XC7Z045-1FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
MPN: XC7Z045-1FBG676I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $666.55 | $666.55 |
| 10 | $620 | $6,200.00 |
| 100 | $580 | $58,000.00 |
| 500 | $550 | $275,000.00 |
| 1,000 | $520 | $520,000.00 |
Drop-in alternatives for XC7Z045-1FBG676I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7Z045-2FBG676I
β Drop-Inβ In Stock
$650 / Unit
View Datasheet βXC7Z030-1FBG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z030-2FBG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z035-1FBG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z045-1FBG676I Maximum Ratings & Electrical Characteristics
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of Cores | 2 |
| Maximum Clock Frequency | 667 MHz |
| Logic Cells | 350K |
| On-Chip RAM | 256 KB |
| Package | 676-FCBGA (27x27 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C |
| Speed Grade | -1 |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| RoHS Status | Compliant |
| REACH Status | Compliant |
| MSL Level | [DATA_NEEDED: MSL Level] |
XC7Z045-1FBG676I Pin Configuration
| Pin A1 | VCCINT β Internal core voltage supply |
| Pin A2 | GND β Ground |
| Pin B1 | VCCAUX β Auxiliary voltage supply |
| Pin C1 | IO_L1P_T0 β User I/O bank 0 |
| Pin D1 | IO_L1N_T0 β User I/O bank 0 |
| Pin E1 | DDR3_DQ[0] β DDR3 memory data |
| Pin F1 | DDR3_DQ[1] β DDR3 memory data |
| Pin G1 | GTX_REFCLK β High-speed transceiver reference clock |
| Pin H1 | GTX_TX_P β High-speed transceiver transmit positive |
| Pin J1 | GTX_TX_N β High-speed transceiver transmit negative |
| Pin K1 | GTX_RX_P β High-speed transceiver receive positive |
| Pin L1 | GTX_RX_N β High-speed transceiver receive negative |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7Z045-1FBG676I is suitable for 6 applications: High-Performance Embedded Computing, Aerospace and Defense Systems, Medical Imaging Equipment, Wired and Wireless Communications, Industrial Automation and Control, Software-Defined Radio (SDR).
High-Performance Embedded Computing
The XC7Z045-1FBG676I excels in high-performance embedded computing by combining a dual-core ARM Cortex-A9 processor with a Kintex-7 FPGA fabric. The 667 MHz processor handles complex software algorithms, while the 350K logic cells accelerate hardware-intensive tasks. This architecture enables low-latency data processing and real-time control, making it ideal for applications like industrial automation and robotics. The 256 KB on-chip RAM provides fast data storage, and the high-speed transceivers support rapid data exchange with external peripherals.
Recommended
Aerospace and Defense Systems
In aerospace and defense, the XC7Z045-1FBG676I provides the processing power and hardware flexibility needed for radar, communication, and image processing systems. The dual-core ARM processor handles control and communication protocols, while the FPGA fabric implements signal processing algorithms with high throughput. The industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. The device's high logic density supports complex beamforming and target tracking algorithms, making it a preferred choice for mission-critical applications.
Recommended
Medical Imaging Equipment
The XC7Z045-1FBG676I is well-suited for medical imaging equipment such as ultrasound and MRI systems. The FPGA fabric accelerates image processing algorithms, including filtering and reconstruction, while the ARM processor manages system control and user interfaces. The 350K logic cells provide ample resources for parallel processing of image data, and the high-speed transceivers enable fast data transfer from sensors. The device's reliability and long-term availability make it a trusted choice for medical device manufacturers.
Recommended
Wired and Wireless Communications
For wired and wireless communications, the XC7Z045-1FBG676I offers the performance needed for base stations, routers, and software-defined radio. The dual-core ARM processor handles protocol stacks, while the FPGA fabric implements PHY layer processing and modulation/demodulation. The high-speed transceivers support multiple gigabit links, and the 350K logic cells enable complex MIMO and beamforming algorithms. This SoC provides a flexible platform for evolving communication standards.
Recommended
Industrial Automation and Control
In industrial automation, the XC7Z045-1FBG676I enables advanced control systems with real-time processing and hardware acceleration. The ARM processor runs control algorithms and HMI interfaces, while the FPGA fabric implements high-speed I/O and custom protocols. The device supports multiple communication interfaces, including Ethernet and PCIe, facilitating integration into existing systems. The industrial temperature range and robust design make it suitable for factory floor environments.
Recommended
Software-Defined Radio (SDR)
The XC7Z045-1FBG676I is ideal for software-defined radio applications, where the FPGA fabric implements digital down/up conversion, filtering, and modulation, while the ARM processor handles protocol processing and control. The 350K logic cells provide ample resources for wideband signal processing, and the high-speed transceivers support multiple RF channels. This SoC enables flexible, reconfigurable radio systems that can adapt to changing communication standards.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z045-1FBG676I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z045-2FBG676I | XC7Z030-1FBG676I | JYX4S045 |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | PBGA900 |
| Brand | AMD | AMD | AMD | CETC58 |
| Logic Cells | 350K | 350K | 125K | 350K |
| Max Clock Frequency | 667 MHz | 766 MHz | 667 MHz | [DATA_NEEDED] |
| On-Chip RAM | 256 KB | 256 KB | 256 KB | [DATA_NEEDED] |
| Speed Grade | -1 | -2 | -1 | [DATA_NEEDED] |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | Wider temp range |
| Core Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
Key Differentiators
- Higher logic density (vs XC7Z030-1FBG676I)
- Standard speed grade (vs XC7Z045-2FBG676I)
- Pin-compatible with lower-cost options (vs XC7Z030-1FBG676I)
Design Notes
The XC7Z045-1FBG676I requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing. Refer to the Zynq-7000 power management application note for recommended sequencing to avoid latch-up. Use low-ESR decoupling capacitors close to each power pin.
For high-speed transceivers, maintain controlled impedance traces and use ground vias around differential pairs. Follow the PCB design guidelines in UG933 for Zynq-7000 to ensure signal integrity. Keep the FPGA fabric power planes clean and separate from I/O planes.
The 676-FCBGA package can dissipate significant power under heavy logic utilization. Use a heatsink or active cooling for applications exceeding 5W. Ensure adequate airflow and consider the thermal resistance (theta_JA) from the datasheet for your specific board layout.
Compliance Information
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified.
