7Z045-2FF676I square
تكوين الأطراف لـ XC7Z045-2FF676I (حزمة square). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC7Z045-2FF676I.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC7Z045-2FF676I مناسب لـ 6 التطبيقs: Industrial Automation and Control, Embedded Vision and Image Processing, Communications and Network Equipment, Test and Measurement Equipment, High-Performance Embedded Control, Aerospace and Defense Electronics.
Industrial Automation and Control
The XC7Z045-2FF676I fits industrial automation systems that need deterministic I/O alongside higher-level control. Its 350K FPGA logic cells can implement motion-control loops, encoder interfaces, safety-adjacent logic, or multi-axis timing functions, while the dual-core 800 MHz ARM Cortex-A9 subsystem can run control software, communications, and diagnostics. Partitioning time-critical functions into programmable logic reduces dependence on operating-system scheduling. The principal tradeoff is the complexity of a 676-ball FCBGA layout, which requires dense routing, a robust power tree, and assembly validation before deployment.
موصى به
Embedded Vision and Image Processing
The XC7Z045-2FF676I is suitable for embedded vision systems that benefit from combining an 800 MHz ARM Cortex-A9 control path with FPGA-level parallelism. The FPGA fabric can accelerate pixel transport, filtering, thresholding, or interface conversion, while the processor handles image capture orchestration, control, and higher-level processing. This division can improve throughput compared with executing every operation sequentially on the processor. However, external memory behavior, image data rates, and accelerator interfaces must be designed carefully because the device's general-purpose fabric is not a substitute for a dedicated image-processing engine.
موصى به
Communications and Network Equipment
The XC7Z045-2FF676I fits communications infrastructure requiring flexible packet handling, custom interfaces, and embedded processing in one programmable device. Its 350K FPGA cells can implement protocol-specific data paths, while the dual Cortex-A9 cores manage routing, management, telemetry, or secure-control functions. The same-footprint 676-FCBGA platform also makes it possible to evaluate related speed and qualification grades without changing PCB geometry. High-speed designs still require controlled-impedance routing, verified transceiver interfaces, careful clocking, and simulation of the complete signal path.
موصى به
Test and Measurement Equipment
The XC7Z045-2FF676I can support test and measurement instruments that need configurable signal acquisition, timing, and control logic alongside embedded software. The FPGA fabric is suited to parallel data collection, trigger logic, and custom interface behavior, while the 800 MHz ARM subsystem can manage instrumentation control and data presentation. This architecture is valuable when product differentiation depends on programmable measurement logic. Because the part is supplied in a 676-ball FCBGA, the instrument designer should budget for fine-pitch assembly, controlled power delivery, and adequate copper and thermal spreading around the device.
موصى به
High-Performance Embedded Control
The XC7Z045-2FF676I is appropriate for embedded control platforms where a general-purpose processor alone may not provide sufficient parallel throughput. The dual ARM Cortex-A9 cores at 800 MHz can manage software services, state machines, and communication protocols, while the 350K-cell FPGA fabric handles concurrent I/O, data filtering, or time-critical sequencing. This partitioning can reduce software overhead for parallel tasks. Designers should profile power, interrupt latency, and memory bandwidth early because performance gains depend on how effectively the application separates software and hardware responsibilities.
موصى به
Aerospace and Defense Electronics
The XC7Z045-2FF676I can serve as a programmable processing platform in aerospace, defense, and mission-critical electronic systems when the selected ordering variant satisfies the required qualification. The dual-core ARM Cortex-A9 subsystem supports embedded control software, while the FPGA fabric supports configurable I/O, data processing, and fault-tolerant logic architectures. Qualification must be confirmed for the exact XC7Z045 suffix rather than inferred from the broader Zynq-7000 family. The 676-ball FCBGA also requires controlled assembly processes and rigorous inspection appropriate to the finished-system reliability requirements.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC7Z045-2FF676I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC7Z045-2FFG676I | XC7Z045-1FBG676I | XC7Z045-1FBG676C | XC7Z045-2FFG676C | XC7Z045-2FFG676E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) |
| Processor | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| Processor Frequency | 800 MHz | 800 MHz | 733 MHz | 733 MHz | 800 MHz | 800 MHz |
| FPGA Logic Cells | 350K | 350K | 350K | 350K | 350K | 350K |
| Temperature / Qualification Suffix | I suffix; industrial grade | I suffix; industrial grade | I suffix; industrial grade | C suffix | C suffix | E suffix |
| Pin-to-Pin Compatibility | Reference device | Same 676-FCBGA footprint; verify suffix requirements | Same 676-FCBGA footprint; lower processor speed grade | Same 676-FCBGA footprint; lower speed and C grade | Same 676-FCBGA footprint; C grade | Same 676-FCBGA footprint; E grade |
أبرز الفروقات
- Higher processor speed than the -1 speed-grade alternative (مقابلXC7Z045-1FBG676I)
- Web-confirmed 350K logic and 800 MHz rating in the closest G-suffix ordering variant (مقابلXC7Z045-2FFG676I)
- Industrial-grade ordering option versus lower or different qualification suffixes (مقابلXC7Z045-1FBG676C)
ملاحظات التصميم
Design the PCB as a high-density 676-ball FCBGA platform, not as a generic square BGA. Follow the AMD package drawing and Zynq-7000 design guide for ball maps, escape routing, layer transitions, and via construction. Keep high-speed interfaces away from noisy power-regulator regions, provide continuous return-path opportunities, and validate the stack-up with signal-integrity and power-integrity simulation before fabrication.
Implement the complete power tree using the AMD DS191 power requirements rather than treating the listed 1 V value as the only supply. Separate the processor, FPGA, memory, and I/O supply domains, apply the recommended sequencing, and place local high-frequency decoupling directly at the relevant balls. Review worst-case current, startup order, rail tolerances, and regulator transient response together because the 676-ball escape geometry can constrain capacitor and regulator placement.
Conduct a thermal analysis for the assembled board rather than relying on the package alone. Use the package's exposed-ball and power-distribution arrangement, preserve thermal-via access beneath the device, and provide balanced copper spreading where the package construction permits. Estimated: power dissipation equals the sum of each rail's measured voltage multiplied by current; because no verified current data was supplied, no numerical junction-temperature claim is made here.
Do not treat an ordering-suffix change as automatically harmless. XC7Z045-2FFG676I, -1FBG676I, -1FBG676C, -2FFG676C, and -2FFG676E share the 676-FCBGA family platform, but speed grade, temperature grade, qualification, and supported lifecycle can affect production acceptance. Before substitution, compare the official AMD ordering information, package drawings, datasheet limits, and qualification records for the exact suffix.
Plan clock, memory, and high-speed serial routing before fixing the board layer stack. Use the AMD reference design and device constraints as the source for I/O standards, impedance, topology, and timing. Simulation should cover loss, crosstalk, return discontinuities, and power-reference-plane transitions. Do not infer electrical compatibility from the fact that two devices use the same FCBGA footprint, because speed and I/O specifications may differ.
معلومات الامتثال
The verified records do not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive-qualification declarations for the exact XC7Z045-2FF676I ordering code. Confirm the exact suffix with AMD compliance and qualification documentation before production release.