XCKU3P-1FFVD900I - Kintex UltraScale+ FPGA | AMD
MPN: XCKU3P-1FFVD900I ✓ نشطXCKU3P-1FFVD900I نظرة عامة
A field-programmable gate array is a programmable digital integrated circuit whose configurable logic blocks, interconnects, memory resources, and input/output resources can be tailored after manufacture. The FPGA belongs to the Kintex UltraScale+ product family and sits within the broader semiconductor and programmable-logic hierarchy. This makes it suitable when a design needs substantial parallel processing capacity, flexible interfaces, and a hardware platform that can be revised through downloadable configuration data rather than redesigned as a fixed-function ASIC.
The listed device provides 355,950 logic cells organized into 20,340 configurable logic blocks, with 304 input/outputs available for board-level connections. Its 31,641,600 memory bits support data storage and buffering within the programmable fabric. The 0.85 V nominal core voltage reflects the high-performance architecture of the Kintex UltraScale+ family, while the 900-BBGA FCBGA package provides a large pin and interconnect platform suitable for complex systems.
The XCKU3P device family is intended for applications requiring high logic density and flexible hardware behavior. Relevant uses include data processing, control systems, communications infrastructure, industrial automation, test and measurement equipment, and embedded signal-processing platforms. Its large programmable fabric allows parallel data paths and multiple control functions to be consolidated without developing a custom silicon device.
The principal design consideration is package-level complexity. A 900-BBGA FCBGA requires careful PCB layout, dense escape routing, controlled power delivery, and assembly processes capable of handling fine-pitch balls. Board designers should use the AMD package pinout files and the relevant device documentation to assign every ball, power plane, configuration signal, and high-speed connection correctly.
This page combines the device identification, package information, programmable resource counts, sourcing details, family alternatives, and practical design guidance in one engineering-focused reference. It helps designers distinguish speed-grade, package, and suffix differences before committing to a board layout or production configuration.
بدائل مباشرة لـ XCKU3P-1FFVD900I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XCKU3P-1FFVD900I (نفس عامل الشكل والبصمة) — يختلف في Package, Device Type, Block RAM, Speed Grade.
XCKU3P-2FFVD900I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XCKU3P-1FFVD900E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XCKU3P-2FFVD900E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XCKU3P-1FFVD900I الحدود القصوى والخصائص الكهربائية
| Device Type | Kintex UltraScale+ FPGA |
| Logic Cells | 355,950 cells |
| Configurable Logic Blocks | 20,340 CLBs |
| Input/Output Count | 304 I/Os |
| Memory Bits | 31,641,600 bits |
| Nominal Core Voltage | 0.85 V |
| Speed Grade | -1 |
| العلبة | 900-BBGA FCBGA |
| FPGA Architecture | Kintex UltraScale+ |
| نوع التركيب | Surface Mount |
دليل تكوين أطراف XCKU3P-1FFVD900I 900-bbga fcbga
تكوين الأطراف لـ XCKU3P-1FFVD900I (حزمة 900-bbga fcbga). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XCKU3P-1FFVD900I.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XCKU3P-1FFVD900I مناسب لـ 6 التطبيقs: Communications and Network Equipment, Industrial Automation and Control, Test and Measurement Systems, High-Performance Embedded Processing, Signal Processing and Data Acquisition, Aerospace and Defense Prototyping.
Communications and Network Equipment
The XCKU3P-1FFVD900I fits communications equipment requiring substantial parallel processing and programmable board-level interfaces. Its 355,950 logic cells and 20,340 configurable logic blocks can implement protocol engines, packet-processing pipelines, test sequences, and control logic in one FPGA. The 304 available I/Os provide connection capacity for external transceivers, memories, and status interfaces. The 900-BBGA FCBGA package supports dense routing, but engineers must treat high-speed links as a board-integrity problem, using the AMD D900 pinout files and device guidance for controlled impedance, power delivery, and clock distribution.
موصى به
Industrial Automation and Control
The XCKU3P-1FFVD900I is appropriate for industrial automation systems that combine multiple control paths with flexible logic. Engineers can use the 355,950 available logic cells for sequencing, motion coordination, safety-adjacent monitoring, and machine communication, while the 31,641,600 memory bits support buffering and stateful data processing. Its 304 I/Os enable integration of sensors, actuators, field buses, and diagnostics. The industrial ordering suffix aligns with an industrial product context, although the finished system must still satisfy its specified temperature, environmental, lifecycle, and functional-safety requirements.
موصى به
Test and Measurement Systems
The XCKU3P-1FFVD900I can serve as the programmable core of a high-channel-count test and measurement platform. Its large logic population allows parallel acquisition logic, pattern generation, timing control, and digital analysis to share one device instead of relying on separate fixed-function components. The 304 I/Os provide attachment points for test channels, trigger systems, reference interfaces, and capture logic. The 0.85 V nominal core voltage and -1 speed grade require careful timing-budget analysis, while the 900-BBGA package demands a low-defect assembly process and comprehensive board-level validation.
موصى به
High-Performance Embedded Processing
The XCKU3P-1FFVD900I suits embedded systems that need more parallelism and configurability than a fixed microcontroller provides. Designers can implement dedicated accelerators, custom peripherals, real-time data paths, and supervisory logic within the 20,340 configurable logic blocks. The 31,641,600 memory bits provide internal storage for buffering and working data, while the 304 I/Os connect external sensors, converters, and memories. Because this is a large programmable device, software and hardware integration should include a defined configuration boot process, JTAG access strategy, watchdog behavior, and recovery path before field deployment.
موصى به
Signal Processing and Data Acquisition
The XCKU3P-1FFVD900I is suitable for parallel signal-processing and data-acquisition designs that benefit from programmable filters, correlation functions, digital conversion, and real-time analysis. Its 355,950 logic cells allow multiple processing lanes to be implemented concurrently, while 31,641,600 memory bits can support sample buffering and intermediate data. The 304 I/Os permit connection to analog front ends, high-speed converters, memory devices, and synchronization interfaces. Timing closure, clock jitter, input thresholds, and external memory interfaces must be evaluated together because nominal core voltage alone does not determine signal-chain performance.
موصى به
Aerospace and Defense Prototyping
The XCKU3P-1FFVD900I can support advanced prototyping in aerospace, defense, and rugged embedded systems where programmable logic density is valuable. The 355,950 logic cells and 20,340 configurable logic blocks allow mission-specific data paths, navigation processing, signal conditioning, and redundant control functions to be consolidated. The 304 I/Os allow extensive sensor, communication, and memory interconnection, but the 900-BBGA package is mechanically and electrically demanding. Designers must confirm program-specific temperature, radiation, shock, screening, and export requirements rather than inferring ruggedness from the ordering suffix alone.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XCKU3P-1FFVD900I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XCKU3P-2FFVD900I | XCKU3P-1FFVD900E | XCKU3P-2FFVD900E |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 900-BBGA FCBGA | 900-BBGA FCBGA - same D900 footprint | 900-BBGA FCBGA - same D900 footprint | 900-BBGA FCBGA - same D900 footprint |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Speed Grade | -1 | -2 | -1 | -2 |
| Logic Cells | 355,950 cells | 355,950 cells | 355,950 cells | 355,950 cells |
| Configurable Logic Blocks | 20,340 CLBs | 20,340 CLBs | 20,340 CLBs | 20,340 CLBs |
| Input/Output Count | 304 I/Os | 304 I/Os | 304 I/Os | 304 I/Os |
| Nominal Core Voltage | 0.85 V | 0.85 V | 0.85 V | 0.85 V |
| Memory Bits | 31,641,600 bits | 31,641,600 bits | 31,641,600 bits | 31,641,600 bits |
| Final Ordering Suffix | I | I | E | E |
أبرز الفروقات
- Lower nominal speed grade within the same D900 package (مقابلXCKU3P-2FFVD900I)
- Industrial ordering suffix for the target configuration (مقابلXCKU3P-1FFVD900E)
- Same-package upgrade path without changing the PCB footprint (مقابلXCKU3P-2FFVD900E)
ملاحظات التصميم
Use AMD's D900 package files as the authority for all 900-ball assignments, including power, ground, configuration, clock, and user I/O. Confirm that the PCB stack-up can escape the fine-pitch ball array without violating clearance or via-current limits. Treat pad, solder-mask, and assembly definitions as a coordinated set, and validate the design with the selected assembly process before fabrication release.
Plan the 0.85 V core rail as a dedicated, low-impedance power distribution network with placement and decoupling based on the AMD device guidance for the exact package. Account for the -1 speed grade's dynamic power and configure sequencing only as directed by the device documentation. Validate steady-state and transient loading across voltage, temperature, and process corners rather than relying on nominal supply voltage alone.
High-speed interface and memory routing must be designed against the selected board stack-up, including impedance targets, insertion loss, crosstalk, return paths, and reference-plane transitions. The D900 package's high pin density leaves limited routing space, so escape routing should be resolved before placement. Run post-layout extraction and verify that power and ground connections do not interrupt the intended signal return path.
Do not approve a family variant solely because it has the same 900-BBGA outline. Compare the complete ordering code, package ball map, speed grade, configuration behavior, temperature option, electrical limits, and programming support. In particular, changing -1 to -2 can alter timing and power behavior, while changing the final suffix can change the intended qualification envelope even when the footprint remains the same.
معلومات الامتثال
No specific environmental, automotive, lead-free, halogen-free, or conflict-minerals declarations were identified. Confirm compliance and qualification requirements with AMD for the exact ordering code.
